Thank you Davef,
If I am not wrong in understanding, your answer is mainly related to the Legal point of view according to several different Countries who adopted Rohs or equivalent.
My question, sorry for my poor English, is mainly related to the limit of Pb % (allowed by process) above that we could meet soldering problems. Like, for istance: bad solder joint, dross build up, brittle solder gioint,bridges, icing, etc. Like what we could meet today with Sn/Pb alloy when too much Cu, Fe,Ni,Sb,Ag,Bi,. see IPC-J-STD-001D Table 3-1
I know, with new alloy like SACs or similar, the scenario in terms of contamination % limits have changed a lot comparing to Sn/Pb 63/37, but just courios to know what is coming on in this matter when moving to Lead Free solder inside pot of wave soldering machines . And what they (those who already have L-F wave process) take care weekly or monthly when analyzing the solder alloy samples from wave pots and how they re-balance the values if out from limits, but which limits ?
Thank you
Best Regards..........GS
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