IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly!

This exciting topic will unfold over a three-part webinar series hosted by IPC Hall of Famer, Ray Prasad, Ray Prasad Consultancy Group. The webinar series brings together the latest information on recent/upcoming updates to IPC standards IPC-7095D, Design and Assembly Process Implementation for BGAs, updated in 2018; IPC-7093, Design and Assembly Process Implementation of Bottom Termination SMT Components, new revision coming soon; and IPC-7530A, Guidelines for Temperature Profiling for Mass Soldering Processes. Ray chairs the committees that develop these standards so he will bring additional insight to the importance of the changes to improve industry best practices for assembly.

Over the series, Ray will address how to develop thermal profiles for soldering processes to reduce soldering defects and improve the quality and reliability of various types of components including BGAs and BTCs. He will also focus on profiling mixed-alloy assemblies which use tin-lead solder paste with Pb-free BGAs. Furthermore, Ray will go into detail on how to integrate BGA and BTC components into a design, with focus on land pattern design for assembly. The challenges associated with these components, such as voiding or head-on-pillow defects can often be alleviated with careful attention to design and reflow profiling.

Who should attend this course?
This is an intermediate level course, perfect for process engineers, quality managers, designers, as well as operators and technicians who develop thermal profiles and troubleshoot assembly defects. This broad topic will suit those new to the industry as well as people who have been in the industry for a long time but would like to know more about updates to these standards and best practices.

Attendees will be provided with presentation slides in addition to admission to the live webinar events on

August 27, 2019 1:00 pm CDT:          Free Introduction Webinar - Missed the free webinar? Register today and a link to the presentation and recording will be sent to you via email!
September 19, 2019 1:00 pm CDT:    Part 1: Focus on Bottom Termination Components
October 3, 2019 1:00 pm CDT:          Part 2: Focus on Ball Grid Array Challenges

Key takeaways from the course:

• How to properly develop profiles for various soldering processes including reflow, wave, vapor phase, laser and selective soldering
• Understand the importance of achieving time above liquidus for selected solder alloys and the impact on common assembly defects
• Overviews of BGA and BTC designs to enable effective high-yield assembly processes
• Areas to investigate when troubleshooting manufacturing issues with BGAs and BTCs
• Deep analysis of critical challenges such as voiding, head-on-pillow, pad cratering and more!