IMAPS 2017 - 50th International Symposium on Microelectronics

The 50th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2017 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks that span the three days of sessions on: CHIP PACKAGING INTERACTIONS (CPI); HIGH PERFORMANCE, RELIABILITY, & SECURITY; ADVANCED PACKAGING AND ENABLING TECHNOLOGIES; ADVANCED PACKAGING & SYSTEM INTEGRATION; ADVANCED MATERIALS & PROCESSES; as well as the Interactive Poster Session.