2017 RaMP Workshop and Tabletop Exhibition

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology. To help bring together the international community, this workshop is being co-sponsored by IMAPS-France and will be the continuation of a series of joint workshops on RF and Microwave packaging between IMAPS and IMAPS-France and UK Chapters.

Sessions are being planned and abstracts are being requested in the following areas:

Emerging Technologies

• 60 GHz Personal Area Network (PAN)
• Short Wave IR Packaging
• Nanopackaging
• 3D RF/MW
• New and Disruptive Technology
• EMI Shielding for RF/MW Packaging
• Wafer Level Packaging for Microwave and MMwave Applications
• Packaging Issues for Wide Band Gap Semiconductors
• SIP

New Design/Materials

• New Power Amplifier Design Beyond LDMOS
• Thermal Management
• New Uncooled IR Sensors
• Plastic RF/MW Packaging
• RF MEMS
• Low loss, wide BW, high power interconnects

New Applications

• Military / space
• Optoelectronics (night vision, thermal weapon sight, etc.)
• High Power Electronics • Space / Extreme Environments
• MEMS/NEMS
• Biomedical
• Telecomm
• Reliability
• MMIC
• Automotive
• High Speed Electronics

Current Technology

• Medical electronics
• Wearable electronics