Are You Considering Irregular Loading Cycles in Solder Interconnect Life Estimations?

The life estimations of solder interconnects are made using fatigue life models that are derived from standard temperature cycle tests. Once an effective model has been established, engineers can use the model to predict test outcomes. However, predicting field outcomes is more difficult.

On April 7th, 2020, Deng Chen will host a free webinar review solder interconnect fatigue life model development, temperature cycle extraction from temperature time history, and damage accumulation methods for fatigue life prediction.