Determining Thermomechanical Reliability of Flip Chipped SiC Power Device Assemblies

Silicon Carbide (SiC) power devices have demonstrated over double the power density of Silicon (Si) power devices at greater efficiency. However, power packaging approaches are now the limiting factor in fully realizing their performance benefits.

On April 28, 2020, Prof. Patrick McCluskey will host a free webinar discussing a complete packaging solution that allows a full realization of the performance advantages of SiC devices. This webinar will take a look at its structure as well as the manufacturing steps used to create it.