13th International Conference and Exhibition on Device Packaging


Trade ShowsConferences


Tue, March 07 - Thu, March 09, 2017


WekoPa Resort and Casino , Fountain Hills, Arizona


The Largest 2017 Conference Dedicated to Interposers, 3D IC & Packaging.

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.



Oct 26, 2021


Designing for Reliability in Class III Assemblies - October 26th

ZESTRON Americas

Oct 28, 2021


Juarez Chapter Webinar: Pin in Paste

Surface Mount Technology Association (SMTA)

Nov 01, 2021

El Segundo, CA

IPC/WHMA-A-620 Trainer (CIT) Certification Online Live Training Course

EPTAC Corporation

Jun 21, 2022

Detroit, MI

Silicone Expo

Select Global Events

Jun 22, 2022

Bangkok, Thailand

NEPCON Thailand 2022

Reed Tradex Co., Ltd.

See electronics manufacturing industry events calendar »

13th International Conference and Exhibition on Device Packaging event has been viewed 178 times

Sell Your Used SMT & Test Equipment

MSD Dry Cabinets