13th International Conference and Exhibition on Device Packaging

Category

Trade ShowsConferences

Date:

Tue, March 07 - Thu, March 09, 2017

Location:

WekoPa Resort and Casino , Fountain Hills, Arizona

Description:

The Largest 2017 Conference Dedicated to Interposers, 3D IC & Packaging.

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Url:

http://www.imaps.org/devicepackaging

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