Are You Considering Irregular Loading Cycles in Solder Interconnect Life Estimations?

Category

Online Events

Date:

Tue, April 07, 2020

Description:

The life estimations of solder interconnects are made using fatigue life models that are derived from standard temperature cycle tests. Once an effective model has been established, engineers can use the model to predict test outcomes. However, predicting field outcomes is more difficult.

On April 7th, 2020, Deng Chen will host a free webinar review solder interconnect fatigue life model development, temperature cycle extraction from temperature time history, and damage accumulation methods for fatigue life prediction.

Url:

calce.umd.edu/event/15039/calce-webinar--are-you-considering-irregular-loading-cycles-in-solder-interconnect-life-estimations

Sep 26, 2024

East Syracuse, NY

Empire Expo & Tech Forum

Surface Mount Technology Association (SMTA)

Jun 18, 2025

Bangkok, Thailand

NEPCON Thailand 2025

Reed Tradex Co., Ltd.

See electronics manufacturing industry events calendar »

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