SMTA Webinar: Secure, Intelligent, Detailed Design Data Exchange Between Design & Manufacturing

SMTA Workforce Development Webinar

“Secure, Intelligent, Detailed Design Data Exchange Between Design And Manufacturing”

Speakers: Michael Ford (Aegis Software), Ivan Aduna (Koh Young),
Hemant Shah (IPC-2581 Consortium Chair) & Dana Korf (Nano Dimension)

Overview

Secure, complete design data is needed to build, assemble and test PCBs. As the technology of inspection and testing of assembled PCBs evolves, detailed design data is needed to facilitate advanced functionality, as well as reduce the programming and preparation time for production. The issue of the security of design data as it is passed to manufacturing and detailed design data that is needed to facilitate inspection and testing of assembled PCBs are at odds and remain unresolved for far too long. We have witnessed far too many instances of tampering, with the intent to introduce vulnerabilities into products as the design data is passed to manufacturing. For the first time, both issues are being addressed in one solution, with the combination of two standards from IPC. 

In this presentation, we will talk about the issues around design data management and security. How the design data in IPC-2581 (DPMX) format can be securely exchanged through the internet directly with the manufacturing using IPC-CFX (Connected Factory Exchange). 
Once processed by digital manufacturing engineering tools to resolve production BOM and line assignments, the same IPC-2581 data is sent directly to the machines together, with work-instructions ready for advanced programming by the machine vendor in the minimum time. We also look at the reverse flow for DFx, using the same secure mechanism, that allows designers to understand the potential for design improvement based on actual manufacturing capabilities.

Presenters

Ivan Aduna

Ivan Aduna is a MES Software Developer at Koh Young America, the leading 3D measurement-based inspection equipment and solutions provider for the electronics industry.

He earned his Mechatronics Engineering degree at the Universidad Panamericana in Guadalajara where he focused on embedded systems, algorithms, and low-power solutions. From there, Ivan applied his software expertise at Intel where he designed and executed test plans and use cases to refine network controllers on both Windows and Linux environments. His foray into the Internet of Things began at Dextra Technologies where he developed embedded software systems for the automotive segment and telemetry-based tracking solutions.

Today, Ivan leads the Koh Young smart factory integration efforts for electronics manufacturing. His expertise mixed with theoretical and practical knowledge positions him with the ability to understand, adopt, and implement software advancements from both the user and supplier perspectives.

Hemant Shah

Hemant Shah is the chairman of the IPC-2581 Consortium, a consortium of over 120 companies dedicated to getting IPC-2581 adopted. Hemant was VP of Product Marketing at Anew Design Automation until December 2022. Prior to Anew Design Automation, Shah was Group Director of Product Management for Allegro PCB products at Cadence.

Shah led the effort to create an industry wide consortium of design and supply chain companies to get IPC-2581 – the standard for transferring PCB design data to manufacturing – adopted. Prior to managing the PCB and FPGA products, he managed the Allegro Signal and Power Integrity products for PCB & IC Packaging. Shah also led an industry wide effort to get a new algorithmic modeling standard (IBIS-AMI) approved and adopted.

Prior to joining Cadence Hemant worked at Xynetix Inc. and before that at Intergraph Corporation.  He is passionate about developing, marketing leading edge software products for PCB design.

Michael Ford

Michael Ford is the Senior Director of Emerging Industry Strategy at Aegis Software. Working for Aegis Software provides Michael the opportunity to apply his software for electronics assembly manufacturing experience to further drive technology solution innovation, satisfying evolving business needs in modern digital manufacturing.

Throughout his career, including eight years working in Japan, Michael has been instrumental in creating and evolving revolutionary software solutions for assembly manufacturing, that meet the most demanding expectations.

Today, Michael is an established thought leader for Industry 4.0 data-driven manufacturing, and an active contributor to industry standards. In 2023, Michael was recognized by IPC with the Hillman-Lambert award, for contributions to standards including CFX, cyber-security, traceability, secure supply-chain and Digital Twin standards. Michael regularly contributes articles, columns and blogs in several leading industry publications.

Dana Korf

Dana Korf is the AME Standards Manager at Nano Dimension. He is chair of IPC D-67 Additively Manufactured Electronics (AME) sub-committee, on the IPC-2581 committee, is a recipient of the IPC Presidents Award and has several IPC Special Recognition awards for his work in high-speed design standards and digital twin.

Dana currently writes for the iConnect007 Design online magazines focusing on data transfer under the tag line “Dana on Data”. Prior to Nano Dimension, Dana was the Principal Consultant at Korf Consultancy based in Bremerton, WA, working with software companies, fabricators, OEMs, and IPC to improve the design to manufacturing data transfer quality since 2019. Dana has been in the industry for over 40 years.

He recently spent over 7 years living and working in China as the Multek Sr. Director of Central Manufacturing Engineering and NPI and was previously the Director of PCB Technology at Huawei Technologies in Shenzhen, China. Prior to moving to China, he worked at Sanmina, HADCO, and Zycon as the Director of Product Engineering.

Registration Details:

Free of charge! Pre-registration is required. Only registered attendees will receive the link to participate.