SMTA Taiwan Tech Forum 2024
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Date: |
Tue, March 26, 2024 |
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TPCA (Taiwan Printed Circuit Association), Taoyuan City, |
Description: |
SMTA Taiwan Tech Forum 20243/26/2024 When:Tuesday, March 26, 2024 Where:TPCA (Taiwan Printed Circuit Association) Contact:Jeffrey Lee Welcome to the SMTA Tech Forum hosted by SMTA TAIWAN Alliance Group! Join us on Mar 26, 2024, at TPCA, Taoyuan for the exciting in-person event filled with innovation and technology on IC packages and PCBAs, presented by SMTA member companies. Discover the latest advancements in the electronics industry, connect with industry experts, and explore cutting-edge technologies. This event brings together a wealth of industry knowledge and enables electronics manufacturers to address critical reliability issues of today and prepare for tomorrow. Engage insightful technical presentations, and gain valuable insights into the future of the electronics industry. This event, organized by SMTA Taiwan Alliance Group, will provide an interactive platform where participants can discuss and share knowledge and experience on topics such as:
本活動由SMTA Taiwan Alliance Group主辦,台灣電路板協會協辦。活動時間為2024年3月26日,地點在台灣電路板協會大樓。 本活動將會由協會成員引領探討晶片封裝與電路板的技術與創新。讓我們一起發現電子製造行業中最新的先進技術與認識該技術領域中的專家們。我們將會討論與分享下列主題的技術與經驗: 本活動匯集了豐富的行業知識,使電子製造商能夠解決當今的關鍵可靠度問題並為明天做好準備。 Registration Register as an attendee or sponsor by clicking the green "Register " button at the top of this page. You will be re-directed to a registration form. From there, please select your attendee type and complete the necessary steps. Experiencing troubles? Email alicia@smta.org for help! Advanced registration is required to attend the event. Registration is due by Mar 10, 2024 or will be closed after reaching the meeting room capacity (100 people). SMTA TAIWAN Alliance Group reserves the right to select the audience. A registration confirmation letter will be sent on Mar 18, 2024. 參與本活動須先報名註冊。報名註冊將於2024年3月10日截止,或於達到活動人數上限時截止。本活動人數上限為100人,SMTA Taiwan Alliance Group保留篩選與會人員的權利。報名成功的確認信件將會在2024年3月18日前寄出至您的電子信箱。 Cost: Who Should Attend 在晶片封裝、電路板組裝…等電子行業的從業人員,如產品經理、研發人員、品質與可靠度工程師、製程與製造工程師…等人員。 未來可能從事電子行業工作的學生。 |
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