Wire/Die bond Engineer
Date Posted: |
March 28, 2001 |
Job Category: |
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Location: |
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Job Description: |
Responsible for all Wire and die bond process within this fast growing Microelectronics company.
Company is constantly upgrading equipment and processes to compete in the fiber optics arena.
Company will either hire fulltime or a contract worker who will consider full time in the future. Excellent salary and benefits and relo package. |
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