Packaging System for Semiconductor and Electronic Device
Flip Chip Bonder is an equipment used in the semiconductor packaging process.
It is a method of connecting individual chips of wafers so that the bumps on the chip and ele...
|
Assembly Services |
3D CT AXI equipment exclusively for mass production inspection of assembly electronic component
The world's only assembly electronic components, small die casting products, etc. can be inspected automatically and can be used reliabl...
|
Inspection |
High-precision, ultra-high resolution high-end 2D, 3D CT X-ray examination equipment
With the Focal spot 200nm-class tube developed by SEC, ultra-fine defects can be detected at least 1mm and high-precision tests can be performed with syste...
|
Inspection |
SEC Industrial Linear Accelerator
LINASEC® Linear Accelerator equipment is designed for use as a syringe for non-destructive testing in specific applications and cargo and vehicle inspection at ports and borders. LINASEC® eq...
|
Inspection |
Wafer-level Product In-line(Ireland) 2D, 3D CT AXI Machine
Automatic inspection equipment exclusively for the Wafer-level products and ultra-fine defects of mm can be detected using the Nano Tube of Class Focal spot 200nm. 2D, <...
|
Inspection |
X-ray inspection equipment suitable for mass production inspection S/W application
It is equipped with a 100kV to 130kV Micro-focus Sealed Tube and a Flat Panel Detector with high-quality image.
...
|
Inspection |
X-eye 5100 Series
Entry-level X-ray Inspection System
Practical X-ray Inspection System
100kV ~ 130kV Micro-focus Closed tube and high-definition Flat Panel Detector are installed...
|
Inspection |
Best performance X-ray Inspection System
High-performance Micro-focus Open Tube with 160kV is installed and fine defects of 1㎛ are detectable.
High-resolution X-ray image can be gained with the world best magnification by instal...
|
Inspection |
SNE-4500M Plus
The Highest-end Tabletop SEM
Cost-effective Table-top SEM with Max. 150,000x of magnification by miniaturizing modules.
Able to scan images with high resolution of 5nm by the installat...
|
Inspection |
In-Line X-ray Inspection System
Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components.
Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveni...
|
Inspection |
In-Line X-ray Inspection System
Automatically in-line inspect Solder joint defects of PCBA and other defects on Hidden Components.
Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveni...
|
Inspection |
Inspection System for Die Casting, Automotive Components, Defense Components, Cultural Assets and Large Products
Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside ...
|
Inspection |