Layers: 2
Base material: FR4
&n...
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Fabrication Services |
Layers: 2
Base material: FR4
&n...
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Fabrication Services |
Base Material: FR4
Layer count: two layer
Board thickness: 1.6mm
Copper Thickness:1 oz
Surface finish:Gold finger
Soldermask Colors: Red
Size:119.5*76.7/1up
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Fabrication Services |
Base Material: FR4
Layer count: four layer
Board thickness: 1.6mm
Copper Thickness:1 oz
Surface finish: Immersion Gold
Soldermask Colors: blue
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Printing |
Specifications:
Applicable PCB (L x W): 50 × 50 to 700 × 460mm
Minimum component: 0201
Minimum QFP pitch: 0.4mm
Minimum IC pitch: 0.30mm
Minimum BGA ball diameter: 0.40mm
Ball pitch: 1.0mm
Maximum BGA size: 74x74mm
Service includ...
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Fabrication Services |
Specifications:
Applicable PCB (L x W): 50 × 50 to 700 × 460mm
Minimum component: 0201
Minimum QFP pitch: 0.4mm
Minimum IC pitch: 0.30mm
Minimum BGA ball diameter: 0.40mm
Ball pitch: 1.0mm
Maximum BGA size: 74 x 74mm
Services inc...
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Fabrication Services |
ENIG PCBs with red soldermask
Layers: 2
Base material: FR4
Copper thickness: 1oz
Board thickness: 1.6mm
Min. hole size: 0.45mm
Min. line width: 3 mils
Min. line spacing: 3 mils
Surface finishing: HASL
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Fabrication Services |
Specifications:
Base material: FR4
Layers count: four
Board thickness: 1.6mm
Copper thickness: 1oz
Surface finishing: immersion and gold finger
Solder mask color: green
Size: 125.09 x 95.25/1up
SMT SMD, 230 DIP and 4 pieces component
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Fabrication Services |
Base material: FR4
Layer count: four layer
Board thickness: 1.6mm
Copper thickness: 2 oz
Surface finish: Immersion Gold
Solder mask color: Green
Sizes: 262 x 185/1up
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Printing |
Base Material: FR4
Layer count: 4 layer
Board thickness: 1.6mm
Copper Thickness:1 oz
Surface finish: nickel gold plating
Soldermask Colors: Green
Size:159.25*182/1up
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Fabrication Services |
Base Material: Aluminium
Layer count: ten layer
Board thickness: 3.0mm
Copper Thickness:2 oz
Surface finish: HASL
Soldermask Colors: White
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Fabrication Services |
Specifications:
Size (L x W): 50 x 50 to 700 x 460mm
Minimum component: 0201
Minimum QFP pitch: 0.4mm
Minimum IC pitch: 0.30mm
Minimum BGA ball diameter: 0.40mm
Ball pitch: 1.0mm
Maximum BGA size: 74x74mm
Service include: PCB layout and BOM ...
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Fabrication Services |