The Condor Sigma is the most advanced bond tester on the market, combining the unique strengths of the Condor series with the latest technologies and innovations.
Full automation, 0.075% accuracy, best ergonomics, highest throughput, vision options, lowest c...
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Test Equipment - Bond Testers |
Fully integrated solution for automated wafer testing (up to 300 mm).
The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the in...
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Test Equipment - Bond Testers |
A bond tester that can grow with your company. Future proof performance and flexibility.
With the Condor Sigma Lite, XYZTEC gives you a low cost entry point without sacrificing performance to meet future demands. The Condor Sigma Lite is upgradeable to...
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Test Equipment - Bond Testers |
Easy and automatic CBP cavity cleaning with no mechanical jaw contact.
During use solder builds up in the cavity in cold bump pull (CBP) jaws. This reduces their grip efficiency and affects the quality of your measurements. Cleaning the cavities is very difficult and small ball c...
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Test Equipment - Bond Testers |
Many bond strength tests require a means to grip the part so that the strength of its bond can be tested. In many of these applications the geometry and force of the grip must be precisely controlled to ensure sufficient load can be applied to the bond without the act of gripping affecting the bo...
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Test Equipment - Bond Testers |