Shenmao Technology Inc.
SHENMAO Technology, Inc. supplier of Pb/Pb-free Solder Pastes, Solder Wire, Solder Bar, Flux, BGA Sphere, Bumping Paste/Flux, PCB Plating Anode, PV Ribbon Electronics Assembly Materials, for over 44 years from 10 world locations.
Shenmao Technology Inc. as a professional Solder Materials Manufacturer in Taiwan, provides No Clean and Water Soluble Solder Paste, Laser Solder Paste, Low Temperature Solder Paste, Dispensable Solder Paste, Solder Bar, Cored Solder Wire, Flux, BGA Sphere, Bumping Solder Paste/Flux and PV Ribbon with durable quality to EMS, OEM's and OSAT's from 10 worldwide locations. With over 44 years of experience, SHENMAO manufactures Superior Ultra Pure Tin Alloys and Powder in House, are RoHS-complient and sourced from CFSI listed smelters. 11 of the 12 Largest EMS companies are our customers, please feel free to contact us.
Shenmao Technology Inc. Postings
18 products »
Formosa Lead Free Solder Paste
Lead Free Solder Paste have received sub-license from Fuji Electronic Company. We provide halide-containing and halide-free fluxes for Lead Free Solder Alloys, so our customers can be able to reach the lead free era comfortably....
Formosa Halogen Free Solder Paste
Lead-Free Solder Paste have received sub-license from Fuji Electronic Company. We provide halide-free fluxes for Lead-Free solder alloys, and conform to the RoHS law, so our customers can be able to reach the lead free era comfortably....
Formosa Low Temperature Solder Paste
Shenmao Technology has developed Low Temperature Solder Paste for SMT devices. The Low Temperature Solder Paste has been qualified by third party organization. Low Temperature Solder Paste: Sn42Bi58 Melting point: 138℃...
Formosa Package on Package Solder Paste
For high density and advanced package technology, We provide new Solder Paste for PoP applications. Package on Package Solder Paste has better wettability, solderability and low void than others....
Formosa Water Soluble Solder Paste
Shenmao Technology offers a full line of Water Soluble Fluxes and Water Soluble Solder Paste for SMT and IC packaging applications. We provide halide-containing and halide-free fluxes for Tin/Lead as well as Lead-Free solder alloys. Our formulations,...
Bumping Solder Paste aims to decrease current issue of too much voids in the IC Packaging Manufactures. Our applications engineers of SMMI focus on developing the lower Void,...
Tin Lead Solder Pastes are made from high purity metal (Tin, Lead); high quality is guaranteed. Our strict production and quality control, strong technical and development team results in reasonable price and to meet each customer'...
Water Soluble and No-Clean Fluxes
We offer a full line of Water Soluble Fluxes and No-Clean Flux for SMT, IC packaging and PCB Wave solder applications. We provide halide-containing and halide-free fluxes for Lead-Free solder alloys. Besides, our Lead-Free Liq...
SM-150G/SM-155P Epoxy Adhesives
SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suit...
SM-150G / SM-155P Single Component Epoxy Adhesive
SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suit...
126 news releases »
Sep 16, 2024 | SHENMAO America, Inc. is proud to introduce its latest innovation in response to the rising demand for ultra-thin electronic packages. As package thinness increases, issues like package warpage and its detrimental effects on production yield have become critical challenges. SHENMAO is addressing these concerns with its new Low-Temperature Solder (LTS) materials, which are engineered to lower reflow temperatures, mitigating PCB and substrate deformation while enhancing overall yield rates.
SHENMAO Introduces Rosin-Free No-Clean Liquid Flux SM-ZR10 for Automatic Wave Soldering Process
Aug 12, 2024 | SHENMAO America, Inc. is pleased to announce the launch of its latest innovation, the Rosin-Free No-Clean Liquid Flux SM-ZR10, specifically designed for automatic wave soldering processes. The no-clean liquid flux offers superior soldering performance, easy maintenance, and compliance with stringent environmental standards.
SHENMAO Recycled Solder Materials PF606R-PW215 and PF629R-B Receive UL ECVP 2809 Certification
Jul 15, 2024 | SHENMAO America, Inc. is pleased to announce that its various solder materials have received UL ECVP 2809 (UL Environmental Claim Validation Procedure, UL ECVP) certification for Recycled Content Standard, which now includes auditing of social responsibility procedures.
SHENMAO Develops Thermal Fatigue-Resistant Solder Paste PF918-P250 for High-Reliability Requirements
Jun 10, 2024 | SHENMAO Technology proudly announces the development of its new thermal fatigue-resistant solder paste, PF918-P250. Designed to meet high-reliability requirements, PF918-P250 offers advanced features and superior performance for electronic products requiring exceptional durability.
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SHENMAO's PF606-P276 Ultra-Low Void Paste Ensures High Joint Strength
May 13, 2024 | SHENMAO Technology is pleased to offer its PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. PF606-P276 has been specifically developed for the surface mount technology (SMT) process, offering superior void performance after the reflow process. By minimizing gas generation during reflow, this solder paste ensures exceptional reliability and performance for a wide range of electronic components and assemblies.
SHENMAO Debuts Special Solder Paste for AI Substrate Power Management Modules
Apr 29, 2024 | SHENMAO Technology proudly presents its latest innovation, the PF719-P250A solder paste, specifically designed for AI substrate power management modules. This cutting-edge solder paste represents a significant advancement in thermal fatigue reliability and performance.
SHENMAO Low-Temperature Solder Paste PF735-PQ10-10 Is Designed for High-Speed Printing Processes
Mar 18, 2024 | SHENMAO Technology is pleased to announce that its PF735-PQ10-10 Low-Temperature Lead-Free Solder Paste is specifically designed for SMT processes, offering a low melting point to accommodate high-speed printing processes. Designed to meet the evolving needs of the electronics manufacturing industry, PF735-PQ10-10 offers a range of features and benefits to enhance SMT processes and improve production efficiency.
SHENMAO to Showcase Advanced Automotive Electronic Solutions at 2024 IPC APEX EXPO
Mar 18, 2024 | SHENMAO Technology will exhibit its cutting-edge solutions for automotive electronics at Booth 2639 during the upcoming IPC APEX EXPO 2024. Taking place April 9-11, 2024 at the Anaheim Convention Center in California, the expo will provide an opportunity for industry professionals to explore SHENMAO's latest advancements in solder paste technology.
New Low Residue No-Clean Flip Chip Flux SMF-D61 from SHENMAO
Feb 12, 2024 | SHENMAO Technology is pleased to announce the availability of its latest innovation, the SMF-D61 Low Residue No-Clean Flip Chip Flux. This advanced flux is meticulously engineered to meet the demanding requirements of flip chip dipping applications, offering exceptional performance and reliability throughout the soldering process.
SHENMAO Embarks on Expansion with a New Factory in Texas to Serve Automotive Applications
Jan 15, 2024 | SHENMAO Technology announces a strategic expansion initiative with the establishment of a new factory in Texas. The move reflects the company's commitment to meeting the growing demand for its high-quality solder products, particularly in the automotive sector. SHENMAO anticipates that the new facility will significantly enhance its production capacity, catering to the needs of key clients, including major players in the electric vehicle manufacturing sector.
