Shenmao Technology Inc.

SHENMAO Technology, Inc. supplier of Pb/Pb-free Solder Pastes, Solder Wire, Solder Bar, Flux, BGA Sphere, Bumping Paste/Flux, PCB Plating Anode, PV Ribbon Electronics Assembly Materials, for over 44 years from 10 world locations.

Manufacturer

Shenmao Technology Inc. as a professional Solder Materials Manufacturer in Taiwan, provides No Clean and Water Soluble Solder Paste, Laser Solder Paste, Low Temperature Solder Paste, Dispensable Solder Paste, Solder Bar, Cored Solder Wire, Flux, BGA Sphere, Bumping Solder Paste/Flux and PV Ribbon with durable quality to EMS, OEM's and OSAT's from 10 worldwide locations. With over 44 years of experience, SHENMAO manufactures Superior Ultra Pure Tin Alloys and Powder in House, are RoHS-complient and sourced from CFSI listed smelters. 11 of the 12 Largest EMS companies are our customers, please feel free to contact us.

Shenmao Technology Inc. Postings

18 products »

Formosa Lead Free Solder Paste

Lead Free Solder Paste have received sub-license from Fuji Electronic Company. We provide halide-containing and halide-free fluxes for Lead Free Solder Alloys, so our customers can be able to reach the lead free era comfortably....

Solder Materials

Formosa Lead Free Solder Paste

Formosa Halogen Free Solder Paste

Lead-Free Solder Paste have received sub-license from Fuji Electronic Company. We provide halide-free fluxes for Lead-Free solder alloys, and conform to the RoHS law, so our customers can be able to reach the lead free era comfortably....

Solder Materials

Formosa Halogen Free Solder Paste

Formosa Low Temperature Solder Paste

Shenmao Technology has developed Low Temperature Solder Paste for SMT devices. The Low Temperature Solder Paste has been qualified by third party organization. Low Temperature Solder Paste: Sn42Bi58 Melting point: 138℃...

Solder Materials

Formosa Low Temperature Solder Paste

Formosa Package on Package Solder Paste

For high density and advanced package technology, We provide new Solder Paste for PoP applications. Package on Package Solder Paste has better wettability, solderability and low void than others....

Solder Materials

Formosa Package on Package Solder Paste

Formosa Water Soluble Solder Paste

Shenmao Technology offers a full line of Water Soluble Fluxes and Water Soluble Solder Paste for SMT and IC packaging applications. We provide halide-containing and halide-free fluxes for Tin/Lead as well as Lead-Free solder alloys. Our formulations,...

Solder Materials

Formosa Water Soluble Solder Paste

Formosa Bumping Solder Paste

Bumping Solder Paste aims to decrease current issue of too much voids in the IC Packaging Manufactures. Our applications engineers of SMMI focus on developing the lower Void,...

Solder Materials

Formosa Bumping Solder Paste

Formosa Tin Lead Solder Paste

Tin Lead Solder Pastes are made from high purity metal (Tin, Lead); high quality is guaranteed. Our strict production and quality control, strong technical and development team results in reasonable price and to meet each customer'...

Solder Materials

Formosa Tin Lead Solder Paste

Water Soluble and No-Clean Fluxes

We offer a full line of Water Soluble Fluxes and No-Clean Flux for SMT, IC packaging and PCB Wave solder applications.  We provide halide-containing and halide-free fluxes for Lead-Free solder alloys. Besides, our Lead-Free Liq...

Solder Materials

Water Soluble and No-Clean Fluxes

SM-150G/SM-155P Epoxy Adhesives

SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suit...

Solder Materials

SM-150G/SM-155P Epoxy Adhesives

SM-150G / SM-155P Single Component Epoxy Adhesive

SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suit...

Solder Materials

SM-150G / SM-155P Single Component Epoxy Adhesive

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96 news releases »

SHENMAO PF735-P267J Low Melting Point Paste Is Designed for Jet Dispensing

May 18, 2022 | SHENMAO America, Inc. offers PF735-P267J Low Melting Point Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.

SHENMAO Offers Low-Temperature Lead-Free Solder Paste for Sensitive Components

Apr 13, 2022 | SHENMAO America, Inc. is pleased to introduce its PF735-PQ10-10 Low Melting Point Lead-Free Solder Paste. Low-temperature solder paste has become more widely used in the assembly of surface mount technology devices because certain assemblies cannot withstand the same temperatures that are used for lead-free soldering, typically 240°-250°C. These high temperatures can damage sensitive components, causing warpage and other damage.

SHENMAO Develops Thermal Fatigue Resistant Solder Paste for High-Reliability Requirements

Mar 14, 2022 | SHENMAO America, Inc. is pleased to introduce its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy, which is designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.

SHENMAO Offers Halogen-Free SM-862 Liquid Flux

Feb 25, 2022 | SHENMAO America, Inc. is pleased to offer its halogen-free SM-862 Liquid Flux that can replace the widely sold halogenated SM-816. The flux features low solid content and smooth flux residue, making it suitable for automatic wave soldering and manual dipping processes.

SHENMAO to Highlight High-Rel Solder Sphere and Thermal Fatigue Resistant Paste at APEX

Jan 10, 2022 | SHENMAO America, Inc. is pleased to announce plans to exhibit in Booth #2534 during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The company will highlight its PF918-S High Reliability Solder Sphere and PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.

SHENMAO's New PF606-P245X Lead-Free Solder Paste Wins 2021 Mexico Technology Award

Nov 05, 2021 | SHENMAO America, Inc. is pleased to announce that it received a 2021 Mexico Technology Award in the category of Solder Paste for its new PF606-P245X Lead-Free Solder Paste. The award was announced at a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.

SHENMAO to Exhibit New Solder Pastes with NeVo at productronica

Oct 11, 2021 | SHENMAO America, Inc. today announced plans to exhibit together with NeVo GmbH at productronica 2021, scheduled to take place Nov. 16-19, 2021 at Neue Messe München in Munich, Germany. NeVo will showcase Shenmao's PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste and PF606-P245X Lead-Free Solder Paste.

Soldering and Joint Encapsulation with One Step Reflow from SHENMAO

Aug 26, 2021 | SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.

New Thermal Fatigue Resistant Lead-free Solder Paste

Jun 08, 2021 | SHENMAO America, Inc. is pleased to introduce its PF918-P250Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.

SHENMAO Establishes Testing Laboratory in Taiwan – Cheetah Inspection, Inc.

Apr 01, 2021 | SHENMAO is pleased to announce that it has established an independent testing laboratory in Taiwan called Cheetah Inspection Inc. The ISO/IEC 17025 approved testing laboratory is located in Hsinchu, and builds upon SHENMAO's 48 years of packaging and assembly experience.

86 more news releases from Shenmao Technology Inc. »

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