Shenmao Technology Inc.
SHENMAO Technology, Inc. supplier of Pb/Pb-free Solder Pastes, Solder Wire, Solder Bar, Flux, BGA Sphere, Bumping Paste/Flux, PCB Plating Anode, PV Ribbon Electronics Assembly Materials, for over 44 years from 10 world locations.
Shenmao Technology Inc. as a professional Solder Materials Manufacturer in Taiwan, provides No Clean and Water Soluble Solder Paste, Laser Solder Paste, Low Temperature Solder Paste, Dispensable Solder Paste, Solder Bar, Cored Solder Wire, Flux, BGA Sphere, Bumping Solder Paste/Flux and PV Ribbon with durable quality to EMS, OEM's and OSAT's from 10 worldwide locations. With over 44 years of experience, SHENMAO manufactures Superior Ultra Pure Tin Alloys and Powder in House, are RoHS-complient and sourced from CFSI listed smelters. 11 of the 12 Largest EMS companies are our customers, please feel free to contact us.
Shenmao Technology Inc. Postings
18 products »
Formosa Lead Free Solder Paste
Lead Free Solder Paste have received sub-license from Fuji Electronic Company. We provide halide-containing and halide-free fluxes for Lead Free Solder Alloys, so our customers can be able to reach the lead free era comfortably....
Formosa Halogen Free Solder Paste
Lead-Free Solder Paste have received sub-license from Fuji Electronic Company. We provide halide-free fluxes for Lead-Free solder alloys, and conform to the RoHS law, so our customers can be able to reach the lead free era comfortably....
Formosa Low Temperature Solder Paste
Shenmao Technology has developed Low Temperature Solder Paste for SMT devices. The Low Temperature Solder Paste has been qualified by third party organization. Low Temperature Solder Paste: Sn42Bi58 Melting point: 138℃...
Formosa Package on Package Solder Paste
For high density and advanced package technology, We provide new Solder Paste for PoP applications. Package on Package Solder Paste has better wettability, solderability and low void than others....
Formosa Water Soluble Solder Paste
Shenmao Technology offers a full line of Water Soluble Fluxes and Water Soluble Solder Paste for SMT and IC packaging applications. We provide halide-containing and halide-free fluxes for Tin/Lead as well as Lead-Free solder alloys. Our formulations,...
Bumping Solder Paste aims to decrease current issue of too much voids in the IC Packaging Manufactures. Our applications engineers of SMMI focus on developing the lower Void,...
Tin Lead Solder Pastes are made from high purity metal (Tin, Lead); high quality is guaranteed. Our strict production and quality control, strong technical and development team results in reasonable price and to meet each customer'...
Water Soluble and No-Clean Fluxes
We offer a full line of Water Soluble Fluxes and No-Clean Flux for SMT, IC packaging and PCB Wave solder applications. We provide halide-containing and halide-free fluxes for Lead-Free solder alloys. Besides, our Lead-Free Liq...
SM-150G/SM-155P Epoxy Adhesives
SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suit...
SM-150G / SM-155P Single Component Epoxy Adhesive
SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suit...
109 news releases »
May 22, 2023 | SHENMAO America, Inc. is proud to announce the release of its new SMBF-08 Visible No-Clean BGA Flux. This innovative flux is specifically designed to meet the demands of surface mount technology (SMT) assembly and BGA ball mount processes, offering enhanced visibility and performance.
SHENMAO Offers Industry-Leading UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV
Apr 24, 2023 | SHENMAO America, Inc. is proud to announce the release of its new product, the UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV. This innovative new solder paste is designed to meet the demands of modern electronics manufacturing, offering excellent performance and reliability.
New Anti-HoP Lead-Free Solder Paste Developed to Prevent HoP Issues
Mar 16, 2023 | SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.
SHENMAO Offers Low-Temperature Lead-Free Solder Paste PF735-PQ10-10L for High-Speed Printing
Feb 27, 2023 | SHENMAO America, Inc. has released its PF735-PQ10-10L Low Melting Point Lead-Free Solder Paste. The paste has been designed specifically for the SMT process and is applicable to the high-speed printing process to increase production capacity.
High Thermal Impact Reliability Water-Soluble Solder Paste from SHENMAO Wins 2023 NPI Award
Jan 30, 2023 | SHENMAO America, Inc. received a 2023 NPI Award in the category of Soldering Materials for its PF918-PW216 water-soluble high thermal impact reliability solder paste. The award was announced during a ceremony that took place Monday, Jan. 23, 2023 in San Diego.
SHENMAO Celebrates 50 Years of Developing Solder Materials
Jan 09, 2023 | SHENMAO America, Inc. today announced the company's 50th anniversary as a leading solder material manufacturer. As an award-winning supplier of electronics assembly and semiconductor packaging materials, the company has a reputation for its quality service.
SHENMAO Debuts Low-Temp Joint Enhanced Solder Paste PF735-EP307
Nov 15, 2022 | SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.
High Thermal Impact Reliability Water-Soluble Solder Paste from SHENMAO
Oct 11, 2022 | SHENMAO America, Inc. has successfully developed a no-clean high thermal impact reliability solder paste. PF918-PW216 solder paste adopts the newly designed high reliability lead-free alloy (Sn/4Ag/3Bi) that achieves tensile strength performance 1.4 times higher than typical SAC305 alloys.
Shenmao Recycled Solder Materials to Be Certified to UL ECVP 2809
Sep 08, 2022 | Shenmao America, Inc. is pleased to announce that four of its solder materials have received UL ECVP 2809 (UL Environmental Claim Validation Procedure, UL ECVP) for Recycled Content Standard which now includes auditing of social responsibility procedures. Additionally, more of its recycled tin products will be UL certified in the near future.
SHENMAO Shows High-Rel Solder Paste at SMTA Guadalajara
Aug 26, 2022 | SHENMAO America, Inc. will exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Sept. 21-22, 2022, at the Expo Guadalajara in Jalisco, Mexico. The company will showcase its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste can increase thermal reliability performance by a minimum of 30 percent.
