Shenmao Technology Inc.

SHENMAO Technology, Inc. supplier of Pb/Pb-free Solder Pastes, Solder Wire, Solder Bar, Flux, BGA Sphere, Bumping Paste/Flux, PCB Plating Anode, PV Ribbon Electronics Assembly Materials, for over 44 years from 10 world locations.

Manufacturer of Assembly Material, Assembly, Component Packaging, Repair/Rework, Soldering

Shenmao Technology Inc. as a professional Solder Materials Manufacturer in Taiwan, provides No Clean and Water Soluble Solder Paste, Laser Solder Paste, Low Temperature Solder Paste, Dispensable Solder Paste, Solder Bar, Cored Solder Wire, Flux, BGA Sphere, Bumping Solder Paste/Flux and PV Ribbon with durable quality to EMS, OEM's and OSAT's from 10 worldwide locations. With over 44 years of experience, SHENMAO manufactures Superior Ultra Pure Tin Alloys and Powder in House, are RoHS-complient and sourced from CFSI listed smelters. 11 of the 12 Largest EMS companies are our customers, please feel free to contact us.

Shenmao Technology Inc. Postings

18 products »

Formosa Lead Free Solder Paste

Lead Free Solder Paste have received sub-license from Fuji Electronic Company. We provide halide-containing and halide-free fluxes for Lead Free Solder Alloys, so our customers can be able to reach the lead free era comfortably. ...

Solder Materials

Formosa Lead Free Solder Paste

Formosa Halogen Free Solder Paste

Lead-Free Solder Paste have received sub-license from Fuji Electronic Company. We provide halide-free fluxes for Lead-Free solder alloys, and conform to the RoHS law, so our customers can be able to reach the lead free era comfortably....

Solder Materials

Formosa Halogen Free Solder Paste

Formosa Low Temperature Solder Paste

Shenmao Technology has developed Low Temperature Solder Paste for SMT devices. The Low Temperature Solder Paste has been qualified by third party organization. Low Temperature Solder Paste: Sn42Bi58 Melting point: 138℃ ...

Solder Materials

Formosa Low Temperature Solder Paste

Formosa Package on Package Solder Paste

For high density and advanced package technology, We provide new Solder Paste for PoP applications. Package on Package Solder Paste has better wettability, solderability and low void than others. Package on Package (PoP)...</p>
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Formosa Package on Package Solder Paste

Formosa Water Soluble Solder Paste

Shenmao Technology offers a full line of Water Soluble Fluxes and Water Soluble Solder Paste for SMT and IC packaging applications. We provide halide-containing and halide-free fluxes for Tin/Lead as well as Lead-Free solder alloys. Our formulations,...

Solder Materials

Formosa Water Soluble Solder Paste

Formosa Bumping Solder Paste

Bumping Solder Paste aims to decrease current issue of too much voids in the IC Packaging Manufactures. Our applications engineers of SMMI focus on developing the lower Void, <100000ppm, of formula. It’s approved by our customers that can...

Solder Materials

Formosa Bumping Solder Paste

Formosa Tin Lead Solder Paste

Tin Lead Solder Pastes are made from high purity metal (Tin, Lead); high quality is guaranteed. Our strict production and quality control, strong technical and development team results in reasonable price and to meet each customer'...

Solder Materials

Formosa Tin Lead Solder Paste

Water Soluble and No-Clean Fluxes

We offer a full line of Water Soluble Fluxes and No-Clean Flux for SMT, IC packaging and PCB Wave solder applications.  We provide halide-containing and halide-free fluxes for Lead-Free solder alloys. Besides, our Lead-Free Liq...

Solder Materials

Water Soluble and No-Clean Fluxes

SM-150G/SM-155P Epoxy Adhesives

SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suit...

Solder Materials

SM-150G/SM-155P Epoxy Adhesives

SM-150G / SM-155P Single Component Epoxy Adhesive

SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suit...

Solder Materials

SM-150G / SM-155P Single Component Epoxy Adhesive

See all products from Shenmao Technology Inc. »

67 news releases »

SHENMAO Offers Quality Low-Temperature Solder Paste for SMT Devices

May 20, 2019 | SHENMAO America, Inc. introduces PF735-PQ10 Low Temperature Solder Paste. Qualified by a third-party organization, the PQ10 series of low temperature solder paste is made with a modified Sn/Bi alloy that has a lower melting point range from 137°~142°C to 137°~170°C. This makes it ideal for SMT devices, which can have sensitive components that cannot withstand higher temperatures.

SHENMAO Provides New Solder Paste for Automobile Electronics

May 13, 2019 | SHENMAO America, Inc. introduces PF719-P250, a new solder paste for automobile electronics. With a wide process window and a variety of unique features, this solder paste is ideal for even the most complicated printed circuit board (PCB) design.

SHENMAO Offers Thermal Fatigue Resistance Pb-Free Solder Alloy

May 12, 2019 | SHENMAO America, Inc. offers PF719 Thermal Fatigue Resistance Pb-Free Solder Alloy. PF719 provides excellent thermal fatigue reliability. The alloy offers a similar operating temperature window to typical SAC alloys.

SHENMAO Announces Partnership with Ideal Sales, Inc.

Apr 16, 2019 | SHENMAO America, Inc. is pleased to announce that it has partnered with Ideal Sales, Inc. as its manufacturers’ representative in Southern California and Arizona.

SHENMAO to Exhibit Low-Temperature Solder Pastes at ECTC

Apr 15, 2019 | SHENMAO America, Inc. is pleased to announce that it will exhibit at the 2019 IEEE Electronic Components and Technology Conference (ECTC), scheduled to take place May 28-31, 2019 at The Cosmopolitan of Las Vegas. The company will showcase its PQ10 series low temperature solder paste in Booth #500.

SHENMAO Provides Quality Solder Paste for SMT Assembly

Apr 01, 2019 | SHENMAO America, Inc. provides a variety of solder paste products for SMT assembly including Tin Lead Solder Paste, Lead-Free Solder Paste, Water-Soluble Solder Paste, Package-on-Package Solder Paste, Low-Temperature Solder Paste, and Halogen-Free Solder Paste.

SHENMAO Offers Quality Solarjoin PV Ribbon to Meet High-Reliability Requirements

Mar 31, 2019 | SHENMAO America has more than 40 years of experience in delivering solder materials with effective research and development and total solution capabilities.

SHENMAO to Debut New Pastes & Fluxes at electronica China

Mar 05, 2019 | SHENMAO America, Inc. is pleased to announce that it will exhibit at electronica China, scheduled to take place March 20-22, 2019 at the Shanghai New International Expo Centre. The company will showcase its PQ10 series low temperature solder paste, new P250 series solder paste for automobile electronics, PW215 water soluble solder paste, SMF-WC53 water soluble ball-attach flux and solder sphere, and water-based wave soldering flux & water-based cleaner.

SHENMAO Picks up Third Award for New Liquid Flux

Jan 30, 2019 | SHENMAO America, Inc. is pleased to announce that it was awarded a 2019 NPI Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

SHENMAO to Debut New Solder Wire for Automatic Soldering Equipment at APEX

Jan 05, 2019 | SHENMAO America is pleased to announce that it will exhibit in Booth #1304 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will showcase its new PF606-F13 solder wire and PQ10 series low temperature solder paste.

57 more news releases from Shenmao Technology Inc. »

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