Shenmao Technology Inc.

SHENMAO Technology, Inc. supplier of Pb/Pb-free Solder Pastes, Solder Wire, Solder Bar, Flux, BGA Sphere, Bumping Paste/Flux, PCB Plating Anode, PV Ribbon Electronics Assembly Materials, for over 44 years from 10 world locations.

Manufacturer of Assembly Material, Assembly, Component Packaging, Repair / Rework, Soldering

Shenmao Technology Inc. as a professional Solder Materials Manufacturer in Taiwan, provides No Clean and Water Soluble Solder Paste, Laser Solder Paste, Low Temperature Solder Paste, Dispensable Solder Paste, Solder Bar, Cored Solder Wire, Flux, BGA Sphere, Bumping Solder Paste/Flux and PV Ribbon with durable quality to EMS, OEM's and OSAT's from 10 worldwide locations. With over 44 years of experience, SHENMAO manufactures Superior Ultra Pure Tin Alloys and Powder in House, are RoHS-complient and sourced from CFSI listed smelters. 11 of the 12 Largest EMS companies are our customers, please feel free to contact us.

Shenmao Technology Inc. Postings

18 products »

Formosa Lead Free Solder Paste

Lead Free Solder Paste have received sub-license from Fuji Electronic Company. We provide halide-containing and halide-free fluxes for Lead Free Solder Alloys, so our customers can be able to reach the lead free era comfortably. ...

Solder Materials

Formosa Lead Free Solder Paste

Formosa Halogen Free Solder Paste

Lead-Free Solder Paste have received sub-license from Fuji Electronic Company. We provide halide-free fluxes for Lead-Free solder alloys, and conform to the RoHS law, so our customers can be able to reach the lead free era comfortably....

Solder Materials

Formosa Halogen Free Solder Paste

Formosa Low Temperature Solder Paste

Shenmao Technology has developed Low Temperature Solder Paste for SMT devices. The Low Temperature Solder Paste has been qualified by third party organization. Low Temperature Solder Paste: Sn42Bi58 Melting point: 138℃ ...

Solder Materials

Formosa Low Temperature Solder Paste

Formosa Package on Package Solder Paste

For high density and advanced package technology, We provide new Solder Paste for PoP applications. Package on Package Solder Paste has better wettability, solderability and low void than others. Package on Package (PoP)...</p>
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Formosa Package on Package Solder Paste

Formosa Water Soluble Solder Paste

Shenmao Technology offers a full line of Water Soluble Fluxes and Water Soluble Solder Paste for SMT and IC packaging applications. We provide halide-containing and halide-free fluxes for Tin/Lead as well as Lead-Free solder alloys. Our formulations,...

Solder Materials

Formosa Water Soluble Solder Paste

Formosa Bumping Solder Paste

Bumping Solder Paste aims to decrease current issue of too much voids in the IC Packaging Manufactures. Our applications engineers of SMMI focus on developing the lower Void, <100000ppm, of formula. It’s approved by our customers that can...

Solder Materials

Formosa Bumping Solder Paste

Formosa Tin Lead Solder Paste

Tin Lead Solder Pastes are made from high purity metal (Tin, Lead); high quality is guaranteed. Our strict production and quality control, strong technical and development team results in reasonable price and to meet each customer'...

Solder Materials

Formosa Tin Lead Solder Paste

Water Soluble and No-Clean Fluxes

We offer a full line of Water Soluble Fluxes and No-Clean Flux for SMT, IC packaging and PCB Wave solder applications.  We provide halide-containing and halide-free fluxes for Lead-Free solder alloys. Besides, our Lead-Free Liq...

Solder Materials

Water Soluble and No-Clean Fluxes

SM-150G/SM-155P Epoxy Adhesives

SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suit...

Solder Materials

SM-150G/SM-155P Epoxy Adhesives

SM-150G / SM-155P Single Component Epoxy Adhesive

SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suit...

Solder Materials

SM-150G / SM-155P Single Component Epoxy Adhesive

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86 news releases »

SHENMAO Introduces Thermal Fatigue Resistant Solder Alloy

Mar 04, 2021 | SHENMAO America, Inc. has introduced its PF719-P250 thermal fatigue resistant solder alloy for automobile electronics. With a wide process window and a variety of unique features, this solder paste is ideal for even the most complicated printed circuit board (PCB) design.

New Joint Enhanced Solder Paste and Solder Joint Encapsulation Material Flux from SHENMAO

Mar 02, 2021 | SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.

SHENMAO Introduces New Joint-Enhanced Solder Paste Series

Dec 01, 2020 | SHENMAO America, Inc. is pleased to introduce its Joint-Enhanced Solder Paste (JEP) PF606-EP Series. JEP offers the advantages of both traditional solder paste and anisotropic conductive paste.

SHENMAO Develops New Joint-Enhanced Flux

Nov 09, 2020 | SHENMAO America, Inc. is pleased to introduce its newly developed Joint-Enhanced FluxSMEF-Z3. The new no-clean flux has been designed for fine-pitch assembly and LED die attach.

SHENMAO Awarded for Lead & Halogen-Free Solder Wire

Oct 27, 2020 | SHENMAO America, Inc. received a 2020 Mexico Technology Awardin the category of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire.The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.

SHENMAO Receives Two GLOBAL Technology Awards for New Solder Wire & Solder Paste

Oct 04, 2020 | SHENMAO America, Inc. received two 2020 GLOBAL Technology Awards in the categories of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire, and Solder Paste for its PF606-RT35 Room Temperature Solder (RTS). The awards were announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.

SHENMAO Receives TwoGLOBAL Technology Awards for New Solder Wire & Solder Paste

Oct 03, 2020 | SHENMAO America, Inc. received two 2020 GLOBAL Technology Awards in the categories of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire, and Solder Paste for its PF606-RT35 Room Temperature Solder (RTS).The awards were announced during a Virtual Awards Ceremony on Tuesday, Sept. 29, 2020.

SHENMAO's New Room Temperature Solder Paste Offers Stability for a Range of Temperature Conditions

May 30, 2020 | SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.

SHENMAO Introduces New Solder Wire for Automatic Soldering

May 25, 2020 | SHENMAO America, Inc. is pleased to introduce its new PF606-F13 lead-free and halogen-free solder wire designed for automatic soldering equipment. The new solder wire enhances high-precision soldering, soldering efficiency and offers stable soldering quality.

Advanced Liquid Flux and Low Temp Solder from SHENMAO at SMTA Silicon Valley Expo

Nov 25, 2019 | SHENMAO America, Inc. announces that it will exhibit at the SMTA Silicon Valley Expo, scheduled to take place Wednesday, Dec. 4, 2019 at the Bestronics Box Build Facility in San Jose, CA. The company will showcase its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux.

76 more news releases from Shenmao Technology Inc. »

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