Inspection Systems

Inspection Systems Description:

State-of-the-art inspection is key to ensuring quality, so we have installed the revolutionary ERSASCOPE Inspection System 300. This system offers a cross-sectional non-destructive visual image of hidden solder joints by looking beneath the BGA. With this tool, we can quickly inspect all types of BGA, MicroBGA, and Flip-Chip components.

We can focus on and see interior balls in the middle of the BGA. Magnification can be up to 330X.

Fiberoptic backlighting allows rapid, optimal visual inspection.

We can inspect a flip chip with a standoff height as low as 20 microns or .001".

We can easily position any size board for quick inspection up to 24"X24".

The integrated system software allows our technicians to automatically measure distance, angle, volume and area values.

For more information please visit our website