MPC® Technology's cleaning properties allow a wide application range and power the complete removal of all contaminants from electronic substrate surfaces.
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics and semiconductor manufacturing industry.
With 7 worldwide technical centers offering more than 90 cleaning machines from leading international manufacturers and the largest team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
ZESTRON offers a complete range of true pH neutral, alkaline and engineered solvent process solutions for the aerospace, military, automotive, communications, and medical industries. With cleanliness assessment services onsite, ZESTRON’s Application Engineering team performs in-depth cleanliness assessments consisting of ionic contamination testing, ion chromatography, visual inspection, SIR C3 extraction testing, climatic reliability, and failure analysis.
Offering complete process solutions, ZESTRON Academy provides training on the latest solutions and best practices through webinars, workshops, technical papers, and customized training.
Cleaning questions? ZESTRON has answers.
ZESTRON Americas Postings
Incorporating the ZESTRON® EYE's 3P-Technology, the ZESTRON® EYE CM monitors and controls wash bath concentration in real time. This stand alone concentration management system easily integrates with batch and inline c...
World’s first water-based cleaning agent for the removal of conformal coating material from pallets, fixtures, and tools ATRON® DC is engineered specifically for maximum decoating power while prioritiz...
The World’s First Automated Concentration Measurement System For Electronics Cleaning Processes The ZESTRON® EYE consists of a sensor and a controller that can be fully integrated with commonly used cleaning machine types and...
pH neutral cleaning agent for semiconductor applications. HYDRON® SE 220 is a water-based, single-phase cleaning agent specifically developed for use in immersion and ultrasonic processes. HYDRON® SE 220 removes flux residues f...
HYDRON® WS 400, based on the FAST® Technology, is an aqueous based cleaning agent specifically designed to remove water-soluble (OA) flux residues from electronic assemblies and is compatible with sensitive metals. Applied at low concentra...
Water-based, pH-neutral defluxing agent Based on the MPC® Technology, ZESTRON’s latest pH-neutral cleaning agent has been specifically developed for use at low operating concentrations in spray-in-air inline and batch cleanin...
pH Neutral Cleaning Agent for Power Electronic Applications. VIGON® PE 180, based on the MPC® Technology (Micro Phase Cleaning), is a water-based, pH neutral cleaning agent specifically developed for the use in s...
PCB Cleaning Medium with a Mild Formulation Especially for Sensitive Metal Alloys VIGON A 250 is a water-based MPC® cleaning agent designed to remove flux residues and solder pastes from electronic assemblies. Due to its mild formu...
VIGON US is a water-based medium specifically developed for the use in ultrasonic, spray-under-immersion and centrifugal cleaning equipment. Based on MPC Technology, VIGON US removes all types of flux residues from electronic assemblies, ceramic h...
Water-based Cleaning Medium for Reflow and Wave Solder Equipment. Based on the MPC® Technology, VIGON® RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It re...
- Why Cleaning is Critical Before Conformal Coating - March 23rd
Tue, Mar 23, 2021| Online
- DI-Water vs. Chemistry - April 27th
Tue, Apr 27, 2021| Online
- Jet Printing and Cleaning Challenges - May 25th
Tue, May 25, 2021| Online
- Surface Cleanliness: How Clean is Clean? - June 22nd
Tue, Jun 22, 2021| Online
- Solder Mask and Low Stand-off Component Cleaning – A Connection? - July 27th
Tue, Jul 27, 2021| Online
- Advanced Cleaning for Advanced Packages - August 24th
Tue, Aug 24, 2021| Online
- Improvements in Yield and Reliability for SMT Processes - September 21st
Tue, Sep 21, 2021| Online
- Designing for Reliability in Class III Assemblies - October 26th
Tue, Oct 26, 2021| Online
Nov 04, 2020 | Jigar Patel and Umut Tosun
OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards....
Feb 25, 2016 | Umut Tosun, Jigar Patel, Kalyan Nukula, Fernando Gazcon, ZESTRON America
With regard to precision cleaning applications within electronics manufacturing, pH neutral product development was a major breakthrough in recent years. The impetus for this development resulted from changes with regard to solder paste formulations and resulting assembly processes.</p><p>The greater use of lead-free solder paste and the required higher reflow profiles have resulted in even more difficult to remove burnt-in flux residues. Coupled with increases in component density, larger component packages, higher lead counts, finer lead spacing, and lower standoff distances, effective cleaning is greatly challenged. The aqueous alkaline based cleaning agents can effectively remove these flux residues, however, the process often requires an increase in wash temperature and exposure time, chemical concentration, and mechanical energy. Although an efficient and effective cleaning process can be developed, oftentimes, the required operating parameters present a new set of challenges with regard to material compatibility.</p><p>Since their introduction, the newly developed pH neutral formulations have proven to be capable not only of removing these difficult post reflow residues from complex board geometries, but do so without affecting material compatibility of sensitive components. Additionally, they perform at low concentration levels. This study reviews the performance of pH neutral cleaning agents as compared to alkaline cleaning agent alternatives and includes field data demonstrating their effectiveness with regard to material compatibility and cleaning performance....
Jun 28, 2011 | ZESTRON
ZESTRON America’s spring edition of ZESTRON News goes back to basics providing the latest information on the topics of cleaning in the electronics manufacturing industry....
Dec 22, 2009 | Dr. Harald Wack, Umut Tosun, M.S.Chem.Eng., Dr. Joachim Becht, Dr. Helmut Schweigart
While most cleaning applications in the North American market rely on cleaning with DI-water only, for removing OA fluxes in first place, recent market studies show that water has reached its limitations in cleaning performance while favoring usage of aqueous processes. The term aqueous implies the use of aqueous-based chemistries with active ingredients and are usually diluted with DI-water. The nature of these active ingredients in the aqueous chemistries varies between manufacturer and his R&D knowledge. ...
Sep 18, 2009 | Harald Wack, Ph.D., Umut Tosun, Naveen Ravindran, Sylvain Chamousset, Joachim Becht, Ph.D.; ZESTRON, Steve Stach, Austin American Technology Corp.
In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in available information. Such information is crucial for potential and existing users to fully address the cleanliness levels under their respective components. With the emergence of lead-free soldering and even smaller components, new challenges have arisen including cleaning in gaps of less than 1-mil....
Jul 01, 2009 | Steve Stach, Austin American Technology Harald Wack, Ph.D., Umut Tosun, Naveen Ravindran, ZESTRON America, John M. Radman, Daniel D. Phillips, Trace Laboratories East
During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly....
Jan 06, 2009 | Steve Stach, Austin America; Harald Wack, Ph.D., Naveen Ravindran, Zestron America; Joachim Becht, Zestron Europe
To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent based applications have re-emerged, and with that, an overall process solution is necessary....
Mar 02, 2021 | ZESTRON is pleased to announce that it will host "Why Cleaning is Critical Before Conformal Coating" on Tuesday March 23rd, from 11:00 AM to 12:00 PM EDT. This is the first installment of the ZESTRON Academy 2021 Cleaning Webinar Series, and will be presented by our industry expert, Naveen Ravindran, M.S.Ch.E, Application Engineer.
Jan 27, 2021 | ZESTRON Academy is pleased to announce the 2021 Cleaning Webinar Series schedule. ZESTRON Academy continues to educate production line operators, manufacturing and quality control managers as well as process engineers by providing detailed industry knowledge and troubleshooting techniques.
Jan 21, 2021 | ZESTRON and GEN3 Systems is proud to announce their collaboration on a new test service for the US electronics Industry to help develop Objective Evidence required by the latest release of IPC-J-STD-001 Revision H.
Nov 17, 2020 | ZESTRON is pleased to announce the addition of James Mueller as the new Western Regional Sales Manager.
Oct 10, 2020 | ZESTRON is pleased to announce that it will host "Multiple Thermal Cycles" on Thursday October 29th, from 1:30 PM to 2:30 PM EDT. This is the eighth and final installment of the ZESTRON Academy 2020 Cleaning Webinar Series, and will be presented by our industry expert, Jigar Patel, M.S.Ch.E, Senior Application Engineer.
Sep 10, 2020 | ZESTRON is pleased to announce that Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer and Terry Price, Ph.D, R&D Scientist, will present "Accelerating Continuous Improvement with Next Generation pH Neutral Cleaning Products" at the SMTA International Virtual Conference.
Sep 01, 2020 | ZESTRON is pleased to announce that it will host "Solder Mask & Low Stand-off Component Cleaning – A Connection?" on Thursday September 17th, from 1:30 PM to 2:30 PM EDT. This is the seventh installment of the ZESTRON Academy 2020 Cleaning Webinar Series, and will be presented by our industry expert, Jigar Patel, M.S.Ch.E, Senior Application Engineer.
Sep 01, 2020 | ZESTRON is pleased to announce that it will be featuring the newly released VIGON® NX 700 at the SMTAI virtual expo.
Aug 07, 2020 | ZESTRON is pleased to announce that it will host "Defluxing Advanced Packages" on Thursday August 27th, from 1:30 PM to 2:30 PM EDT. This is the sixth installment of the ZESTRON Academy 2020 Cleaning Webinar Series, and will be presented by our industry expert, Ravi Parthasarathy, M.S.Ch.E, Senior Application Engineer.
Aug 07, 2020 | ZESTRON is pleased to announce that it has released VIGON® NX 700, a pH neutral defluxing agent.