ZESTRON Americas

The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.

Cleaning, Test Services, Training Provider

MPC® Technology's cleaning properties allow a wide application range and power the complete removal of all contaminants from electronic substrate surfaces.

Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics and semiconductor manufacturing industry.

With 7 worldwide technical centers offering more than 90 cleaning machines from leading international manufacturers and the largest team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.

ZESTRON offers a complete range of true pH neutral, alkaline and engineered solvent process solutions for the aerospace, military, automotive, communications, and medical industries. With cleanliness assessment services onsite, ZESTRON’s Application Engineering team performs in-depth cleanliness assessments consisting of ionic contamination testing, ion chromatography, visual inspection, SIR C3 extraction testing, climatic reliability, and failure analysis.

Offering complete process solutions, ZESTRON Academy provides training on the latest solutions and best practices through webinars, workshops, technical papers, and customized training.

Cleaning questions? ZESTRON has answers.

ZESTRON Americas Postings

15 products »

ZESTRON® EYE CM Automatic Concentration Management System

Incorporating the ZESTRON® EYE's 3P-Technology, the ZESTRON® EYE CM monitors and controls wash bath concentration in real time. This stand alone concentration management system easily integrates with batch and inline c...

Cleaning Agents

ZESTRON® EYE CM Automatic Concentration Management System

ATRON® DC - Conformal Coating Remover

World’s first water-based cleaning agent for the removal of conformal coating material from pallets, fixtures, and tools ATRON® DC is engineered specifically for maximum decoating power while prioritiz...

Cleaning Agents

ATRON® DC - Conformal Coating Remover

ZESTRON® EYE Automated Concentration Measurement System

The World’s First Automated Concentration Measurement System For Electronics Cleaning Processes The ZESTRON® EYE consists of a sensor and a controller that can be fully integrated with commonly used cleaning machine types and...

Cleaning Agents

ZESTRON® EYE Automated Concentration Measurement System

HYDRON® SE 220 True pH Neutral Defluxing for Semiconductor Electronics

pH neutral cleaning agent for semiconductor applications. HYDRON® SE 220 is a water-based, single-phase cleaning agent specifically developed for use in immersion and ultrasonic processes. HYDRON® SE 220 removes flux residues f...

Cleaning Agents

HYDRON® SE 220 True pH Neutral Defluxing for Semiconductor Electronics

HYDRON® WS 400 - Aqueous-based Cleaning Medium for Defluxing

HYDRON® WS 400, based on the FAST® Technology, is an aqueous based cleaning agent specifically designed to remove water-soluble (OA) flux residues from electronic assemblies and is compatible with sensitive metals. Applied at low concentra...

Cleaning Agents

HYDRON® WS 400 - Aqueous-based Cleaning Medium for Defluxing

VIGON® N 600 – PH-Neutral Defluxing Agent

Water-based, pH-neutral defluxing agent Based on the MPC® Technology, ZESTRON’s latest pH-neutral cleaning agent has been specifically developed for use at low operating concentrations in spray-in-air inline and batch cleanin...

Cleaning Agents

VIGON® N 600 – PH-Neutral Defluxing Agent

VIGON® PE 180 True pH Neutral Defluxing for Power Electronics

pH Neutral Cleaning Agent for Power Electronic Applications. VIGON® PE 180, based on the MPC® Technology (Micro Phase Cleaning), is a water-based, pH neutral cleaning agent specifically developed for the use in s...

Cleaning Agents

VIGON® PE 180 True pH Neutral Defluxing for Power Electronics

VIGON® A 250 - Water Based PCB Defluxing Agent

PCB Cleaning Medium with a Mild Formulation Especially for Sensitive Metal Alloys VIGON A 250 is a water-based MPC® cleaning agent designed to remove flux residues and solder pastes from electronic assemblies. Due to its mild formu...

Cleaning Agents

VIGON® A 250 - Water Based PCB Defluxing Agent

VIGON® US - Flux Removal Agent for PCB's

VIGON US is a water-based medium specifically developed for the use in ultrasonic, spray-under-immersion and centrifugal cleaning equipment. Based on MPC Technology, VIGON US removes all types of flux residues from electronic assemblies, ceramic h...

Cleaning Agents

VIGON® US - Flux Removal Agent for PCB's

VIGON® RC 101 - Cleaning Agent for Reflow and Wave Solder Equipment

Water-based Cleaning Medium for Reflow and Wave Solder Equipment. Based on the MPC® Technology, VIGON® RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It re...

Cleaning Agents

VIGON® RC 101 - Cleaning Agent for Reflow and Wave Solder Equipment

See all products from ZESTRON Americas »

9 technical articles »

PCB Surface Finishes & The Cleaning Process - A Compatibility Study

Oct 20, 2021 | Umut Tosun, Naveen Ravindran

All PCBs that are manufactured require a surface finish to protect exposed copper on the surface which if left unprotected, can oxidize, rendering the board unusable. To address this issue, it is common to surface treat the PCB prior to assembly and reflow. The surface finish not only prevents oxidation of the underlying copper, but guarantees a solderable surface. A cost effective and widely used approach to PCB surface finish is HASL (Hot Air Solder Leveling). However, as circuit complexity and component density have increased, HASL has reached its limitations, necessitating the need for thinner coatings. Thus, coatings such as Immersion Tin (ImSn), Immersion Silver (ImAg), Organic Solderability Preservatives (OSP), and Electroless Nickel Immersion Gold (ENIG) are becoming more widely used....

Cleaning Before Conformal Coating

Oct 06, 2021 | Naveen Ravindran

Cleaning PCBs before conformal coating removes potentially harmful and unknown contaminants from the board's surface resulting in better adhesion of the conformal coating and thereby preventing delamination. Cleaning PCBs can ultimately prevent issues like leakage current, electrochemical migration and coating failures. From a production standpoint, it can help to decrease the cost of labor and time needed for the re-work of the boards....

Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection?

Nov 04, 2020 | Jigar Patel and Umut Tosun

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remain on the substrate surface, potential failure mechanisms, including dendritic growth by electrochemical migration reaction and leakage current, may result. These failures have been well documented. If a decision to clean substrates is made, there are numerous cleaning process options available. For defluxing applications, the most common systems are spray-in-air, employing either batch or inline cleaning equipment and an engineered aqueous based cleaning agent. Regardless of the type of cleaning process adopted, effective cleaning of post solder residue requires chemical, thermal and mechanical energies. The chemical energy is derived from the engineered cleaning agent; the thermal energy from the increased temperature of the cleaning agent, and the mechanical energy from the pump system employed within the cleaning equipment. The pump system, which includes spray pressure, spray bar configuration and nozzle selection, is optimized for the specific process to create an efficient cleaning system. As board density has increased and component standoff heights have decreased, cleaning processes are steadily challenged. Over time, cleaning agent formulations have advanced to match new solder paste developments, spray system configurations have improved, and wash temperatures (thermal energy) have been limited to a maximum of 160ºF. In most cases, this is due to thermal limitations of the materials used to build the polymer-based cleaning equipment. Building equipment out of stainless steel is an option, but one that may be cost prohibitive. Given the maximum allowable wash temperature, difficult cleaning applications are met by increasing the wash exposure time; including reducing the conveyor speed of inline cleaners or extending wash time in batch cleaners. Although this yields effective cleaning results, process productivity may be compromised. However, high temperature resistant polymer materials, capable of withstanding a 180°F wash temperature, are now available and can be used in cleaning equipment builds. For this study, the authors explored the potential for increasing cleaning process efficiency as a result of an increase in thermal energy due to the use of higher wash temperature. The cleaning equipment selected was an inline cleaner built with high temperature resistant polymer material. For the analysis, standard substrates were used. These were populated with numerous low standoff chip cap components and soldered with both no-clean tin-lead and lead-free solder pastes. Two aqueous based cleaning agents were selected, and multiple wash temperatures and wash exposure times were evaluated. Cleanliness assessments were made through visual analysis of under-component inspection, as well as localized extraction and Ion Chromatography in accordance with current IPC standards....

ph Neutral Cleaning Agents - Market Expectation & Field Performance

Feb 25, 2016 | Umut Tosun, Jigar Patel, Kalyan Nukula, Fernando Gazcon, ZESTRON America

With regard to precision cleaning applications within electronics manufacturing, pH neutral product development was a major breakthrough in recent years. The impetus for this development resulted from changes with regard to solder paste formulations and resulting assembly processes.</p><p>The greater use of lead-free solder paste and the required higher reflow profiles have resulted in even more difficult to remove burnt-in flux residues. Coupled with increases in component density, larger component packages, higher lead counts, finer lead spacing, and lower standoff distances, effective cleaning is greatly challenged. The aqueous alkaline based cleaning agents can effectively remove these flux residues, however, the process often requires an increase in wash temperature and exposure time, chemical concentration, and mechanical energy. Although an efficient and effective cleaning process can be developed, oftentimes, the required operating parameters present a new set of challenges with regard to material compatibility.</p><p>Since their introduction, the newly developed pH neutral formulations have proven to be capable not only of removing these difficult post reflow residues from complex board geometries, but do so without affecting material compatibility of sensitive components. Additionally, they perform at low concentration levels. This study reviews the performance of pH neutral cleaning agents as compared to alkaline cleaning agent alternatives and includes field data demonstrating their effectiveness with regard to material compatibility and cleaning performance....

Back to Basics – Why Clean?

Jun 28, 2011 | ZESTRON

ZESTRON America’s spring edition of ZESTRON News goes back to basics providing the latest information on the topics of cleaning in the electronics manufacturing industry....

Why Switch From Pure DI-Water to Chemistry

Dec 22, 2009 | Dr. Harald Wack, Umut Tosun, M.S.Chem.Eng., Dr. Joachim Becht, Dr. Helmut Schweigart

While most cleaning applications in the North American market rely on cleaning with DI-water only, for removing OA fluxes in first place, recent market studies show that water has reached its limitations in cleaning performance while favoring usage of aqueous processes. The term aqueous implies the use of aqueous-based chemistries with active ingredients and are usually diluted with DI-water. The nature of these active ingredients in the aqueous chemistries varies between manufacturer and his R&D knowledge. ...

Fluid Flow Mechanics Key To Low Standoff Cleaning

Sep 18, 2009 | Harald Wack, Ph.D., Umut Tosun, Naveen Ravindran, Sylvain Chamousset, Joachim Becht, Ph.D.; ZESTRON, Steve Stach, Austin American Technology Corp.

In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in available information. Such information is crucial for potential and existing users to fully address the cleanliness levels under their respective components. With the emergence of lead-free soldering and even smaller components, new challenges have arisen including cleaning in gaps of less than 1-mil....

Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution

Jul 01, 2009 | Steve Stach, Austin American Technology Harald Wack, Ph.D., Umut Tosun, Naveen Ravindran, ZESTRON America, John M. Radman, Daniel D. Phillips, Trace Laboratories East

During the last 5 years, the processes to remove flux residues especially for lead-free and challenging geometries have demonstrated new cleaning obstacles which have to be overcome.i A new methodology has been recently developed to further increase the propensity for successful cleaning.ii At the core of this method is the thermal identification of the residue matrix. Thermal energy changes the physical state, i.e. transitions between liquid, solid and gas phases. By taking advantage of such specific information during phase transitions, the cleaning process can be tailored to such settings, which in turn increases the cleaning success significantly....

Cleaning High-power Electronics

Jan 06, 2009 | Steve Stach, Austin America; Harald Wack, Ph.D., Naveen Ravindran, Zestron America; Joachim Becht, Zestron Europe

To prevent malfunctions in high-power electronics, flux residues must be removed from flip chip components prior to subsequent processes. As a result, integrating a suitable cleaning application into the manufacturing process of flip chip components is often required. Solvent based applications have re-emerged, and with that, an overall process solution is necessary....

428 news releases »

ZESTRON Academy to Host FREE "Designing for Reliability in Class III Assemblies" Webinar

Oct 04, 2021 | ZESTRON is pleased to announce that it will host "Designing for Reliability in Class III Assemblies" on Tuesday October 26th, from 11:00 AM to 12:00 PM EST. This is the eighth and final installment of the ZESTRON Academy 2021 Cleaning Webinar Series, and will be presented by our industry expert, Ravi Parthasarathy, M.S.Ch.E, Senior Application Engineer.

ZESTRON Academy to Host FREE "Improvements in Yield and Reliability for SMT Processes" Webinar

Sep 02, 2021 | ZESTRON is pleased to announce that it will host "Improvements in Yield and Reliability for SMT Processes" on Tuesday September 21st, from 11:00 AM to 12:00 PM EST. This is the seventh installment of the ZESTRON Academy 2021 Cleaning Webinar Series, and will be presented by our industry expert, Kalyan Nukala, M.S.Ch.E, Application Engineer.

ZESTRON Academy to Host FREE "Advanced Cleaning for Advanced Packages" Webinar

Aug 13, 2021 | ZESTRON is pleased to announce that it will host "Advanced Cleaning for Advanced Packages" on Tuesday August 24th, from 11:00 AM to 12:00 PM EST. This is the sixth installment of the ZESTRON Academy 2021 Cleaning Webinar Series, and will be presented by our industry expert, Ravi Parthasarathy, M.S.Ch.E, Senior Application Engineer.

ZESTRON Academy to Host FREE "Solder Mask and Low Stand-off Component Cleaning – A Connection?" Webinar

Jul 02, 2021 | ZESTRON is pleased to announce that it will host "Solder Mask and Low Stand-off Component Cleaning – A Connection?" on Tuesday July 27th, from 11:00 AM to 12:00 PM EST. This is the fifth installment of the ZESTRON Academy 2021 Cleaning Webinar Series, and will be presented by our industry expert, Jigar Patel, M.S.Ch.E, Senior Application Engineer.

ZESTRON Academy to Host FREE "Surface Cleanliness: How Clean is Clean?" Webinar

Jun 02, 2021 | ZESTRON is pleased to announce that it will host "Surface Cleanliness: How Clean is Clean?" on Tuesday June 22nd, from 11:00 AM to 12:00 PM EST. This is the fourth installment of the ZESTRON Academy 2021 Cleaning Webinar Series, and will be presented by our industry expert, Naveen Ravindran, M.S.Ch.E, Application Engineer.

ZESTRON Academy to Host FREE "Jet Printing and Cleaning Challenges" Webinar

May 04, 2021 | ZESTRON is pleased to announce that it will host "Jet Printing and Cleaning Challenges" on Tuesday May 25th, from 11:00 AM to 12:00 PM EST. This is the third installment of the ZESTRON Academy 2021 Cleaning Webinar Series, and will be presented by our industry expert, Kalyan Nukala, M.S.Ch.E, Application Engineer.

ZESTRON Academy to Host FREE "DI-Water vs. Chemistry" Webinar

Apr 03, 2021 | ZESTRON is pleased to announce that it will host "DI-Water vs. Chemistry" on Tuesday April 27th, from 11:00 AM to 12:00 PM EDT. This is the second installment of the ZESTRON Academy 2021 Cleaning Webinar Series, and will be presented by our industry expert, Jigar Patel, M.S.Ch.E, Senior Application Engineer.

ZESTRON Academy to Host FREE "Why Cleaning is Critical Before Conformal Coating" Webinar

Mar 02, 2021 | ZESTRON is pleased to announce that it will host "Why Cleaning is Critical Before Conformal Coating" on Tuesday March 23rd, from 11:00 AM to 12:00 PM EDT. This is the first installment of the ZESTRON Academy 2021 Cleaning Webinar Series, and will be presented by our industry expert, Naveen Ravindran, M.S.Ch.E, Application Engineer.

ZESTRON Academy Announces 2021 Cleaning Webinar Schedule

Jan 27, 2021 | ZESTRON Academy is pleased to announce the 2021 Cleaning Webinar Series schedule. ZESTRON Academy continues to educate production line operators, manufacturing and quality control managers as well as process engineers by providing detailed industry knowledge and troubleshooting techniques.

ZESTRON and GEN3 Systems Collaboration

Jan 21, 2021 | ZESTRON and GEN3 Systems is proud to announce their collaboration on a new test service for the US electronics Industry to help develop Objective Evidence required by the latest release of IPC-J-STD-001 Revision H.

418 more news releases from ZESTRON Americas »

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