SMT Equipment

Ultrasonic Engineering Al Wedge Wire Bonder

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Ultrasonic Engineering   Al Wedge Wire Bonder

Ultrasonic Engineering   Al Wedge Wire Bonder

Name:

Ultrasonic Engineering Al Wedge Wire Bonder

Offered by:

Tanaka Corporation

   

Ultrasonic Engineering Al Wedge Wire Bonder Description:

Spec. : Al wedge wire bonder, Fine wire 25 to 50 micron meter diameter, Rotation head, 60kHz Ultrasonic, Bonding area 104x104 mm Remarks : Manual

Ultrasonic Engineering Al Wedge Wire Bonder was added in Feb 2006

Ultrasonic Engineering Al Wedge Wire Bonder has been viewed 79 times

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