S-Bond Technologies
Brazing and soldering, metal bonding, dissimilar materials, active solder technology
S-Bond Technologies Postings
6 products »
S-Bond has been licensed as a supplier and provider of ultrasonic activated joining services using EWI SonicSolder®, an EWI patented* binary lead-free solder alloy that melts at 231°C. In conjunction with ultrasonic soldering, it can be used to join...
S-Bond Technologies offers both conventional flux soldering and S-Bond soldering. As an Active Solder, S-Bond solder is flux-free eliminating the potential of contamination and corrosion associated with fluxes. Additionally, S-Bond’s limited capillar...
Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizat...
S-Bond® solders are unique in their ability to provide a high performance thermal joint between these materials. S-Bond materials offer approximately 10 times the thermal conductivity of most thermal epoxies along with the ability to bond in air with...
S-Bond joins metals, ceramics, carbon, carbides, and semiconductors making S-Bond a viable process assemble and bond sensors and sensor housings. Applications include the fluxless joining of electrical signal leads to sensor elements where twisted le...
Alternative to Brazing S-Bond can be an alternative lower temperature joining process and replace brazing in some applications. S-Bond is very effective in soldering aluminum to aluminum as well as soldering aluminum to copper....
