ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

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ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies provides custom training in many technical areas including failure analysis, manufacturing engineering, IPC standards and many others.  With IPC Master Instructors and a factory equipped with state of the art equipment our students experience far exceeds that of basic certification classes.

ACI has the expert technical staff and state-of-the-art facilities to assist your company by providing a multitude of electronics manufacturing and production support services to complement your existing production capabilities. Whether you need a reliable second source for prototyping, materials and process evaluation, or assistance in setting up or operating an advanced packaging production line, ACI will work with you to identify the optimum solution for you manufacturing requirements.

ACI's analytical services are available in order to aid in solving a variety of industry issues. ACI's vast capabilities include materials testing, cleanliness analysis, solderability testing, solderability restoration, and environmental stress screening. In addition to routine analysis, ACI can investigate a problem in-depth, utilizing a team of experienced scientists and engineers with our state of the art analytical laboratories and demonstration factory floor. Because of this multidimensional approach, ACI can provide more than just data. We provide answers and recommendations in order to help you find the root cause of your problems. Through our product support services, improving your company's product reliability is our main focus.

One of the primary functions of ACI's analytical laboratory is failure analysis of printed wiring assemblies (PWAs) and electronic components. Once analyses are completed, ACI's technical staff proceeds by recommending and aiding in the implementation of a preventative course of action such as: incoming inspection, vendor qualification, process development, quality control improvement, and inspection

ACI Technologies, Inc. Postings

24 products »

Qualification of Bare Boards

Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard. Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specificat...

Test Services

Qualification of Bare Boards

Reliability Testing Services

Environmental testing is a very useful tool in ensuring product reliability. We have an environmental laboratory that can assist with every aspect of this testing. Our capabilities begin with test planning with the custom...

Test Services

Reliability Testing Services

Counterfeit Component Screening

Counterfeit components screening is the investigation of components that are not performing as compared to the respective data sheet and/or have come from an unqualified or uncertified distributor. We can assist in the an...

Test Services

Counterfeit Component Screening

Cleanliness and Contamination Testing Services

Cleanliness and contamination refers to the analysis of residues and particulate that are present in electronics assemblies and components that could be harmful to the function and reliability of the system. Using our ROS...

Test Services

Cleanliness and Contamination Testing Services

Advanced Imaging Services

Imaging at ACIT assists our scientists with visualizing the failures that have been described. The application of advanced imaging has a wide range of uses in our laboratory. Imaging provides a permanent visual record of ...

Test Services

Advanced Imaging Services

Failure Analysis Services

Failure analysis is a common term that is used in the electronics industry for the process of investigating variables that may have resulted in a defect or interruption in function. We can perform the investigation and su...

Test Services

Failure Analysis Services

Inspection Services - Visual and X-Ray

ACI Technologies employs personnel that are Master IPC Trainers and Certified IPC Trainers for all IPC inspection standards. Visual Inspection Services ACI Technologies e...

Inspection

Inspection Services - Visual and X-Ray

Rework and Repair Services

In order to maintain the highest level of quality in electronics, most manufacturers will employ some form of process control methodology to identify faulty conditions or potential quality variances. The feedback provid...

Rework & Repair Services

Rework and Repair Services

Power Packaging Services

The manufacturing factory at ACI includes a clean room, power electronics assembly and packaging laboratory. This specialized facility aids in the development of manufacturing and assembly technologies that can exploit th...

Design Services

Power Packaging Services

Small Run Prototype Assembly Services

Our experienced engineers and technicians can craft processes that require a variety of surface mount technology (SMT) and plated through-hole (PTH) assembly techniques. ACI can assist manufacturers that require process d...

Prototyping

Small Run Prototype Assembly Services

See all products from ACI Technologies, Inc. »

56 technical articles »

Cleaning No-Clean Fluxes Prior to Conformal Coating

Mar 09, 2020 | ACI Technologies, Inc.

A customer called the Helpline seeking advice for cleaning no-clean fluxes prior to applying a conformal coating. The customer's assemblies were manufactured with a no-clean rosin based solder paste (ROL0) and were cleaned with an isopropyl alcohol (IPA) wash. After cleaning, a white residue was sometimes found in areas with high paste concentrations and was interfering with the adhesion of the conformal coating (Figure 1). For conformal coatings to adhere properly, the printed circuit board (PCB) surface must be clean of fluxes and other residues. In addition, ionic contamination left by flux residues can lead to corrosion and dendrite growth, two common causes of electronic opens and shorts. Other residues can lead to unwanted impedance and physical interference with moving parts....

Mechanical Drop Shock Testing

Feb 03, 2020 | ACI Technologies, Inc.

Accurate impact testing is a key component to establishing that a product is not only reliable, but durable in an end-use environment. ACI Technologies tested a high-g circuit board to demonstrate component durability and ruggedization for guided munitions. The Lansmont Model 23 Shock Test System customized with a Dual Mass Shock Amplifier was used for this testing (Figure 1)....

Atomic Layer Deposition

Jan 13, 2020 | ACI Technologies, Inc.

Is it possible to coat electronic assemblies with a thin, uniform in thickness, pinhole-free, moisture impervious, truly hermetic (by the MIL-STD-883 definition) film of ceramic material that is far more affordable than placing the same electronic assemblies in the currently used glass-to-metal sealed, thick, heavy, metal-and-ceramic-based hermetic enclosures? Since the coating (called a “conformal coating”) would be both hermetic (moisture proof) and hundreds or thousands of times thinner than the currently used enclosures, it would be both less expensive, lighter, and still just as effective in excluding moisture (hermetic) as the current heavy, bulky, expensive electronic enclosures are....

Counterfeit Component Analysis

Jan 02, 2020 | ACI Technologies, Inc.

A customer contacted the Helpline with the concern that parts being used in their assembly may possibly be counterfeit components. The counterfeiting of electronics components is a world-wide problem, and the threat today is even more evident than ever before. Any company, large or small, that manufactures assemblies using electronics components is equally susceptible to using counterfeit devices in their assemblies. In most cases, counterfeit components aren’t discovered until after the component has already been placed on a printed circuit board (PCB), usually during first article electrical test. At this point, the only recourse is to debug the circuit to determine the faulty component and rework each PCB already in production to replace the faulty component. As one might easily surmise, this is a rather costly process; world-wide, counterfeit components account for over $15B loss in sales annually! ...

Masking for Conformal Coatings

Dec 05, 2019 | ACI Technologies

Conformal coatings are regularly employed to protect the surface of a soldered printed circuit board assembly from moisture, chemicals in the PCBA's service environment, and foreign objects or debris. Conformal coatings are nonconductive and therefore cannot be placed on any location where electrical contact will be required, such as connector pins, test points, and sockets. Conformal coatings are also not permitted on any mechanical interface location, such as mounting holes or brackets, to assure the proper fit between items in the final assembly. In order to apply conformal coatings to an assembly and comply with the restrictions on keep-out areas, masking is employed to protect those surfaces. ...

Fiber Optic Cabling

Nov 13, 2019 | ACI Technologies, Inc.

Fiber optic harnesses appear simple, but they have been designed to maintain all of the critical areas of aligning two fibers and minimize the losses associated with a break in the transmission path. In order to understand how the connectors overcome alignment issues, we must first understand the issues. Fiber optic communications networks use specific wavelengths of light (or colors) to transmit information through a clear fiber at high speed. They use the property of internal reflection along the fiber’s axis to contain the light and keep the optical power high enough to be detected at the receiving end. ...

Investigation of PCB Failure after SMT Manufacturing Process

Oct 21, 2019 | ACI Technologies, Inc.

An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead)....

Advanced Packaging Technology

Oct 16, 2019 | ACI Technologies, Inc.

A major goal of the development of advanced packaging technology is to reduce the size, weight, and power consumption of electronics components using state-of-the-art commercial technologies. One of the novel concepts involves the use of all three spatial dimensions when designing and producing new systems. In the past, electronic structures tended to be two dimensional in nature. Generally speaking, individually packaged integrated circuit (IC) dies were interconnected on printed circuit boards. Techniques such as die and package stacking naturally contribute to a reduction of the spatial footprint of any given electronic system design. ...

Power Interfaces

Oct 07, 2019 | ACI Technologies, Inc.

Power interfaces are required when external power sources like solar panels, fuel cells, or batteries are used to generate power for electrical devices. There are two major power interfaces commonly used, direct current to direct current (DC/DC) converters and direct current to alternating current (DC/AC) inverters. While both interfaces are designed to convert from variable DC inputs, they output to different power standards and power levels that are used in different applications....

Cleanliness/Corrosion Mitigation

Sep 27, 2019 | ACI Technologies, Inc.

One of the most critical factors in preventing corrosion from occurring in electronics is maintaining the state of cleanliness. This is not an easy feat to achieve. Corrosion is defined as the deterioration of a material or its properties due to a reaction of that material with its chemical environment. [1] So, to prevent corrosion from occurring, either the material or the chemical environment must be adjusted. Adjusting the material usually means application of a protective coating or replacing a more reactive material with a less reactive material. Adjusting the chemical environment usually means removing ionic species through cleaning, and removing moisture, usually with a conformal coating or hermetic package. Ionic species and moisture are problematic because they form an electrolyte which is able to conduct ions and electricity. Any metal that comes into contact with the electrolyte can begin to corrode....

46 more technical articles from ACI Technologies, Inc. »

2 news releases »

ACI Technologies Hosts Open House and Vacuum Reflow Technology Demos for Excellent Voiding Control

Oct 08, 2019 | As part of our regularly scheduled series of events, ACI Technologies will host an open house on November 5. Among the presentations and equipment demonstrations, BTU will discuss the void-reducing advantages of adding a vacuum chamber after the solder has achieved a liquid state. An equipment demonstration will be given on BTU’s new vacuum reflow oven.

FREE Download of Failures Analysis Booklet from ACI Technologies

Nov 30, 2016 | ACI Technologies invites you to download a free copy of its very popular e-booklet, “Failure Analysis Techniques for Electronics” from its Website store, which is located at http://store.aciusa.org/Failure-Analysis-Techniques-for-Electronics-Digital-Download-P181.aspx

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PCB equipment