ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Design, IPC Standards Certification Center, Consultant, Service Provider, Training Provider

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ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies provides custom training in many technical areas including failure analysis, manufacturing engineering, IPC standards and many others.  With IPC Master Instructors and a factory equipped with state of the art equipment our students experience far exceeds that of basic certification classes.

ACI has the expert technical staff and state-of-the-art facilities to assist your company by providing a multitude of electronics manufacturing and production support services to complement your existing production capabilities. Whether you need a reliable second source for prototyping, materials and process evaluation, or assistance in setting up or operating an advanced packaging production line, ACI will work with you to identify the optimum solution for you manufacturing requirements.

ACI's analytical services are available in order to aid in solving a variety of industry issues. ACI's vast capabilities include materials testing, cleanliness analysis, solderability testing, solderability restoration, and environmental stress screening. In addition to routine analysis, ACI can investigate a problem in-depth, utilizing a team of experienced scientists and engineers with our state of the art analytical laboratories and demonstration factory floor. Because of this multidimensional approach, ACI can provide more than just data. We provide answers and recommendations in order to help you find the root cause of your problems. Through our product support services, improving your company's product reliability is our main focus.

One of the primary functions of ACI's analytical laboratory is failure analysis of printed wiring assemblies (PWAs) and electronic components. Once analyses are completed, ACI's technical staff proceeds by recommending and aiding in the implementation of a preventative course of action such as: incoming inspection, vendor qualification, process development, quality control improvement, and inspection

ACI Technologies, Inc. Postings

24 products »

Qualification of Bare Boards

Qualification of boards and assemblies is the comparison of the board or assembly to an industry standard. Specifically, we qualify printed circuit boards to IPC-6012 – Qualification and Performance Specificat...

Test Services

Qualification of Bare Boards

Reliability Testing Services

Environmental testing is a very useful tool in ensuring product reliability. We have an environmental laboratory that can assist with every aspect of this testing. Our capabilities begin with test planning with the custom...

Test Services

Reliability Testing Services

Counterfeit Component Screening

Counterfeit components screening is the investigation of components that are not performing as compared to the respective data sheet and/or have come from an unqualified or uncertified distributor. We can assist in the an...

Test Services

Counterfeit Component Screening

Cleanliness and Contamination Testing Services

Cleanliness and contamination refers to the analysis of residues and particulate that are present in electronics assemblies and components that could be harmful to the function and reliability of the system. Using our ROS...

Test Services

Cleanliness and Contamination Testing Services

Advanced Imaging Services

Imaging at ACIT assists our scientists with visualizing the failures that have been described. The application of advanced imaging has a wide range of uses in our laboratory. Imaging provides a permanent visual record of ...

Test Services

Advanced Imaging Services

Failure Analysis Services

Failure analysis is a common term that is used in the electronics industry for the process of investigating variables that may have resulted in a defect or interruption in function. We can perform the investigation and su...

Test Services

Failure Analysis Services

Inspection Services - Visual and X-Ray

ACI Technologies employs personnel that are Master IPC Trainers and Certified IPC Trainers for all IPC inspection standards. Visual Inspection Services ACI Technologies e...

Inspection

Inspection Services - Visual and X-Ray

Rework and Repair Services

In order to maintain the highest level of quality in electronics, most manufacturers will employ some form of process control methodology to identify faulty conditions or potential quality variances. The feedback provid...

Rework & Repair Services

Rework and Repair Services

Power Packaging Services

The manufacturing factory at ACI includes a clean room, power electronics assembly and packaging laboratory. This specialized facility aids in the development of manufacturing and assembly technologies that can exploit th...

Design Services

Power Packaging Services

Small Run Prototype Assembly Services

Our experienced engineers and technicians can craft processes that require a variety of surface mount technology (SMT) and plated through-hole (PTH) assembly techniques. ACI can assist manufacturers that require process d...

Prototyping

Small Run Prototype Assembly Services

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68 training courses »

58 more training courses from ACI Technologies, Inc. »

30 technical articles »

Fiducial Marks

Jun 17, 2019 | ACI Technologies, Inc.

Very often pick and place machines are programmed using CAD data. This data increases the accuracy, precision, and repeatability of its component placement objectives. CAD data makes fine pitch and small component assemblies repeatable, but cannot adjust to a particular board unless it is exactly the same size and shape of the original board used for programming. The process by which printed circuit boards (PCBs) are made only allows some minor changes inboard size and shape, but these small differences are enough for parts to be misplaced. For this reason we use fiducial marks to increase the chances of precise component alignment....

BGA Placement on Rework Station

Jun 12, 2019 | ACI Technologies, Inc.

The success of ball grid array (BGA) placement on electronic assemblies is as much a matter of proper preparation and planning, as it is technique. In some designs, it is more appropriate to apply BGAs using a rework station that isolates the placement of the device, without subjecting the entire assembly to thermal reflow. This is especially beneficial in board constructions where the number of BGAs is limited, and the application of the solder paste is difficult, due to small pitch features that stretch the limitation of the stencil construction. Another application for rework stations, involves very large and thermally conductive BGAs, which will not uniformly reflow with other components on the assembly, and may require special process parameters for their proper placement. The most common use of BGA rework stations are for assemblies requiring BGA removal and replacements due to failures in the initial assembly stage....

Reflow Experiment

Jun 11, 2019 | ACI Technologies, Inc.

An experiment was recently performed ACI Technologies for a customer that was interested in comparing the wetting of lead-free solders with varying temperature profiles and atmospheric conditions. In order to deliver an objective measurement of solder wetting (in addition to subjective inspection analysis), a simple wetting indicator pattern was added to the solder stencil in an area on the test vehicle that had exposed and unused copper....

Component Failure Analysis - Hermetic Packaging

Jun 11, 2019 | ACI Technologies, Inc.

Recently ACI Technologies was asked to perform failure analysis on a hermetically sealed transistor for potential electrostatic discharge (ESD) or electrostatic overstress (EOS). ACI was asked to determine if the field-failed transistor was damaged by ESD or EOS. In order to properly assess the failure, additional samples were requested....

Surface Finish Issues Affecting Solderability and Reliability

Jun 07, 2019 | ACI Technologies, Inc.

ACI Technologies was contacted in regards to poor solder joint reliability. The customer submitted an assembly that was exhibiting intermittent opens at multiple locations on a ball grid array (BGA) component. The assembly’s functionality did not survive international shipping, essentially shock and vibration failures, immediately making the quality of the solder joints suspect. The customer was asked about the contract manufacturer and the reflow oven profile as well as the solder paste and surface finish used. The ACI engineering staff evaluated the contract manufacturer’s technique and determined that they were competent in the methods they used for placing thermocouples in the proper locations and developing the reflow oven profile. The surface finish was unusual, but not unheard of, in that it was hard gold over hard nickel, rather than electroless nickel immersion gold (ENIG). The customer was able to supply boundary scan testing data which showed a diagonal row of troublesome BGA pins....

Advanced Packaging of SMT Assemblies for Greater Cost Reduction

Jun 06, 2019 | ACI Technologies, Inc.

Legacy electronics assemblies, such as through-hole (Figure 1) and connectorized component packages, are robust and prevalent throughout industry. However, each of these assembly methods have reached their limits in terms of weight, volume, reliability, and most importantly cost. With cost reduction of assemblies now the primary focus area throughout the electronics industry, there is more of a need than ever to implement the latest advancements in surface mount technology (SMT) into electronics assembly designs. Although SMT has been utilized in the electronics industry for many years, implementation of the technology is still in the ever-evolving process of reducing component footprint size, component spacing, and component I/O pitch. Implementation of the most up-to-date SMT processes provides optimal weight, volume, and cost savings, for any type of assembly....

Ceramic to Plastic Packaging

Jun 05, 2019 | ACI Technologies, Inc.

As electronic products increase in functionality and complexity, there is an emphasis on affordability, miniaturization, and energy efficiency. The telecommunications, automotive, and commercial electronic markets are the leading drivers for these trends. These markets see high volume manufacturing with millions of units priced to the fraction of the cent. The choice of the packaging material for the electrical components for these markets can have a substantial effect on the cost of the final product. Therefore plastic encapsulated components are almost universally used in non-military applications over the conventional ceramic or metal electronic packages....

Platings for Interconnections

Jun 04, 2019 | ACI Technologies, Inc.

Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance....

Corrosion Analysis

Jun 03, 2019 | ACI Technologies, Inc.

ACI Technologies was pleased to assist a customer by conducting elemental analysis on several assemblies displaying severe corrosion. Several board assemblies had failed in the field and exhibited areas of corrosion in close proximity to onboard components. The most common source of corrosion on electronic assemblies is residual flux. Fluxes are specific chemistries applied during the soldering process which improve the wetting of the solder to both the pad and component when forming the solder joint. They can be highly reactive chemicals that, if left on the assemblies, can lead to corrosion, electrical degradation, and decreased reliability. In the presence of moisture and electrical bias, flux residue can enable dendritic growth as a result of electrochemical migration (ECM)....

The Power Packaging Laboratory at ACI Technologies

May 31, 2019 | ACI Technologies, Inc.

Microelectronics is the manufacture of systems built from extremely small electronic components. In today’s electronic world, devices must be portable, equipped with wireless technology and are driven by size, weight, power, and cost (SWaP-C). These system level drivers are crucial to all current and future electronic applications from personal computers and cellular telephones to military-fielded hardware, biomedical instrumentation, and space-flight hardware....

20 more technical articles from ACI Technologies, Inc. »

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FREE Download of Failures Analysis Booklet from ACI Technologies

Nov 30, 2016 | ACI Technologies invites you to download a free copy of its very popular e-booklet, “Failure Analysis Techniques for Electronics” from its Website store, which is located at http://store.aciusa.org/Failure-Analysis-Techniques-for-Electronics-Digital-Download-P181.aspx

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