Lehigh University
Located in Pennsylvania's beautiful Lehigh Valley, Lehigh is one of the nation's most distinguished private research universities. Through academic rigor, an entrepreneurial mindset and collaborative opportunities we challenge our
Lehigh University Technical Articles
A Study of the Aperture Filling Process in Solder Paste Stencil Printing
[July 25, 2023]
Stencil printing has been the dominant method of solder deposition in surface mount assembly. With the development of advanced packaging technologies such as ball grid array (BGA) and flip chip on board (FCOB), stencil printing ...
Analysis of Interfacial Cracking in Flip Chip Packages With Viscoplastic Solder Deformation
[September 25, 2022]
This paper examines the modeling of viscoplastic solder behavior in the vicinity of interfacial cracking for flip chip semiconductor packages. Of particular interest is the relationship between viscoplastic deformation in the solder bumps and any ...
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