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SMTnet Express, March 20, 2025, Subscribers: 26,107, Companies: 12,378, Users: 29,539

█ Electronics Manufacturing Technical Articles

Package on Package (PoP) Stacking and Board Level Reliability, Results of Joint Industry Study

This paper presents the results of a joint - three way study between Amkor Technology, Panasonic Factory Solutions and Spansion in the area of package on package (PoP) board level reliability (BLR) (...) The scope of this paper is to cover the already popular 14 x 14mm PoP package size that provides a 152 pin stacked interface which supports a high level of flexibility in the memory architecture for multimedia requirements.

Credit: Amkor Technology, Inc.

The Challenges Of Package On Package (Pop) Devices During Assembly And Inspection

Ball Grid Array devices, BGAs, are widely used in a vast range of products including consumer, telecommunications and office based systems. As an area array device of solder joints, it provides high packing density with a relatively easy introduction cycle. However, over the last couple of years engineers have started to experiment, and in some cases implement, stacked packages, of the type often called ...

Credit: Electronic Presentation Services

Characterization of Solder Defects on Package on Packages with AXI Systems for Inspection Quality Improvement

As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes.

Credit: Flex (Flextronics International)

Assembly Reliability of TSOP/DFN PoP Stack Package

Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-on-package (PoP) that offers a reduction in overall PCB board area requirements while allowing for increases in functionality. It utilizes standard, readily available device packaging methods in which high-density packaging ...

Credit: Jet Propulsion Laboratory

Package-on-Package (PoP) for Advanced PCB Manufacturing Process

In the 1990's, both BGA (Ball Grid Array) and CSP (Chip Size Package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (Surface Mount Device) from the I 980's and THD (Through-Hole mount Device) from the 1970's are reaching its own impasse in terms of maximizing its electrical, mechanical, and thermal performances, size, weight, and reliability.

Credit: Samsung Electro-Mechanics

RESULTS of Searches for related keywords - "pop" (371)

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█ Printed Circuit Board Assembly & PCB Design Forum

Issues with Placement of Kingbright ATS2013UV385 LED on Siplace X �� Sticky Silicone Surface -- Hello everyone, We're currently experiencing an issue with placing Kingbright ATS2013UV385 type LEDs on our PCBs using Siplace X equipment. The component has a sticky silicone coating on its surface, which causes it to adhere to the nozzle, preventing successful placement on the board. We have tried using various types of nozzles, including standard and ceramic ones of different sizes, but the result remains the same �� the part sticks to the nozzle and fails to detach during placement. Has anyone encountered a similar issue or have suggestions for potential solutions? Any advice or insights would be greatly appreciated. Thank you in advance for your help!

Need Help with BGA Soldering in PoP Assembly -- Dear colleagues, Good day to all. We are facing an issue with soldering the lower BGA component in a Package-on-Package (PoP) assembly. To address this, we drilled a hole and installed a thermocouple. Using a KIC device, we created a thermal profile corresponding to the solder paste (KOKI S3X58-M500). However, X-ray inspection shows insufficient soldering in the lower BGA. Attempts to slightly decrease the conveyor speed and increase the temperature have brought only minimal improvements. We are working with a Heller 1809 MK5 10-zone reflow oven. We would appreciate any suggestions or advice on how to resolve this issue.

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█ SMT, PCB Manufacturing Companies - Industry Directory

POWER MEMBERS

WINTECH SERVICE & MARKETING SDN BHD - WINTECH provides new/used/pre-owned SMT, AI & PCB Assembly (PCBA) equipment of various brands. Also supply service, modification & original or local-made spare parts. We are also an appointed agent for well-known brands.

SEO 1A - SEO 1A provides internet marketing services for manufacturers, sales reps, distributors, & service providers. These services span a wide range of options, catering to companies of all sizes. Experts at optimizing SMTnet promo!

F. I. Group s.r.o. - F.I. Group s.r.o. is established to support businesses using SMT machines and technology. Our main business field is SMT technology, buy/sell of used machines, supplying materials, spare parts for SMT production

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Soccer Random - Explore the challenging soccer simulation Soccer Random!

ECO-Elektronik Kft. - Innovative and precision SMT contract manufacturing. Our main activity is manufacturing of PCB boards with SMT technology and activities linked with this technology

PCB Trace - One-Stop PCB Manufacturer, PCB Assembly and PCB Prototype Service in USA. Our Expertise Are in Electronics Manufacturing Services. Call Now.

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█ SMT, PCB Electronics Assembly Manufacturing Industry News

EVS International to Demonstrate Cleaner, More Efficient Solder Recovery at SMTA Dallas & Houston Expos EVS International, the leader in solder recovery, is set to exhibit at both the SMTA Dallas Expo & Tech Forum on Tuesday, April 1, 2025, at the Plano Event Center, and the SMTA Houston Expo on Thursday, April 3, 2025, at Pinstripes in Houston, Texas. Attendees will have the opportunity to experience the EVS 500LFCABF Solder Recovery System, designed to set new standards for efficiency, cost savings, and sustainability in the solder recovery process.... EVS International
KOKI to Present on New Flux Technology Development at IPC APEX 2025 KOKI will showcase its new E14 Series lead-free solder paste at IPC APEX 2025, from March 19-21, 2025, in Anaheim, CA. Visitors can find KOKI at Booth 2410, where the company will unveil the newly developed flux technology compatible with formic acid reduction reflow ovens. This technology offers solutions to the issues associated with conventional power device soldering.... Koki Company LTD
Machine Vision Products, Inc. to Show Innovative SMT and Microelectronics Inspection Capabilities at IPC Apex Expo 2025 Vista, CA �� March 13, 2025 �� Machine Vision Products, Inc. (MVP), a global leader in advanced imaging and inspection technologies, will demonstrate its latest inspection platforms at IPC Apex Expo in Anaheim, California, from March 18-20 at Booth 1342.... Machine Vision Products, Inc	--->

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█ SMT / PCB Products & Services

NEW SMT / PCB EQUIPMENT & SERVICES - For Sale

PCB REFLOW OVEN

1910 MK5 Dual Lane, Dual Temperature Reflow Oven

Heller

PCB DISPENSING

MAX II (Heated) High Precision Dispensers

GPD Global

Reflow

PCB Reflow Oven Machine I.C.T Lyra Series

Dongguan I.C.T

SELECTIVE SOLDERING

Pillarhouse Jade Handex

Pillarhouse USA

PCB SOFTWARE

ProntoVIEW-MARKUP Assembly Viewer...

Unisoft

PCB ASSEMBLY

PCB Fab & Assembly

Imagineering

PCB INSPECTION

MS-11e High Speed In-Line SPI System

Mirtec

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█ SMT / PCB Assembly Equipment Auctions

AUCTION | Liebold Technologies Factory Closure Auction

AUCTIONEER | Baja Bid

TYPE | Online Auction

FEATURING | SMT Manufacturing & SMT Equipment

SCHEDULE | Mon, Mar 24 to Wed, Mar 26, 2025

OPENS | March 24, 2025 [8am EST]

CLOSING BEGINS | March 26, 2025 [1pm EST]

Removal Deadline | April 4, 2025

LOCATION | Melbourne, FL, USA

INSPECTION - By Appointment Only | March 17, 2025 [8am to 3pm EST]

MARKET - Used Electronic Assembly Machines For Sale

PCB INSPECTION

Viscom S3088 Ultra Chrome 3D AOI

Lewis & Clark Viscom S3088 AOI

Lewis & Clark

P&P / Feeders

Assembleon AX201

KD Electronics - Assembleon AX201

DEK NEOHORIZON 03iX

SMTUnion - DEK NEOHORIZON 03iX

SMTUnion

P&P / FEEDERS

Assembleon Yamaha MG1R Pick and Place

World Equipment Source - Assembleon /Yamaha MG1Rl P&P

World Equipment Source, LLC

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MARKET - Used PCB Assembly Equipment Wanted To Buy

PCB TEST

Agilent 3070

Lewis & Clark Agilent 3070

Lewis & Clark

PCB TEST

Agilent 3070

KD Electronics Agilent 3070

KD Electronics

Pick & Place/Feeders

Mydata Agilis Magazines

Baja Bid

P&P / FEEDERS

Assembleon MG-1R

World Equipment Source Assembleon MG-1R

World Equipment Source, LLC

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█ Electronics Manufacturing & Assembly Events Calendar

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█ Electronics Manufacturing Training Courses & PCB Assembly Training

FIND TRAINING FOR:

IPC Certification

Soldering & Rework

PCB Design

Electronics Assembly

Electronics Inspection

Online Training