Today's analyses of electronics reliability at the system level typically use a "black box approach", with relatively poor understanding of the behaviors and performances of such "black boxes" and how they physically and electrically interact (...) The incorporation of more rigorous and more informative approaches and techniques needs ...
A system level test, usually built-in test (BIT), determines that one or more subsystems are faulty. These subsystems sent to the depot or factory repair facility, called units under test (UUTs) often pass that test, an event we call No-Fault-Found (NFF). With more-and more electronics monitored by BIT, it is more likely that an intermittent ...
Traditional single level microvia structures are generally considered the most robust type of interconnection within a printed wire board (PWB) substrate. The rapid implementation of HDI technology now commonly requires between 2, 3 or 4 levels of microvias sequentially processed into the product. Recent OEM funded reliability testing has confirmed ...
The solid-state electronics industry faces relentless pressure to improve performance, increase functionality, decrease costs, and reduce design and development time. As a result, device feature sizes are now in the nanometer scale range and design life cycles have decreased to fewer than five years. Until recently, semiconductor ...
This paper presents the use of physics of failure (PoF) methodology to infer fast and accurate lifetime predictions for power electronics at the printed circuit board (PCB) level in early design stages. It is shown that the ability to accurately model silicon—metal layers, semiconductor packaging, printed circuit boards (PCBs), and assemblies allows...
DDR5 SMD -- Has anyone encountered soldering DDR5 connectors in the SMD version?
In the near future we are going to solder, they say that they warp when soldering, and in order to avoid defects they put a weight on them, hence the question, what to use as a load?
parts moving after placement? -- I'm having a lot of trouble placing a long thin connector (DF40C-100DS from Hirose) all my other parts including 0.3mm pitch parts are placed very well, but this part is much longer than anything else and is often placed with rotation or position errors.
I'm using a custom nozzle as I thought it was moving after the nozzle picked it up, but now I'm thinking it could be moving after it's placed. The paste has basically no marks on it, and the parts can be easily moved with even the lightest tap on the board. How should I fix this? Increased placement force? Stickier paste? Placement is with a UIC GX11.
Plus Printers - Plus Printers is your trusted partner for custom packaging and printing solutions. We specialize in creating folding cartons, corrugated boxes, and luxury packaging tailored to your specific needs.
VIGOR COMPONENTS PTE.LTD - VIGOR, a leading supplier of electronic components. We specialize in providing a wide range of top-quality components at competitive prices.
GTS Translation Services - GTS provides expert technical and engineering translation services to SMT and PCB manufacturing companies. This includes translation in over 100 languages of manuals, specifications, software UI, SDS and more.
The SMTA announced that the technical program of their annual conference, SMTA International, is finalized and registration is now open. The event will be held October 20 - 24, 2024 at the Donald E. Stephens Convention Center in Rosemont, IL, USA....
IMPORTANT INFORMATION
Bidding Notice: This is an "E-Bay Style" auction.*All equipment is being sold as-is, where-is with no warranty included or implied. Bidders may be invited to inspect the equipment prior to the auction during the preview period.
SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.