Optimizing Time/Pressure Dispensing of Adhesives by Chrys Shea Over the past decade, depositing adhesives for SMT components on the solder side of a circuit board has seen more dramatic changes than any other production process. It's gone from pin transfer, to screening, to time/pressure dispensing, to positive displacement pumps. These changes have not been in the vein of typical process evolutions where experience and experiments give way to refinements and improvements. This process evolution has encountered complete conceptual changes in the approach to get a repeatable, reliable glue dot.
Everyone in the industry will agree that time/pressure systems are not the best way to form adhesive deposits. Some organizations can justify the capital expense of positive displacement pump equipment, while others have returned to screening adhesives with a more refined process than in years past. But many assemblers have time/pressure systems on their shop floor, and no choice but to use them to the best of their capability. Understanding the mechanics of the process can help the effort to optimize this less-than-perfect process, however.
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