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SMT Express, Volume 2, Issue No. 2 - from SMTnet.com
Volume 2, Issue No. 2 Thursday, February 17, 2000
Special Announcements

more belowNew Talkback Feature Added to Newsletter Articles

Featured Articles

Packaging
Reliability Assessment of a Thin (Flex) BGA Using a Polyimide Tape Substrate
Trent Thompson, Armando Carrasco and Andrew Mawer, Motorola Semiconductor Products Sector, Austin, Texas
Wireless communication customers require thinner, smaller footprint packaging to allow for reductions in phone and paging product sizes. Currently, the thin MAP (Mold Array Process) BGA (Ball Grid Array) package is in production which converted from glob-top BGA to reduce the overall package profile from 1.60 to 1.30 mm. The limitations of the MAP BGA is substrate routing on finer geometries or more dense designs and meeting the overall package thickness requirement (1.10 mm max. before collapse). In addition, major issues were experienced with the manufacturing of the thin MAP BGA package due to substrate warpage. The fleXBGA™ package is a thin package that uses polyimide tape as a substrate to reduce the overall package profile to 1.10 mm. This paper will review results received from the evaluation of this new package as compared to the thin MAP BGA currently in production. This report discusses how the substrate processing issues were addressed in thin MAP BGA and on the flex BGA ...
Trends
Trends in Electronic Products and Placement Equipment
by Kevin Towle, Tektronix, Inc., Beaverton, Oregon
The trend in electronic products is towards smaller, faster, lighter assemblies with ever-increasing levels of functionality. In order to meet these demands, the product must be designed with leading edge component technology and assembled with state of the art manufacturing equipment. Component technology development is driven by miniaturization and integration. The components are getting smaller while the functionality is increasing.

In the future, the circuit board and the components will converge. The discrete components will be integrated into the inner layer of the circuit board and silicon microcircuits or dies will be bonded directly to the substrate of the board. Electronic products that are the size of a lunch box will be reduced to a size that will fit into your pocket.


SMTnet Site News

New Talkback Feature Added to Newsletter Articles
A new feature, called Talkback, has been added to the articles in the SMT Express newsletter. Talkback will make the newsletter more interactive by allowing readers' to comment on the articles. Reader comments are immediatley appended to the article itself. At the end of each article, you will see a link inviting you to post a Talkback. By clicking on it, you can post your comments directly to the page. Other readers' comments will appear there as well. This new feature will help improve the quality of the the newsletter, and insure that readers are being provided with the information they need.

Publish Your Papers and Promote Your Company
As SMTnet prepares for the next issue of the SMT Express, we are looking to our readers for articles and papers to feature. Submissions will be accepted any time for future issues. If you have anything you wish to offer, such as papers you have written, book reviews, anecdotes, commentaries, or anything we haven't thought of, please send it to SMTnet. Also, please read the submission guidelines.

The SMT Express is sent to thousands of electronics manufacturing professionals worldwide each month. This is a great opportunity to promote yourself and/or your company for free. In addition, a complete archive of past issues is avaiable at SMTnet.com, so your work will continue to be read long after the newsletter is released.

What's Happening in the Industry
SMT Process Engineer Anaheim, CA
Sr. Mechanical Design Engineer Redmond, WA
SMT Technician Oviedo, FL
General H. Norman Schwarzkopf to Keynote APEX
IPC -- Association Connecting Electronics Industries has announced that General H. Norman Schwarzkopf will deliver the keynote address for the IPC SMEMA Council Electronics Assembly Process Exhibition ...
U.S. Department of Commerce Selects NEPCON West 2001 for the International Buyer Program
Buzz Aldrin to Deliver Opening Keynote Address at NEPCON West 2000

Upcoming EventsCalendar of Events

NEPCON West 2000 Anaheim, California Feb. 27 - Mar. 2
Scan-Tech Asia 2000 Singapore Mar. 1-3
APEX 2000 Long Beach, CA Mar. 14-16

SMTnet Content Report
SMTnet is the most informative electronics industry Web site on the Internet. We are constantly adding more content and intend to keep you informed of our progress since the last issue of this newsletter.

Search or browse the sections below for topics of interest to you.

SECTION NEW ADDITIONS
Electronics Forums 352 new messages
PCBCE Mart 196 new items
Career Center 25 new jobs and resumes
SMT News 20 new stories
Directory 139 new companies

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About This Newsletter

The SMT Express is a periodical featuring assembly solutions from your peers and vendors. We, at SMTnet.com, have designed this newsletter to bring useful information to the mailboxes of electronics manufacturing professionals.

Since we are just getting started, we need your help to make this a relevant and welcome publication. We want your feedback, suggestions, complaints, and compliments. We also want your articles. Please read the submission guidelines and Contact Us regarding article and news submissions.

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