Reliability Assessment of a Thin (Flex) BGA Using a Polyimide Tape Substrate Trent Thompson, Armando Carrasco and Andrew Mawer, Motorola Semiconductor Products Sector, Austin, Texas Wireless communication customers require thinner, smaller footprint packaging to allow for reductions in phone and paging product sizes. Currently, the thin MAP (Mold Array Process) BGA (Ball Grid Array) package is in production which converted from glob-top BGA to reduce the overall package profile from 1.60 to 1.30 mm. The limitations of the MAP BGA is substrate routing on finer geometries or more dense designs and meeting the overall package thickness requirement (1.10 mm max. before collapse). In addition, major issues were experienced with the manufacturing of the thin MAP BGA package due to substrate warpage. The fleXBGA package is a thin package that uses polyimide tape as a substrate to reduce the overall package profile to 1.10 mm. This paper will review results received from the evaluation of this new package as compared to the thin MAP BGA currently in production. This report discusses how the substrate processing issues were addressed in thin MAP BGA and on the flex BGA ...
Trends in Electronic Products and Placement Equipment byKevin Towle, Tektronix, Inc., Beaverton, Oregon The trend in electronic products is towards smaller, faster, lighter assemblies with ever-increasing levels of functionality. In order to meet these demands, the product must be designed with leading edge component technology and assembled with state of the art manufacturing equipment. Component technology development is driven by miniaturization and integration. The components are getting smaller while the functionality is increasing.
In the future, the circuit board and the components will converge. The discrete components will be integrated into the inner layer of the circuit board and silicon microcircuits or dies will be bonded directly to the substrate of the board. Electronic products that are the size of a lunch box will be reduced to a size that will fit into your pocket.
New Talkback Feature Added to Newsletter Articles A new feature, called Talkback, has been added to the articles in the SMT Express newsletter. Talkback will make the newsletter more interactive by allowing readers' to comment on the articles. Reader comments are immediatley appended to the article itself. At the end of each article, you will see a link inviting you to post a Talkback. By clicking on it, you can post your comments directly to the page. Other readers' comments will appear there as well. This new feature will help improve the quality of the the newsletter, and insure that readers are being provided with the information they need.
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