SMT Express, Volume 2, Issue No. 5 - from SMTnet.com
Volume 2, Issue No. 5
Wednesday, May 17, 2000
Special Announcements
SMTnet's Premier OnBoard Forum to Feature Charles A. Harper
Event scheduled for May 19th Moved to June 6th
Due to unforeseen circumstances, our premier OnBoard Forum featuring Charles A. Harper, Editor of the newly released Third Edition of The Electronic Packaging and Interconnection Handbook has been rescheduled for June 6th from 12 to 5 PM ET.
So just what is the OnBoard Forum? Each month we will bring prominent professionals in the electronics manufacturing industry to SMTnet to discuss timely issues affecting the industry. We anticipate thought-provoking discussions, and expect issues raised during OnBoard Forums to reverberate in the Electronics Forums once the interview session has concluded (just the type of food-for-thought exchanges SMTneter's have been looking for!).
Electronic Packaging and Interconnection Handbook - Editor: Charles A. Harper Reviewed by Dave Fish (davef), Pandion Electronics, Inc. Today, product performance requirements and environmental concerns force designers and product assemblers to become more aware and involved in electronic packaging and interconnect decisions than ever before. Product performance requirements spiral from the effects of increasing operating speed, decreasing package size, lowering cost, and reducing time to market. These spiraling requirements decrease the emphasis on traditional component packaging, raise new component packaging and handling issues, and place more responsibility for packaging on the assembler, all the while increasing component and product complexity. Environmental concerns drive new requirements for cleaning, interconnection, and reclaiming and conserving resources; and political responses to issues, previously beyond the scope of influence on engineers and scientists ...
Soldering Technology for Area Array Packages byDr. Ning-Cheng Lee, Indium Corporation of America, Utica, NY USA,andWilliam Casey, Micron Technology Inc., Boise, ID USA Soldering is the primary interconnection technology for area array packages. Methods for solder bumping for area
array packages can be categorized as follows: (1) build-up process, (2) liquid solder transfer, (3) solid solder transfer,
and (4) solder paste bumping. The first group includes both evaporation and electroplating processes, while the second
group includes meniscus bumping and solder jetting. The third group includes wire bumping, sphere welding, decal
solder transfer, tacky dot solder transfer, integrated preform, and pick-and-place solder transfer processes, with
the last one (pick & place solder transfer) being the current prevailing option. Solder paste bumping exhibits great
potential to reduce bumping costs dramatically, and includes the print-detach-reflow, print-reflow-detach, and
dispense approaches ...
Green Electronics/Green Bottom Line offers practical advice for engineers and engineering managers who want or need to incorporate environmental issues into the design process. The emerging discipline of Design for the Environment (DfE) combines engineering know-how with environmental awareness. Topics covered in the book include international policy issues such as ISO 14000, material selection (e.g., for recyclability), manufacturing concerns like no-flux processes, and design issues such as power consumption. Also referenced are real-world cases showing how these elements can be included in everyday designs.
A review of the book by SMTnet contributor Michael Parker of Unigen Corporation will appear in our June issue of the SMT Express.
New Talkback Feature Added to Newsletter Articles A new feature, called Talkback, has been added to the articles in the SMT Express newsletter. Talkback will make the newsletter more interactive by allowing readers to comment on the articles. Reader comments are immediatley appended to the article itself. At the end of each article, you will see a link inviting you to post a Talkback. By clicking on it, you can post your comments directly to the page. Other readers' comments will appear there as well. This new feature will help improve the quality of the the newsletter, and insure that readers are being provided with the information they need.
Publish Your Papers and Promote Your Company As SMTnet prepares for the next issue of the SMT Express, we are looking to our readers for articles and papers to feature. Submissions will be accepted any time for future issues. If you have anything you wish to offer, such as papers you have written, book reviews, anecdotes, commentaries, or anything we haven't thought of, please send it to SMTnet. Also, please read the submission guidelines.
The SMT Express is sent to thousands of electronics manufacturing professionals worldwide each month. This is a great opportunity to promote yourself and/or your company for free. In addition, a complete archive of past issues is avaiable at SMTnet.com, so your work will continue to be read long after the newsletter is released.
SMTnet is the most informative electronics industry resource on the Internet. New content is constantly being added, so we provide you with this content report to keep you informed of our progress since the last issue of this newsletter.
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The SMT Express is a periodical featuring assembly solutions from your peers and vendors. We, at SMTnet.com, have designed this newsletter to bring useful information to the mailboxes of electronics manufacturing professionals.
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