SMT Express, Volume 2, Issue No. 9 - from SMTnet.com
Volume 2, Issue No. 9
Thursday, September 14, 2000
SMTnet's OnBoard Forum to Feature Erick Russell
September 18, 2000 12:00 AM ET to September 21, 2000 5:00 PM ET
Erick Russell is Product Manager for Laser Soldering Products at ViTechnology. Mr. Russell�s work with ViTechnology includes the development of photonic soldering equipment, research and development of future laser products and customer support for the installed base of ViTechnology products. Mr. Russell�s professional experience prior to that at ViTechnology includes developing procedures and equipment for manual and semi-automatic PCB rework and repair and training customers on current equipment procedures. Mr. Russell also contributed material for IPC-7721 "Repair and Modification of Printed Boards and Electronic Assemblies."
Mr. Russell looks forward to fielding your questions regarding photonic soldering for rework applications, how this technology compares to conventional convection rework systems and, where proprietary information is not requested, theory surrounding photonic soldering technology.
Questions may be posted to the OnBoard Forum at anytime between the beginning and ending dates. However, Mr. Russell will answer posted questions between 8AM and 5PM on Thursday the 21st.
"Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield" 2nd edition by George G. Harman is a excellent book for those involving in troubleshooting wire bonding production processes and those doing failure analysis of wire bonded components.
A few of years ago, "Wire Bonding in Microelectronics" seemed less relevant to electric circuit board assembly than it does today. It's primary utility was for those involved in back end of the line integrated circuit and other semiconductor component assembly and failure analysis laboratories...
The issue of reflow profiling has been and continues to be a hot topic. Questions ranging from Why Profile? to How To Profile? to How Can I Better Profile? continue to proliferate. However, the pains often associated with profiling can be reduced greatly if certain guidelines are followed and if there is a strong understanding of the variables that can be encountered during the reflow process. This paper shall discuss the appropriate guidelines and troubleshooting methods for reflow profiling, and in particular shall focus upon the advantages of newer-style reflow ovens and the benefits of implementing the linear ramp-to-spike profile...
The Budgeting Season Approaches! SMTnet provides a broad bundle of services and resources to those in the electronics manufacturing industry; all free of charge. Professionals appear to value these services. The site is active and growing with over 40,000 user sessions each month and over 1,000,000 hits per month! With new features like a site-wide search capability and the OnBoard Forums, SMTnet continues to evolve to satisfy the informational needs of the community it serves.
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