Selective Solder Paste Deposition Reliability Test Results Credit/Source: Bob Wettermann The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture. While the original assembly process has proven to be fairly trouble-free, replacement of Area Array package devices after the assembly process can be much more difficult... 
Printed Circuit Board Equipment Exchange #8
Assets for Sale: Bid on State-of-the-Art PCB Manufacturing Equipment Featuring Drilling & Routing, Lamination, Etching, Plating, Expore, Solder Mask, Final Test,plus SMT & Placement, Feeders, Reflow & Convection, Screen Printing and much more. 
Posted by Prologic Engineering Inc We have not processed very much 0402 size components in the past. We are finding that alot of our customers are upgrading their circuits and going with 0402 size parts...»» Cleaning prototype PCB assemblies and waste water Posted by BillR We will be hand soldering a small number of PCBs per week (both through hole and SMT) using a water soluble flux. We will be using both standard leaded and lead free solder... »» Posted by Grant I have been using the profile based on the solder paste specification, however we have been getting a large BGA chip coming more unreliable, and breaking off the board after shipment... »» 
18th Design Engineering & Manufacturing Solutions Expo / Conference (DMS) Trade Show/Exhibition | Reed Exhibitions Japan Ltd. Wed, June 27, 2007 | Tokyo Big Sight, Japan Japan's largest trade show and conference focusing on IT solutions for the manufacturing industry... »» Practical Process Control Training (PID Tuning) Seminar/Course | Business Industrial Network Wed, June 27, 2007 | Microsoft Building, Saint Louis, MO, USA Learn how top companies maintain their competitive advantage by maximizing productivity and minimizing costs - by optimizing and controlling critical processes... »» Design for Testability and for Built-in Self Test Seminar/Course | A.T.E. Solutions, Inc. Mon, June 25, 2007 | Houston Hotel, Houston, TX, USA This course teaches all aspects of Design for Testability, from what it is, why you might need it, why someone would object to it, and what it can and cannot accomplish... »» 
Jobs: Morton, IL, USA This person will maintain and repair various types of production and development equipment...»» Astronautics Corporation of America Milwaukee, WI, USA Work with design engineering on the manufacturability of mechanical components in displays and electro-mechanical product lines...»» Astronautics Corporation of America Milwaukee, WI, USA Analysis, design, and implementation of new mechanical assembly processes. Create production documentation...»» Resumes: Desired Field: Engineering... Dallas, TX, USA Talented and accomplished sales operations executive with proven ability to increase revenues and profitability...»» Desired Field: Engineering Tijuana, Mexico 7 years of experience in Manufacturing procesess and New Products Introduction of comercial and military SMT and PTH boards...»» Desired Field: Engineering, Production Mentor, OH, USA 6 years of experience in electronics. I know how to program, operate, maintain, setup SMT machines...»»
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