Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts are focussed on the optimized routing of signal, power and ground connections. More often overlooked are some of the effects of the substrate surface layout on assembly yields. Credit/Source: Universal Instruments Corporation, Pericles Kondos, Peter Borgesen, Dan Blass, and Antonio Prats 
Electronic Manufacturing Exchange #69
Digital oscilloscopes, spectrum, logic and network analyzers, generators, meters, counters, plug-ins, test sets, cards and much more.
BEST Instructors have put to video demonstrations of common hand soldering skills. These are not designed to be in place of live one on one training where repetitive skills and subsequent one on one feedback is given. Rather they are quick refreshers designed to be viewed if a specific skill has not been practiced in a while. 
Posted by aj I am currently looking for a 2nd user machine. A couple of the main factors I will be considering is ease of programming and low false fails...»» Posted by Peter I would like to ask for opinion on an epoxy application. We apply RTV to bond and secure 2 electronic devices on a PCB. But after noticing the RTV bond... »» Posted by dbas Is anyone using a laser to selectively solder components to a board? I'm just starting to research selective soldering methods for the company... »» 
Engineering Documentation Control / Product Configuration Management Seminar/Course | EC3 Corp Tue, December 11, 2007 | Courtyard by Marriott, Old Town, CA, USA Learn why EDC/CM is a strategic discipline. Set the stage for innovation. Leave with many ideas for real cost reduction. Find out where software systems are failing you... »» CONNECTIONS� Europe: Strategies for Digital Living Markets Conference | Parks Associates Tue, December 04, 2007 | The Adlon Kempinski, Berlin, Germany CONNECTIONS� Europe will host 300-350 managers and executives from a broad assortment of companies marketing digital products and services in Europe... »» Trade Show/Exhibition | Reed Exhibitions Japan Ltd. Wed, January 16, 2008 | Tokyo Big Sight, Tokyo, Japan Exhibition Featuring all Lines of Test, Inspection and Measurement Systems for SMT, IC Packaging and Board Manufacturing... »» 
SMT Manufacturing Engineer/Technician Akron, OH, USA Responsible for the operation and process design of a SMT manufacturing line. Utilizes experience and engineering concepts...»» Project Manager Rapid Bare Boards Indianapolis, IN, USA This position plans and coordinates quoting, ordering, and manufacturing activities of designated projects to ensure that goals and objectives...»» Hitachi High Technologies America, Inc. Dallas, TX, USA Develop and maintain relationships with existing accounts that are of significant, strategic importance to the company...»» 
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