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01005 Assembly, the AOI route to optimizing yield

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01005 Assembly, the AOI route to optimizing yield.

The increasing demand for smaller & smaller portable electrical devices is leading to the increasing usage of extremely small components in the SMT assembly lines.

With the introduction of 01005 packages in mass production, all the different stages of the line are facing new challenges: from board design, through component placement to reflow process. Each stage introduces some specific types of defect which are considered impossible to repair due to the small size of the package. AOI has become an essential tool to enable good yield in the assembly of 01005.

Credit / Source: Cathy Combet, Ming-Ming Chang / Vi Technology

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IPC-A-610D Acceptability of Electronic Assemblies

Seminar/Course | Precision PCB Services, Inc.

Mon, July 20, 2009 | Oroville, CA, USA

This latest version D of the IPC-A-610 presented in a one day class is a MUST for all quality assurance and assembly departments. Topics include lead free, component orientation and soldering criteria for through-hole... »»

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Mon, July 20, 2009 | Building 31 Conference Room, Beaverton, OR, USA

The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products... »»

Six Sigma Green Belt Training - Measuring for Performance

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Wed, July 29, 2009 |Online

Improve your business processes and increase your sales using our in-house Six Sigma training! Six Sigma training can help you alleviate the constant pressure to solve problems and make decisions... »»

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July 16, 2009

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