Evolution from cell phones with only a base-band processor and limited memory to today's high-end phones with an additional applications processor and memory has driven the industry to 3-D packaging solutions.
3-D packaging can be achieved via die stacking in one package, package-in-a-package stacking or package on package stacking. Each method has its pros and cons. Package on package stacking, which has been researched in a variety of formats, enables stacking of packages from different suppliers and mixed IC technologies. It also allows for burn-in-testing prior to stacking.
Tin plated, for epoxy use. Can be used for both tin/lead and RoHS compliant. QTY 1.
The base metal is 1 oz copper with chemical etchant which allows for high bond strength to the PCB which will be repaired. The metallization on the PCB side is a bright immersion tin coating. It has a shelf life 6 months minimum and is date-coded on the circuit frame to which it is bonded.
I'm looking for detailed information about the different composition of circuit board pads. We have been experiencing some issues with our solder, and I would like to know the differences between compositions... »»
I have seen an increase in components with contaminated leads, mostly SMT parts. They give us solder wetting problems and insufficient solder joints. Our practice is to not use them and return them to the manufacturer... »»
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A two day exhibition of industry's leading supplier of equipment, materials, and services. The industry's world class technical conference offering 130 technical papers, 20 short courses, and four focused symposiums ... »»
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA Certification | Bookstore