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The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

First published in the 2012 IPC APEX EXPO technical conference proceedings.

by: Julie Silk, Jianbiao Pan, Mike Powers; Agilent

In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages - QFN and an Agilent package called TOPS - on PCBs with a Ni/Au surface finish. Samples were isothermally aged at the equivalent of 0, 2, 7 and 14 years service life. Representative solder joints were cross-sectioned and analyzed using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX) in order to investigate the evolution of the solder joint morphology as a function of Au content and isothermal aging. IMC thickness was measured...

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