The electronics industry is further progressing in terms of smaller, faster, smarter and more efficient electronic devices. This continuous evolving environment caused the development on various electrolytic copper processes for different applications over the past several decades. (...) This paper describes the reasons for development and a roadmap of dimensions for copper filled through holes, microvias and other copper plated structures on PCBs.
This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster, smaller and higher performance communication and electronic devices, build-up technology incorporating microvias has emerged as a viable multilayer printed circuit manufacturing technology. Increased wiring density, ...
The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important technology in the fabrication of PCBs and semiconductors. Aqueous sulfuric acid baths are explored for filling or building up with copper structures like blind micro vias (BMV), trenches, through holes (TH), and ...
Copper-filled micro-vias are a key technology in high density interconnect (HDI) designs that have enabled increasing miniaturization and densification of printed circuit boards for the next generation of electronic products. Compared with standard plated through holes (PTHs) copper filled vias provide greater design flexibility, improved signal performance, and can ...
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper. The resultant paste is injected or fills a via. The via is subsequently sintered by means of photonic sintering, or by heat in a reducing environment. The process will be accomplished in under an hour and results ...
Hotbar Soldering Troubleshooting -- I have a few questions about hotbar soldering. What factors in hotbar soldering would lead to increased solder balls in an application where an FPC is soldered to a rigid PCBA? The FPC is an open window type, with unsupported leads. We have the same P/N being provided by 2 suppliers and are experiencing more solder balls on parts from one supplier than the other. These manifest only during the hotbar process. The only difference I can see so far is that the ones experiencing the issue have less solder deposited on them, but the solder volume is consistent from lot to lot, where the incidence of solder balls is not. Thoughts on how to address? Are there hotbar process troubleshooting guides to address this kind of topic? I could not locate any. Thanks.
Re-Calibration and Certificate on SMT Oven -- We, in Santa Ana Ca, USA need a person or company in local to do Annual Re-Calibration with Certificate on our SMT oven. Send me an email. Thanks.
Supply Chain Crisis: When will the Chip Shortage End? What is the solution? Supply Chain issues are prevalent, causing a supply crunch and resulting in cut production, delinquent delivery shortages, and loss of profit. Then there is offshore manufacturing, which ....
XDry Corp. today announced an exclusive distribution agreement with Bentec Ltd. Under the agreement, David Bennett and the team at Bentec will represent XDry humidity-controlled storage cabinets throughout Europe....
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SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.