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SMTnet Express, November 17, 2022, Subscribers: 24,912, Companies: 11,656, Users: 27,563

█  Electronics Manufacturing Technical Articles

Investigating the Metric 0201 Assembly Process

The advance in technology and its relentless development is delivering yet another surface mount assembly challenge. To meet the market demand for products with higher functionality whilst reducing the overall product size, the next generation of chip package is being readied upon the surface mount community. The Metric 0201 will have dimensions in the order of 0.25mm x 0.125mm, as a result the entire assembly process will be questioned as to its ability to deliver high volume/quality product.

Credit: ASM Assembly Systems (DEK)

Solving Surface-Mount Assembly Challenges Presented by 0201mm Components

The global electronics industry's ability to deliver seemingly limitless ongoing advancements in product capabilities has encouraged an insatiable consumer demand for more, better, and smaller. Demands for high functionality of mobile devices, smart watches, military, medical, audio, and wearable technology continue to drive requirements for miniaturisation.

Credits: Yamaha Motor IM America, Inc.

Stencil Printing 008004/0201 Aperture Components

This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.

Credit: ITW EAE

Tombstoning Of 0402 And 0201 Components: "A Study Examining The Effects Of Various Process And Design Parameters On Ultra-Small Passive Devices"

The long-standing trend in the electronics industry has been the miniaturization of electronic components. It is projected that this trend will continue as Original Equipment Manufacturers (OEMs) and Electronic Manufacturing Service (EMS) providers strive to reduce "real estate" on printed circuit boards. Typically, the miniaturization of components can be achieved by integration or size reduction. At present, size reduction is considered to be more cost effective and flexible than integration. Passive components, which are used in limiting current, terminating transmission lines and de-coupling switching noise, are the primary focus in size reduction due to their variety of uses.

Credit: Plexus Corporation

An Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios

These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge.

This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.

Credit: FCT ASSEMBLY, INC.

0201 and 01005 Adoption in Industry

First introduced in the year 2000, the 0201 package was sold in significant numbers in the electronics industry by 2003. According to some estimates, it currently accounts for approximately 20% of surface mounted component (SMC) demand worldwide1. This pu

Credit: DfR Solutions

SEE Forum results for related keywords - 0201 - 601

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█  Printed Circuit Board Assembly & PCB Design Forum

Protecting PCB, multiplexers and MCU in vending machines -- Hello everyone, I am working on a very low cost, small and basic vending machine ($300) with wooden cabinet for small neighborhood stores. As you may know, it is necessary to properly protect the components to prevent users from trying to steal money or damage the components. The PCB has a TFT display and several shift registers to communicate the ESP32 with the buttons, coin acceptor, bill acceptor, hopper sensor, etc. It's common for people to try to give any of these components a small electrical shock, and multiplexers are the most vulnerable. That is not my only problem, since the +5VDC and +12VDC power supply is not of very good quality, so I also need to protect/stabilize a bit the current that it supplies to the ESP32 and other components. So I'm looking for what low cost components I should use to protect everything or at least the essentials. For now it has only occurred to me to add some TVS diodes, electrolytic capacitors, some SMD capacitors and to protect against electrical shocks I don't know if I should implement a current limiter or Low-Dropout Linear Regulator or zener diode or some other component. I would greatly appreciate your suggestions. That is not my only problem, since the +5VDC and +12VDC power supply is not of very good quality, so I also need to protect/stabilize a bit the current that it supplies to the ESP32 and other components. So I'm looking for what low cost components I should use to protect everything or at least the essentials. For now it has only occurred to me to add some electrolytic capacitors, some SMD capacitors and to protect against electrical shocks I don't know if I should implement a current limiter or Low-Dropout Linear Regulator or zener diode or some other component. I would greatly appreciate your suggestions. Regards.

Views: 1146

juki smt machine 2060 error E611030 -- Error about 'nozzles cannot be returned' why is this happening in middle of a run...? What can we do to resolve this

Views: 1883

Inline Press-Fit machine -- My company would like to invest and SMT Line boards. Boards are simple for P&P machines, couple of 603 and 402 components which most of machines are capable to place. Challenging part is Pin-in-Paste terminals. Those terminals produce with metal strip tapes, which need to be cut from tape and insert after. 30N force is required to insert components. Yearly terminal quantity is around 180M. Any idea for this kind line configuration?

Views: 298

SEARCH the PCB Assembly Forum VISIT the PCB Assembly Forum...


█  SMT, PCB Electronics Assembly Manufacturing News

Registration Open for the 2023 WHMA 30th Annual Wire Harness Conference

Registration is now open for the 2023 WHMA 30th Annual Wire Harness Conference, the industry's only annual global leadership conference for the wire harness manufacturing industry. Geared to wire harness manufacturers, their suppliers and customers, the event will take place in person, February 14-16, 2023, in Albuquerque, New Mexico at the Sandia Resort and Casino....

Association Connecting Electronics Industries (IPC)

Weller's Wxsmart Smart Soldering Platform Connects the Future of Soldering

Weller Tools today introduced its new smart soldering platform WXsmart. The platform consists of a 2-channel soldering station and a hot air module with an air and vacuum requirements, from pico to micro and ultra soldering are part of this platform. A calibration unit as well as a soldering tip holder make it a complete platform with which managing your complete soldering process, from tip to station, has never been easier and more productive with the first all-in-one WXsmart hand soldering platform....

Weller/Apex Tool Group

Weller - New Smart Soldering Platform

CalcuQuote Integrates with EVE GmbH

CalcuQuote is pleased to announce an integration with EVE GmbH, a trusted source for electronic components and cable manufacturing....

CalcuQuote

CalcuQuote Integrates with EVE GmbH a source for electronic components

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█  SMT / PCB Products & Services

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█  Electronics Manufacturing & Assembly Events Calendar

EVENTS

San Diego Expo & Tech Forum | November 17

SMTA

Pan Pacific Microelectronics Symposium | January 30 to February 2

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█  Electronics Manufacturing Training Courses & PCB Assembly Training

FIND TRAINING FOR:

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Online Training

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Nov. 21 to Nov. 22, 2022

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Live Online Training - IPC/WHMA-A-620 Expert (CSE) Certification Training Course

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█  Electronics Manufacturing & PCB Assembly Jobs

CAREER CENTER - Job Needs & Wants

JOBS - POST your job openings now

sales representative & distributor

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Posiition: Quality Control

Currrent Location: Jamui, India

Summary of Qualifications: Rank 1st Diploma Of Engineering In Electronics Engineering In 2022. In-plant training at Patna.

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█  PCB Design & Assembly Industry Associations

SMTA Logo

Surface Mount Technology Association (SMTA)

SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore | Upcoming Events

IPC Logo

Association Connecting Electronics Industries (IPC)

IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

Membership Info | Training & Certification | Online Store | Upcoming Events

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