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SMTnet Express, November 24, 2022, Subscribers: 24,902, Companies: 11,662, Users: 27,575

█  Electronics Manufacturing Technical Articles

Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for SnAgCu Soldered Joints

The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.

Credit: Flex (Flextronics International)

Lead-free SMT Soldering Defects How to Prevent Them

Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003.

Credit: Kester

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...

Credit: Agilent Technologies, Inc.

Effects of PCB Substrate Surface Finish and Flux on Solderability of Lead-Free SAC305 Alloy

The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 _C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.

Credit: Foundry Research Institute

Study of the Rheological Behaviors of Solder Pastes

Solder paste is a homogeneous, stable suspension of solder powder particles suspended in a flux binder, and is one of the most important process materials today in surface mount technology (SMT). By varying the solder particle size, distribution and shape, as well as the other constituent materials, the rheology and printing performance of solder pastes can be controlled. Paste flow behavior is very important in defining the printing performance of any paste.

The purpose of this paper is to study the rheological behavior of SAC (Sn-Ag-Cu) solder paste used for surface mount applications in the electronic industry. The reason why the rheological tests are presented in this paper are two critical sub-processes: aperture filling and paste withdraw. In this paper, we report on the investigation of the rheological profiles, the serrated cone-to-plate system was found as effective in parameter minimizing the wall-slip effect

Credit: Technical University of Kosice

SEE Forum results for related keywords - sac -- 670

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█  Printed Circuit Board Assembly & PCB Design Forum

Removing soldermask from populated boards (PCBAs) -- Hello friends! Is there a method to remove cured soldermask? Area is localized, intent is to solder SMDs parts. Boards are populated. Typically, we use an exacto knife with some risk of course but these boards are pricy and it's alot that needs to be reworked not just a few.

Views: 1421

SRT Rework Machine Repairs -- We have some no longer supported SRT rework machines. Does anyone know 3rd parties that repair these machines?

Views: 3294

Gold Plating of Berylium Copper -- Has anyone brush plated beryllium copper for electronics? Did you use a nickle layer first? Thanks!

Views: 32

SEARCH the PCB Assembly Forum VISIT the PCB Assembly Forum...

█  SMT, PCB Electronics Assembly Manufacturing Industry News

ITW EAE Introduces Auto Exit Wing Feature for Electrovert® Wave Soldering Machines

ITW EAE is releasing a new feature for the Electrovert® Wave Soldering machines that provides automatic adjustment of the laminar wave flow to match the board velocity. To fully optimize the flow dynamics of the laminar wave, the velocity of the PCB needs to equal the flow of the solder over the weir of the exit wing. When the wave flow is fully optimized, the PCB 'peels' away from the solder which minimizes the opportunity for bridging defects to occur....

ITW EAE

ITW EAE - Auto Exit Wing on Electrovert® Wave Machines

What are the operating steps of the Full-auto SMT Stencil Printer in SMT Production Line?

Full-auto SMT Stencil Printer is indispensable equipment in SMT production Line. It is generally composed of board mounting, solder paste, imprinting, and circuit board transfer. Widely used are Full-auto SMT Stencil Printer and semi-auto SMT Stencil Printer These two types, next, let's share with you the operating instructions of Full-auto SMT Stencil Printer....

Dongguan Intercontinental Technology Co., Ltd.

I.T.C - Full-auto SMT Stencil Printer

WHMA/IPC Issues Call for Participation for Electrical Wire Processing Technology Expo 2023

Deadline for proposals: December 5, 2022...

Association Connecting Electronics Industries (IPC)

IPC - WHMA/IPC Issues Call for Participation

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█  PCB Design & Assembly Industry Associations

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Surface Mount Technology Association (SMTA)

SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore | Upcoming Events
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Association Connecting Electronics Industries (IPC)

IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

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