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█  Electronics Manufacturing Technical Articles

Effect of Multiple Reflow Cycles on Intermetallic Compound Creation

This paper deals with the effect of the solder profile and multiple reflow cycles on intermetallic compound (IMC) creation. Soldered joints between PCB and 1206 size chip resistors were made from SAC 305 or SnBi solder alloy. Samples were reflowed one to six times with one of the two different soldering profiles for each soldering alloys. The thickness and composition of IMC layers were measured and observed with a scanning electron microscope. The growing of IMC layers thickness was observed. The results are presented depending on greater value of heating factor and number of reflow cycles. The shear forces for the components were measured and the fracture interfaces were inspected.

Credit: University of West Bohemia

Intermetallic Growth in Tin-Rich Solders

For tin-rich solder alloys, 200°C (392°F) is an extreme temperature. Intermetallic growth in tin-copper systems is known to occur and is believed to bear a direct relationship to failure mechanisms. This study of morphological changes with time at elevated temperatures was made to determine growth rates of tin-copper intermetallics. Preferred growth directions, rates of thickening, and notable changes in morphology were observed. Each of four tin-base alloys was flowed on copper and exposed to temperatures between 100°C and 200°C for time periods of up to 32 days. Metallographic sections were taken and the intermetallics were examined. Intermetallic layer thickening is characterized by several distinct stages. The initial growth of side plates is extremely rapid and exaggerated. This is followed by retrogression (spheroidization) of the elongated peaks and by general thick-

Credit: General Electric

Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu

As reliability requirements increase, especially for defense and aerospace applications, the need to characterize components used in electronic assembly also increases. OEM and EMS companies look to perform characterizations as early as possible in the process to be able to limit quality related issues and improve both assembly yields and ultimate device reliability. In terms of BGA devices, higher stress conditions, RoHS compatible materials and increased package densities tend to cause premature failures in intermetallic layers. Therefore it is necessary to have a quantitative and qualitative test methodology to address these interfaces.

Credit: Universal Instruments Corporation

Effect of Cooling Rate on the Intermetallic Layer in Solder Joints

While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two different crystal forms over the temperature range to which electronics circuitry is exposed during assembly and service, it has only recently been recognized that the change from one form to the other has implications for solder joint reliability. (..) In this paper the authors report a study of the effect of cooling rates on Cu6Sn5 crystals. Cooling rates from 200°C ranged from 10°C/minute to 100°C/minute and the effect of isothermal ageing at intermediate temperatures was also studied. The extent of the phase transformation after each regime was determined using synchrotron X-ray diffraction. The findings have important implications for the manufacture of solder joints and their in-service performance... First published in the 2012 IPC APEX EXPO technical conference proceedings....

Credit: Nihon Superior Co., Ltd.

SEE Forum results for related keywords - intermetallic -- 408

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█  Printed Circuit Board Assembly & PCB Design Forum

Card board boxes in SMT -- It is often said to avoid card board material in SMT area due to dust, i.e. card board boxes etc. are dust generators. Except from house keeping, cosmetic and optical issues, what other concerns are there in SMT/Electronics manufacturing? Solder joint reliability? Are there "dust secured" card board material available?

Views: 684

SAKI AOI TEST ALGORITM -- Good afternoon everyone. Question to AOI Saki BF2 users: What algorithm do we use to check soldering around test pins or antennas? Thanks in advance.

Views: 221

Hanwhu 482 plus fail to run Visfame error. -- Has anyone every had Hanwhu 482 plus fail to run Visfame error. If so what did you do to resolve it?

Views: 1046

SEARCH the PCB Assembly Forum VISIT the PCB Assembly Forum...


█  SMT, PCB Electronics Assembly Manufacturing Industry News

Inline PCBA Brush Cleaning Machine HJS-7000

HJS -7000 series automatic PCBA cleaning machine; It is an online full-automatic cleaning machine for PCBA board, which is suitable for traditional board washing water without manual contact with cleaning agent. This equipment brushes all directions in multiple ways to let PCBA board meet cleaning requirements. It is suitable for cleaning the PCBA welding surface and will not wet the front/upside components....

HJS Automation International Limited

HJS Automation - PCBA Brush Cleaning Machine HJS-7000

Altus Reflects on its Success with ASSCON

As PCBAs become more complex to manufacture with miniaturised components and different parts being mounted to the board, the soldering process becomes more difficult with the risk of structural damage, voids and defects. To support its customers in the challenge Altus Group, partnered with ASSCON vapour phase soldering systems who have the most innovative solutions for the production process....

Altus Group

Altus - Partners with Asscon vapour phase soldering

North American PCB Industry Sales Up 9.0 Percent in October

IPC Releases PCB Industry Results for October 2022...

Association Connecting Electronics Industries (IPC)

IPC - NA PCB Industry Sales Up

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█  SMT / PCB Products & Services

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█  Electronic Equipment Mart

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█  Electronics Manufacturing & Assembly Events Calendar

EVENTS

Silicon Valley Expo & Tech Forum | December 8

SMTA

Pan Pacific Microelectronics Symposium | January 30 to February 2

SMTA

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█  Electronics Manufacturing Training Courses & PCB Assembly Training

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IPC Certification

Soldering & Rework

PCB Design

Electronics Assembly

Electronics Inspection

Online Training

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█  Electronics Manufacturing & PCB Assembly Jobs

CAREER CENTER - Job Needs & Wants

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POST your resume on SMTnet

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█  PCB Design & Assembly Industry Associations

SMTA Logo

Surface Mount Technology Association (SMTA)

SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore | Upcoming Events

IPC Logo

Association Connecting Electronics Industries (IPC)

IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

Membership Info | Training & Certification | Online Store | Upcoming Events

Editor - Dave "davef" Fish (submit your technical articles)

SMTnet.com, 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887.

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