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SMTnet Express, April 6, 2023, Subscribers: 24,655, Companies: 11,755, Users: 27,871

█ Electronics Manufacturing Technical Articles

Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components

Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages ...

Credits: Auburn University

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Credits: Heller Industries Inc.

Operation of a Vacuum Reflow Oven with Void Reduction Data

Credits: BTU International

Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers.

Credit: Heller Industries Inc.

The Effect Of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.

Credit: Nokia Bell Labs

SEE Forum results for related keywords - vacuum reflow -- 135

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█ Printed Circuit Board Assembly & PCB Design Forum

zevatech 570 Driver Error KNOCK position E7018 -- Hello, I'm looking for zevatech (juki) 570 owner that could help me to resolve my problem. I had the following error that occure just before (or sometime a few after) homing the machine : "E7018:Driver Error KNOCK position error <10>". Previsously I had another "non-blocking" problem : "Z axis Driver error" when changing nozzle, that seems to cause a little shock on the head and that perhaps can cause a damage and the knock position error? If someone could send me an error code list, it could help too. Hubert

In-Line x-Ray suggestions -- We are looking for an inline x-ray machine that to put after AOI in our line. We have contacted with some suppliers, but onli reliable one looks like Viscom right now. Do any of you guys ever use this kind of inline machine? What are pros and cons?

SEARCH the PCB Assembly Forum VISIT the PCB Assembly Forum...

█ SMT, PCB Electronics Assembly Manufacturing Industry News

New Guide 'How to use a digital microscope for soldering and PCB inspection'

TAGARNO has developed a new 'how to' guide for implementing digital microscopes for soldering and PCB inspection. Magnification has been an integrated and crucial part of PCB production and rework for many years, and digital microscopes have taken PCB inspection to the next level....

Tagarno

Tagarno - Inspection 'How to' guide

Heller Industries Opens New Office and Demo Center in Taoyuan, Taiwan

Taoyuan, Taiwan (February 27, 2023) — Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region....

Heller Industries Inc.

Heller Industries Opens Office in Taoyuan, Taiwan

Global Banking Crisis Signals Economic Volatility, Signs of Recession

IPC Issues March Economic Outlook Report...

Association Connecting Electronics Industries (IPC)

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█ SMT / PCB Products & Services

NEW SMT / PCB EQUIPMENT & SERVICES - For Sale

PCB INSPECTION

MS-11 High Speed In-Line SPI System

Mirtec

PCB SOFTWARE

CELLS - MES & Tracking Software

Unisoft

PCB ASSEMBLY

PCB Fab & Assembly

Imagineering

PCB REFLOW OVEN

1910 MK5 Dual Lane, Dual Temperature Reflow Oven

Heller

PCB DISPENSING

DS Series Dispensers for Large Boards

GPD Global

Selective Soldering

Selective Wave Soldering Machine I.C.T-SS550

I.C.T

SELECTIVE SOLDERING

Pillarhouse Jade Handex

Pillarhouse USA

VIEW More New Electronic Manufacturing Products...

█ SMT / PCB Assembly Equipment Auctions

AUCTION | Senneheiser - Complete Closure of Audio Device Manufacturing — SMT Facility

AUCTIONEER | The Branford Group

TYPE | Online Auction

SCHEDULE | Mon, April 10 - Wed, April 12, 2023

FEATURING | Panasonic CM602 Placement Machines & 500+ Feeders! ESD Work Benches, Mantis Scopes, Test & Measurement Complete Toolroom, Warehouse, Quality Control and More

█ Electronic Equipment Mart

MART - Used Electronic Assembly Machines For Sale

P&P / Feeders

Assembleon AX201

KD Electronics - Assembleon AX201

KD Electronics

AOI INSPECTION

Viscom S3088 Ultra Chrome 3D AOI

Lewis & Clark Viscom S3088 AOI

Lewis & Clark

Pick and Place/Feeders

Mydata MY100LXe-10

Baja Bid

PCB PRINTING

DEK NEOHORIZON 03iX

SMTUnion - DEK NEOHORIZON 03iX

SMTUnion

Gen'l Purpose T&M

Zeiss LSM-880 Laser Scanning Microscope

World Equipment Source, LLC

P&P / FEEDERS

Panasonic NPM-W P&P

AllSurplus Panasonic NPM-W P&P

AllSurplus

VIEW More Used Equipment For Sale... SEND a RFQ to Equipment Suppliers ....

MART - Used PCB Assembly Equipment Wanted To Buy

WIRE STRIPPERS

Autosplice SAS/2

Baja Bid - Autosplice SAS/2

Baja Bid

P&P / FEEDERS

Assembleon MG-1R

World Equipment Source Assembleon MG-1R

World Equipment Source, LLC

PCB TEST

Agilent 3070

Lewis & Clark Agilent 3070

Lewis & Clark

PCB TEST

Agilent 3070

KD Electronics Agilent 3070

KD Electronics

SEE Buyers' Used Assembly Equipment Wants

█ Electronics Manufacturing & Assembly Events Calendar

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█ Electronics Manufacturing Training Courses & PCB Assembly Training

FIND TRAINING FOR:

IPC Certification

Soldering & Rework

PCB Design

Electronics Assembly

Electronics Inspection

Online Training