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SMTnet Express, May 4, 2023, Subscribers: 24,706, Companies: 11,774, Users: 27,931

█ Electronics Manufacturing Technical Articles

Stencil Printing 008004/0201 Aperture Components

This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.

Credit: ITW EAE

Tombstoning Of 0402 And 0201 Components: "A Study Examining The Effects Of Various Process And Design Parameters On Ultra-Small Passive Devices"

The long-standing trend in the electronics industry has been the miniaturization of electronic components. It is projected that this trend will continue as Original Equipment Manufacturers (OEMs) and Electronic Manufacturing Service (EMS) providers strive to reduce "real estate" on printed circuit boards. Typically, the miniaturization of components can be achieved by integration or size reduction. At present, size reduction is considered to be more cost effective and flexible than integration. Passive components, which are used in limiting current, terminating transmission lines and de-coupling switching noise, are the primary focus in size reduction due to their variety of uses.

Credit: Plexus Corporation

Solving Surface-Mount Assembly Challenges Presented by 0201mm Components

The global electronics industry's ability to deliver seemingly limitless ongoing advancements in product capabilities has encouraged an insatiable consumer demand for more, better, and smaller. Demands for high functionality of mobile devices, smart watches, military, medical, audio, and wearable technology continue to drive requirements for miniaturisation.

Credit: Yamaha Motor IM America, Inc.

RULES FOR WORKING WITH 0201s AND OTHER SMALL PARTS

Surface-mount PCB components are smaller than their lead-based counterparts and provide a radically higher component density. They are available in a variety of shapes and sizes designated by a series of standardized codes curated by the electronics industry. Of these PCB components, the 0201-sized are the smallest, measuring 0.024 x 0.012 in. (0.6 x 0.3 mm) — that's 70% smaller than the previous 0402 level! The 0201 components are designed to improve reliability in space-constrained applications such as portable electronics like smartphones, tablets, robotics and digital cameras, but require delicate handling during the assembly process. Given the miniaturized dimensions of an 0201 package, it is crucial that the mounting process abide by a series of guidelines regarding the design of the PCB mounting pads and solderable metallization, PCB circuit trace width, solder paste selection, package placement and overages, solder paste reflow, solder stencil screening, and final inspection. It's advisable that one review this information when procuring the services of a PCB assembler.

Credit: Advanced Assembly, LLC.

PCB Design Optimization of 0201 Packages for Assembly Processes

The demand for 0201 components in consumer products will increase sharply over the next few years due to the need for miniaturization. It is predicted that over 20 billion 0201 components will be used in more than one billion cell phones worldwide by the year 2003. Therefore, research and development on 0201 assembly is becoming a very hot topic. The first step to achieve a successful assembly process is to obtain a good PCB design for 0201 packages. This paper presents the data and criteria of PCB design for 0201 packages, including the pad design for 0201 components, and the minimum pad spacing or component clearance between 0201 components or between 0201 and other components. A systematic study on pad design and pad spacing was undertaken, using two test vehicles and three Design of Experiments (DOEs). In the first DOE, 2 out of 18 types of 0201 pad designs were selected based on process yield. The second DOE was focused on pad spacing, including 10mil, 8mil, 6mil and 4mil. The third experiment was final optimization, using two types of optimized pad designs with 10mil, 8mil and 6mil pad spacing. Through the above experiments, the design guideline for PCB layout for 0201 packages and the assembly process capability are identified.

Credit: Flextronics International

SEE Forum results for related keywords - 0201 -- 605

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█ Printed Circuit Board Assembly & PCB Design Forum

0201 printing -- Hello, who is printing 0201 apertures or smaller and can provide information on stencil design, stencil thickness and type of solder paste?

What maintenance application do you use? -- Hi, I am searching for a CMMS that will help me organize maintenance and calibration works. What do you use and what are your experiences? Some programs I saw out there are quite detailed and complex in some aspects of maintenance but lack some things I find essential or they get too detailed...

SEARCH the PCB Assembly Forum VISIT the PCB Assembly Forum...

█ SMT, PCB Electronics Assembly Manufacturing Industry News

North American EMS Industry Down 3.1 Percent in March

IPC releases EMS industry results for March 2023...

Association Connecting Electronics Industries (IPC)

IPC - North American EMS Sales Declined

Altus Help EMS to Increase its Production Capabilities with Innovative Solutions

To support its growing customer base leading CEM, Custom Interconnect Ltd. (CIL), required innovative equipment that could meet the exacting specifications required to produce complex and critical applications. Through Altus, CIL has the best-in-class equipment, including vapour phase soldering systems and component counter technology to manufacture highly complex PCBAs....

Altus Group

Altus - Helped EMS Increase Production

Robotic Soldering eBook from Bob Willis

The Robotic Soldering, Inspection & Defect Guide is the latest free process guide produced by Bob Willis...

ASKbobwillisDOTcom

Bob Willis - Robotic Soldering process guide

GET more Electronics Assembly Manufacturing News...

█ SMT / PCB Products & Services

NEW SMT / PCB EQUIPMENT & SERVICES - For Sale

PCB REFLOW OVEN

1910 MK5 Dual Lane, Dual Temperature Reflow Oven

Heller

PCB DISPENSING

MAX II (Heated) High Precision Dispensers

GPD Global

Selective Soldering

Selective Wave Soldering Machine I.C.T-SS550

I.C.T

SELECTIVE SOLDERING

Pillarhouse Jade Handex

Pillarhouse USA

PCB INSPECTION

MV-6e FIVE CAMERA In-Line AOI System

Mirtec

PCB SOFTWARE

ProntoGERBER CONNECTION

Unisoft

PCB ASSEMBLY

PCB Fab & Assembly

Imagineering

VIEW More New Electronic Manufacturing Products...

█ SMT / PCB Assembly Equipment Auctions

AUCTION | Benchmark Electronics - Advanced California EMS Facility Closure

AUCTIONEER | Baja Bid

TYPE | Online Auction

FEATURING | (5) SMT Lines - Universal & Hitachi Pick & Place DEK, Yestech, Heller & Vitronics Soltec Equipment Nitrogen Generators, Air Compressors & More!

SCHEDULE | Wed, May 3 to Wed, May 10, 2023

Opens: May 3 [9:00am PST]

Closes: May 10 [9:00am PST]

INSPECTION | Available by Appointment Only on Monday, May 8th from 9:00 AM to 4:00 PM (PST)

LOCATION | Moorpark, CA USA

█ Electronic Equipment Mart

MART - Used Electronic Assembly Machines For Sale

DEK NEOHORIZON 03iX

SMTUnion - DEK NEOHORIZON 03iX

SMTUnion

Gen'l Purpose T&M

Zeiss LSM-880 Laser Scanning Microscope

World Equipment Source, LLC

P&P / FEEDERS

Panasonic NPM-W P&P

AllSurplus Panasonic NPM-W P&P

AllSurplus

P&P / Feeders

Assembleon AX201

KD Electronics - Assembleon AX201

KD Electronics

AOI INSPECTION

Viscom S3088 Ultra Chrome 3D AOI

Lewis & Clark Viscom S3088 AOI

Lewis & Clark

VIEW More Used Equipment For Sale... SEND a RFQ to Equipment Suppliers ....

MART - Used PCB Assembly Equipment Wanted To Buy

WIRE STRIPPERS

Autosplice SAS/2

Baja Bid - Autosplice SAS/2

Baja Bid

P&P / FEEDERS

Assembleon MG-1R

World Equipment Source Assembleon MG-1R

World Equipment Source, LLC

PCB TEST

Agilent 3070

Lewis & Clark Agilent 3070

Lewis & Clark

PCB TEST

Agilent 3070

KD Electronics Agilent 3070

KD Electronics

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█ Electronics Manufacturing & Assembly Events Calendar

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█ Electronics Manufacturing Training Courses & PCB Assembly Training

FIND TRAINING FOR:

IPC Certification

Soldering & Rework

PCB Design

Electronics Assembly

Electronics Inspection

Online Training