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SMTnet Express, July 27, 2023, Subscribers: 24,953, Companies: 11,851, Users: 28,202

█  Electronics Manufacturing Technical Articles

Challenges for Step Stencils with Design Guidelines for Solder Paste Printing

The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: "faster and smaller" it is necessary to place components with different paste volume close together without regard to solder paste printing. In our days it is no longer possible to control the solder paste volume only by adjustment of the aperture dimensions. The requirements of solder paste volumes for specific components are realized by different thicknesses of metal sheets in one stencil with so called step stencils. The step-down stencil is required when it is desirable to print fine-pitch devices using a thinner stencil foil, but print other devices using a thicker stencil foil.

The paper presents the innovative technology of step-up and step-down stencils in a laser cutting and laser welding process. The step-up/step-down stencil is a special development for the adjustment of solder paste quantity, fulfilling the needs of placement and soldering. This includes the laser cutting and laser welding process as well as the resulting stencil characteristics and the potential of the printing process.

Credit: LaserJob

SMT Manufacturability and Reliability in PCB Cavities

First published in the 2012 IPC APEX EXPO technical conference proceedings. Considering technological advances in multi-depth cavities in the PCB manufacturing industry, various subtopics have materialized regarding the processing and application of such

Credit: AT&S

Printing of Solder Paste - A Quality Assurance Methodology

Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix between large modules and small chip components on large and densely populated printed circuit boards. Having a process for quality assurance of the solder paste print is fast becoming a necessity.

This article describes a method to ensure quality secured data from both solder paste printers and inspection machines in electronic assembly manufacturing. This information should be used as feedback in order to improve the solder paste printing process.

Credit: Ericsson AB

Step Stencil design when 01005 and 0.3mm pitch uBGA's coexist with RF Shields

Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.

Credit: Photo Stencil LLC

Solder Paste Deposition Project Report

INTRODUCTION: • The mixed technology on a PCB is creating unique challenges for board assemblers. Solder paste volume requirement for castle like component and miniature components vary widely. Approaches to solve these problems are: • Dual print • Printing/dispensing • Overprinting • Hybrid approach • Step stencil

Credit: iNEMI (International Electronics Manufacturing Initiative)

A Study of the Aperture Filling Process in Solder Paste Stencil Printing

Stencil printing has been the dominant method of solder deposition in surface mount assembly. With the development of advanced packaging technologies such as ball grid array (BGA) and flip chip on board (FCOB), stencil printing will continue to play an important role. However, the stencil printing process is not completely understood because 52–71 percent of fine and ultra-fine pitch surface mount assembly defects are printing process related (Clouthier, 1999). This paper proposes an analytical model of the solder paste deposition process during stencil printing. The model derives the relationship between the transfer ratio and the area ratio. The area ratio is recommended as a main indicator for determining the maximum stencil thickness. This model explains two experimental phenomena. One is that increasing stencil thickness does not necessarily lead to thicker deposits. The other is that perpendicular apertures print thicker than parallel apertures.

Credit: Lehigh University

SEE Forum results for related keywords - "step stencil" (336)

LEARN MORE in the Technical Library...

In the past year, the number of technical papers that contributors added to the Technical Library was: 152

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█  Printed Circuit Board Assembly & PCB Design Forum

Using AMRs in Production -- I'm curious who may be currently using Automated Mobile Robots (AMRs) or Automated Guided Vehicles (AGVs) in production. I've seen a few companies using them to transport SMT parts from the warehouse to the SMT Line. I'm wondering what others are doing. Anyone care to share? Thanks!

Views: 645

Glass BGA -- Glass Micro BGA- I consistently have chips or micro cracks from the manufacture and some happen during install, what functionality risk do these pose to the product? They pass test... I cannot find an established criteria for this type of component

Views: 1331

SEARCH the PCB Assembly Forum

In the past year, the number of threads opened on the FORUM seeking your help was: 287

CONTRIBUTE to the Assembly Forum...



█  SMT, PCB Electronics Assembly Manufacturing Industry News

Precautions for the use of automatic solder paste printing machine by the KINGSUN technical team

If need more technical support , pls contact with us at Jenny@ksunsmt.com...

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

picture of printer machine

Denmark Partner Delivered Semi-auto SMT LED Production Line

Exceptional Semi-Auto SMT LED Production Line Delivered by Denmark Partner. Witness the power of advanced technology and expertise as our Denmark partner brings you a seamless, high-performing production line. Elevate your LED manufacturing capabilities, optimize efficiency, and stay ahead in the industry with our top-notch solutions today...

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

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Winners of IPC Masters Competition China 2023 Announced

IPC China Skills Competition has been upgraded to IPC Masters Competition China 2023. The competition was co-organized with Pudong New Area Association for Quality and Technology Shanghai and held July 11-13 in Shanghai....

Association Connecting Electronics Industries (IPC)

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█  SMT / PCB Products & Services

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Software

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PCB ASSEMBLY

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PCB DISPENSING

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Heller - Choose an Oven For Your Reflow Needs



█  SMT / PCB Assembly Equipment Auctions

AUCTION | Hutchinson Technology - TDK Leading Manufacturer of Precision Electromechanical Components Die Bonders, Microscopes, Lasers, Test & Measurement Multiple Pallet Lots of MRO Inv

AUCTIONEER | The Branford Group

TYPE | Online Auction

FEATURING | Hutchinson Technology - TDK Leading Manufacturer of Precision Electromechanical Components Die Bonders, Microscopes, Lasers, Test & Measurement Multiple Pallet Lots of MRO Inv

SCHEDULE | Tue, Jul 25 to Tue, Aug 1, 2023

AUCTION OPENS | Bidding Open Now

AUCTION ENDS | Thursday, August 1st 2023 at 10AM CT

CURRENCY | $ USD

EQUIPMENT LOCATION | 2 locations: Minnesota & Wisconsin USA

The Branford Group - Jul 25 to Aug 1, 2023 Auction

VISIT the Assembly Equipment Auctions Calendar...



█  Electronic Equipment Mart

MART - Used Electronic Assembly Machines For Sale

Soldering - Selective

ACE Kiss 103

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PCB PRINTING

 SMTUnion - DEK NEOHORIZON 03iX

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World Equipment Source - Chroma Table Top Single Site Test Handler Model 3111

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AllSurplus Panasonic NPM-W P&P

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KD Electronics - Assembleon AX201

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 Lewis & Clark Viscom S3088  AOI

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102 RFQs were forwarded to equipment suppliers in the past 365 days

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MART - Used PCB Assembly Equipment Wanted To Buy

PCB TEST

Lewis & Clark Agilent 3070

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PCB TEST

KD Electronics Agilent 3070

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Soldering - Reflow

Vitronics XPM 1240

Baja Bid

P&P / FEEDERS

World Equipment Source Assembleon MG-1R

World Equipment Source, LLC

SEE Buyers' Used Assembly Equipment Wants



█  Electronics Manufacturing & Assembly Events Calendar

EVENTS

Space Coast: Microscope Setups, Getting the Best Results From Your Equipment, a Panel Discussion | August 10 to 10

SMTA

Michigan Expo and Tech Forum | August 15

SMTA

SMTA Workforce Dev. Webinar: Effectiveness of Strain Gage Methodology for Durable Board Design | September 12 to 12

SMTA

ADD Your Electronics Manufacturing and Assembly Event Now ...



█  Electronics Manufacturing Training Courses & PCB Assembly Training

FIND TRAINING FOR:

IPC Certification

Soldering & Rework

PCB Design

Electronics Assembly

Electronics Inspection

Online Training

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EPTAC - 2023 IPC Certification Training Schedule

TRAINING - Electronics Manufacturing and PCB Assembly Training Courses

IDEA-STD-1010 Essentials Online Live Training Course

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EPTAC Corporation

Idea Counterfeit Component Workshop Online Live Training

Multiple dates and locations. Check the link for details

EPTAC Corporation

Component Identification Online Live Certification

Multiple dates and locations. Check the link for details

EPTAC Corporation

TRAINING - PCB Inspection Electronics Manufacturing Training Courses

IPC-A-640 Interactive PCB Inspection Lab (CIT or CIS Option)

Multiple dates and locations. Check the link for details

EPTAC Corporation

TRAINING - PCB Rework and Hand Soldering Training Courses

Customizable Basic Hand Soldering

Multiple dates and locations. Check the link for details

Blackfox Training Institute, LLC

TRAINING - Online Electronics Manufacturing and Assembly Training Courses

Reflow Soldering 101 Training Course

Surface Mount Technology Association (SMTA)

IPC/WHMA-A-620 Expert (CSE) Certification Training Course

EPTAC Corporation

Live Online Training - IPC/WHMA-A-620 Trainer (CIT) Challenge Test

ACI Technologies, Inc.

Live Online Training - IPC-A-610 Expert (CSE) Certification Training Course

ACI Technologies, Inc.

Live Online Training - IPC-A-610 (CIT)

ACI Technologies, Inc.

VISIT All Electronics Manufacturing Training Courses...



█  Electronics Manufacturing & PCB Assembly Jobs

CAREER CENTER - Job Needs & Wants

JOBS - POST your job openings now

Overseas SMT Engineer

All over the world, Alabama, USA

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

SMT Engineer, Marketing Representative, Sales Representative, Business Assistant

All over the world, California, USA

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Manufacturing Analyst/Cost Accountant

Williamsport, Pennsylvania, USA

Spartronics

Program Manager

Williamsport, Pennsylvania, USA

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Senior Quality Engineer

Williamsport, Pennsylvania, USA

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Product Engineer

Williamsport, Pennsylvania, USA

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Corporate Director of Quality

Williamsport, Pennsylvania, USA

Spartronics

Purchasing Specialist

Brooksville, Florida, USA

Spartronics

Business Development Manager- High Level Assembly- Remote

Plaistow, New Hampshire, USA

Spartronics

Process Engineer

Williamsport, Pennsylvania, USA

Spartronics

RESUMES - POST your resume now

Position: Manufacturing Process Technician

Job Category: Engineering Maintenance Production Technical Support

Current location: Shirdi, India

Willing to Relocate?: Yes

Summary of Qualifications: • Hands on experience in PLC based machine, DEK Printer Machine, Camlot Glue dot machine, Fuji NXT, SPI machine, reflow: Vitronics XPM2/3, • Expertise in SMT Profiling Qualification & NPI Build, • Soldering defects, Analysis & rework. • Line modification & Assembly tool modification

FIND your next job now... FIND your next employee now...



█  PCB Design & Assembly Industry Associations

SMTA Logo

Surface Mount Technology Association (SMTA)

SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore | Upcoming Events

IPC Logo

Association Connecting Electronics Industries (IPC)

IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

Membership Info | Training & Certification | Online Store | Upcoming Events

Editor - Dave "davef" Fish (submit your technical articles)

SMTnet.com, 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887.

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X-Tech Auctions – Contact Us

Solder Paste Dispensing: Dots, Lines, Complex Shapes, Micro Dispensing 01005

Sell your surplus machinery!!! We buy all types of Fabrication, CNC machines, and More. Contact Tom@ xtechauctions.com for more details.

HELLER - Choose an Oven for Your Reflow Needs

BlackFoxOnline IPC Training & Certification - Now open for limited in-person training

Unused Equipment? - let BajaBid turn your EXCESS ASSETS into cash!

MIRTEC MV 6 OMNI High-Speed / High-Performance 3D AOI MACHINE.

Software for PCB Manufacturing - Unisoft

EPTAC - 2023 IPC Certification Training Schedule

The Branford Group - Jul 25 to Aug 1, 2023 Auction

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