Express Newsletter

The SMTnet Express newsletter is sent weekly to over 25,000 subscribers.

SMTnet
»
Express Newsletter

SMTnet Express, January 4, 2024, Subscribers: 25,270, Companies: 11,980, Users: 28,604

█ Electronics Manufacturing Technical Articles

Effects of Reflow Profile and Thermal Conditioning on Intermetallic Compound Thickness for SnAgCu Soldered Joints

The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.

Credit: Flex (Flextronics International)

Lead-free SMT Soldering Defects How to Prevent Them

Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003.

Credit: Kester

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...

Credit: Agilent Technologies, Inc.

Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies

Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder paste, there is a high propensity for voiding due to the confined nature of the solder paste deposits under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination as well as profile and board surface finishes.

Credit: Indium Corporation

Effects of PCB Substrate Surface Finish and Flux on Solderability of Lead-Free SAC305 Alloy

The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 °C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t0 and the contact angle h. The shortest wetting time was noted for the OSP finish (t0 = 0.6 s with EF2202 flux and t0 = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t0 = 1.36 s with EF2202 flux and t0 = 1.55 s with RF800 flux). The h values calculated from the wetting balance tests were as follows: the lowest h of 45_ was formed on HASL LF (EF2202 flux), the highest h of 63_ was noted on the OSP finish, while on the ENIG finish, it was 58_ (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.

Credit: Foundry Research Institute

RESULTS of Searches for related keywords - "sac" (679)

VIEW MORE PAPERS...

SUBMIT YOUR PAPER...

█ Printed Circuit Board Assembly & PCB Design Forum

Wrinkle solder ball on BGA PKG -- I have used LTS (Sn57.6%Bi0.4%Ag) solder balls for soldering on Ni/Au pads, and I have observed a wrinkle pattern on the ball surface. When you attempted soldering on CuOSP substrate pads under the same conditions, the surface appeared normal. Additionally, the CuOSP pads are about 30% larger than the Ni/Au pads. And target device needs Ni/Au pad. I googled and figured out a couple of reasons for the occurrence of wrinkle patterns 1. During the transition from liquid to solid state, solder shrinks. In addition, The temperature difference between the substrate pad and the ball surface can contribute to wrinkle patterns. 2. Issues with the activation of flux can also lead to wrinkle patterns. Regarding the first point, reducing the cooling slope seems to reduce wrinkle patterns. However, I discovered that Bismuth expands in the solid state more than liquid state, like water. Therefore, I don't believe shrinkage is the primary cause. Nevertheless, I'm still contemplating the impact of differences in substrate pad finish. For the second point, I've used a flux model previously employed with SAC305, setting the dwell at 150°C or higher and the peak at 180-190°C. Considering potential issues with flux activation, I'm contemplating raising the dwell to 160°C or 170°C in the reflow profile. Additionally, I'm searching for flux samples that activate at lower temperatures. Considering the above information, could you provide advice on the primary causes of the wrinkle pattern and suggest directions for further experiments?"

MyData 12 errorF-TLMN-18 -- When I try to install any tool on my MyData12 I get the following error message: F-TLMN-18 Failed to reach tool bank level How do I fix this error? It passes the Hardware Initialization test.

SEARCH THE FORUM

ADD YOUR THOUGHTS ...

█ SMT, PCB Electronics Assembly Manufacturing Industry News

Introducing Midwest Circuit and Soldering LLC: Premier PCB Rework & Circuit Repair in the Midwest! Specializing in Network Equipment, Game Consoles, BGA Rework, SMD Component Replacement Pinnacle Expertise in Advanced Circuit Board Repairs: With an extensive track record spanning over two decades, we have positioned ourselves as the foremost authority in the meticulous repair of premier brands, including Cisco, Aruba, HP, Dell, Juniper, Arista, and more. Our commitment to excellence is underscored by the refinement of our skills to perfection over the years. Rely on us for your board-level repairs and experience the unparalleled quality of our services. Midwest Circuit and Soldering LLC
Automated IC Programming: 11 Package Types Explore the versatility of Automated IC Programming Systems, decoding a myriad of package types for precise and efficient electronics manufacturing.... I.C.T ( Dongguan ICT Technology Co., Ltd. )
"R2-D2 Expert" and Former Principal Concept Technical Director for Walt Disney Imagineering, Paul Bailey, to Keynote IPC APEX EXPO 2024 Each year, IPC APEX EXPO features industry's most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2024 will feature Paul Bailey, mixed-media artist, technologist and vice president and general manager of AOA West, a design, production and project management company in Burbank, Calif.... Association Connecting Electronics Industries (IPC)

ADD YOUR NEWS...

█ SMT / PCB Products & Services

NEW SMT / PCB EQUIPMENT & SERVICES - For Sale

REFLOW OVEN

Voidless / Vacuum Reflow Soldering Oven

Heller

PCB DISPENSING

Island Series Table Top Dispensers

GPD Global

Printing

Full-auto SMT Stencil Printer I.C.T-P4034

Dongguan I.C.T

SELECTIVE SOLDERING

Pillarhouse Jade Handex

Pillarhouse USA

PCB INSPECTION

MS-11e High Speed In-Line SPI System

Mirtec

PCB SOFTWARE

ProntoVIEW-MARKUP Assembly Viewer...

Unisoft

PCB ASSEMBLY

PCB Fab & Assembly

Imagineering

VIEW MORE NEW PRODUCTS...

█ SMT / PCB Assembly Equipment Auctions

Currently, no featured auctions are on SMTnet

SEE MORE AUCTIONS...

█ Electronic Equipment Market

MARKET - Used Electronic Assembly Machines For Sale

P&P / FEEDERS

Assembleon Yamaha MG1R Pick and Place

World Equipment Source - Assembleon /Yamaha MG1Rl P&P

World Equipment Source, LLC

Adhesive Dispensers

Musashi FAD2500

KD Electronics Ltd.

AOI INSPECTION

Viscom S3088 Ultra Chrome 3D AOI

Lewis & Clark Viscom S3088 AOI

Lewis & Clark

Soldering - Selective

Juki Cube 460

Baja Bid

PCB PRINTING

DEK NEOHORIZON 03iX

SMTUnion - DEK NEOHORIZON 03iX

SMTUnion

MORE EQUIPMENT & PARTS...

SUBMIT YOUR RFQ ....

MARKET - Used PCB Assembly Equipment Wanted To Buy

WIRE STRIPPERS

Autosplice SAS/2

Baja Bid - Autosplice SAS/2

Baja Bid

P&P / FEEDERS

Assembleon MG-1R

World Equipment Source Assembleon MG-1R

World Equipment Source, LLC

PCB TEST

Agilent 3070

Lewis & Clark Agilent 3070

Lewis & Clark

PCB TEST

Agilent 3070

KD Electronics Agilent 3070

KD Electronics

SEE Buyers' Used Assembly Equipment Wants

█ Electronics Manufacturing & Assembly Events Calendar

EVENTS

Pan Pacific Strategic Electronics Symposium | January 29 to February 1, 2024

SMTA

Wafer-Level Packaging Symposium | February 14 to 16, 2024

SMTA

█ Electronics Manufacturing Training Courses & PCB Assembly Training

FIND TRAINING FOR:

IPC Certification

Soldering & Rework

PCB Design

Electronics Assembly

Electronics Inspection

Online Training

TRAINING - PCB Rework and Hand Soldering Training Courses

Customizable Basic Hand Soldering

Multiple dates and locations. Check the link for details

Blackfox Training Institute, LLC

TRAINING - Online Electronics Manufacturing and Assembly Training Courses

Reflow Soldering 101 Training Course

Surface Mount Technology Association (SMTA)

IPC/WHMA-A-620 Expert (CSE) Certification Training Course

EPTAC Corporation

IPC Certified Electronics Program Manager (CEPM) Training and Certification Program

Association Connecting Electronics Industries (IPC)

Component Placement 101 Training Course

Surface Mount Technology Association (SMTA)

ESD Control for Electronics Assembly

Association Connecting Electronics Industries (IPC)

MORE TRAINING COURSES...

█ Electronics Manufacturing & PCB Assembly Career Center

Job Needs & Wants

JOBS

YOUR job openings

Overseas SMT Engineer

All over the world, Alabama, USA

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

SMT Engineer, Marketing Representative, Sales Representative, Business Assistant

All over the world, California, USA

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

AOI Engineer

Hai Phong, Vietnam

Dongguan RuiHengHuaTai Electronic Co., Ltd

SMT Process Technician III

Racine, Wisconsin, USA

Cree Lighting

Experienced SAKI AOI programmer

All US, USA

AirDataIOT,LLC

Engineering Project Manager

Strongsville, Ohio, USA

Spartronics

Senior Quality Engineer

Williamsport, Pennsylvania, USA

Spartronics

Senior Systems Engineer

Strongsville, Ohio, USA

Spartronics

Procurement Specialist

Brooksville, Florida, USA

Spartronics

Buyer/Planner

Williamsport, Pennsylvania, USA

Spartronics

Corporate Director of Quality

Williamsport, Pennsylvania, USA

Spartronics

Automotive service Technician

Golden, CO, USA

Engage2excel

Program Manager

Williamsport, Pennsylvania, USA

Spartronics

RESUMES

YOUR resumes

POSITION: SMT Technician/ Engineer/ Management

JOB CATEGORY: Engineering Maintenance Management Production Technical Support

CURRENT LOCATION: Raymond, WA, USA

WILLING TO RELOCATE?: Not willing to relocate.

SUMMARY OF QUALIFICATIONS: Expert knowledge of circuit board manufacturing for the through-hole and Surface Mount Technology industry, international and national field work to manufacturers. Provided high value technical assistance and formal training to industry standards. Specialized in staff and department development.

YOUR next job ... YOUR next employee ...

█ PCB Design & Assembly Industry Associations

Surface Mount Technology Association (SMTA)

SMTA is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore | Upcoming Events

Association Connecting Electronics Industries (IPC)

IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

Membership Info | Training & Certification | Online Store | Upcoming Events

Editor - Dave "davef" Fish (submit your technical articles)

SMTnet.com, 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887.

FEATURED PARTNERS
⇩