High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,
Electronics Forum | Wed Sep 08 20:23:28 EDT 2004 | KEN
Philips Emerald & Emerald-X is specified at max 54mm device. However I have placed 58mm devices. These machines have published accuracies at 0.02mm. Have seen as low as 0.007mm.
Electronics Forum | Sat Nov 18 08:42:11 EST 2006 | davef
Bow & twist: IPC-A-600. Acceptability of Printed Boards 1.5%; Goal 0.005" per inch; Practicle 0.007" per inch
Used SMT Equipment | Adhesive Dispensers
NM-DC15 HDF big table HIGH-SPEED ADHESIVE DISPENSER A high-speed adhesive application machine with a screw-type application head ensures stable application at 0.07 sec/shot regardless of temperature, viscosity or the amount or remaining
Used SMT Equipment | Pick and Place/Feeders
Placement rateaIPC valueBenchmark valueTheoretical valuea) See page 7 for a definition of the output values13,000 comp./h15,000 comp./h20,000 comp./hComponent range 01005 - 200 x 125 mm²Placement accuracybAngular accuracyb) The accuracy value was mea
Industry News | 2016-05-16 20:59:04.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-07-02 06:40:16.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
The CoaxStrip 5300 RX allows you to quickly and accurately strip wires and cables that would be virtually impossible to strip by hand, with inner conductors ranging from 0.003'' / 0.07 mm (42 AWG) up to 0.080'' / 2 mm maximum cable outer diameter (O.
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/
0.015", all Plated holes, smallest trace/space 0.007", Green LPI Mask, White Top Silkscreen, Individual board with Single circuit design and No Multiple images of boards. File type: 274x required. No paint
ORION Industries | http://orionindustries.com/pdfs/thermal.pdf
Silicone/Fiberglass Silicone/Fiberglass Silicone/Film Silicone/Film Silicone/Film Silicone/ Aluminum Silicone/ Fiberglass Thermal Conductivity W/m-K 0.9 @ 0.007” thk 1.2 @ 0.009” thk 3.5 @ 0.015” thk 0.9 @ 0.006” thk 1.1 @ 0.006” thk 1.3 @ 0.006” thk 2.5 @ 0.006” thk 2.0 @ 0.005