New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
New Equipment | Curing Equipment
다이 어태치 및 언더필 가압 큐어링 오븐 가압 큐어링 오븐(PCO) 또는 오토클레이브는 일반적으로 다이 어태치 및 언더필 애플리케이션에서 사용되는 접착 공정에서 보이드를 최소화하고 접착강도를 증대시키기 위해 사용됩니다. PCO pressurizes air into a rigid vessel and heats & cools with forced convection. PCO는 견고한 용기에 공기를 가압해 강제된 대류와 함께 가열 &
Electronics Forum | Mon Aug 08 02:25:40 EDT 2005 | datasheet
http://www.datasheet.in Very Good Site.
Electronics Forum | Fri Jun 20 14:25:40 EDT 2008 | realchunks
Yes.
Used SMT Equipment | Screen Printers
Type A Screen frame size (X)650×(Y)550mm (T)25～40mm (X)750×(Y)650mm (X)29'×(Y)29' Accommodated PCB/substrate size Minimum(X)50×(Y)50mm (T)0.4～2.5mm Maximum(X)330×(Y)250mm Overall Size (D)1235×
Used SMT Equipment | Screen Printers
- Graphite Camera - Fixed board stop - No Under Stencil Cleaning
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Industry News | 2022-06-09 15:25:40.0
PROMATION is a proud distributor of Techman collaborative robots with integrated vision.
Parts & Supplies | Pick and Place/Feeders
YAMAHA KKE-M9127-00 YS24 BELT CONVEYOR KKE-M9127-00 BELT YS24 BELT CONVEYOR / YS24 1250MM BELT CONVEYOR L=1400MM KKE-M917H-00 BELT YS24 BELT CONVEYOR /YS24 1250MM BELT CONVEYOR L=662 KKE-M917H-50 BELT YS24 BELT CONVEYOR /YS24 BELT CONVEYOR
Parts & Supplies | Circuit Board Assembly Products
Juki E86077290C0 PCB BOARD Specs: original, new or old,high quality,best price. SUPPLY JUKI SMT MOUNTER PWB BOARD E86017290B0 SAFETY BOARD B ASM E86027290C0 SASE-FEEDER BOARD ASM E8603729AB0 LIGHT CTRL BOARD AB ASM E860
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
Career Center | Duarte, California USA | Production
This position requires someone who is able to work in a flexible atmosphere and who has the ability to work in a team environment. Good communcation skils, attention to details, mechanically inlclined, and good computer skills are essential. Respo
