Electronics Forum: 87/13 (1)

Re: Reflow soldering Texas Instruments components

Electronics Forum | Tue Dec 14 15:21:41 EST 1999 | BJL

This may be the nickle paladium lead material or an 87/13 tin lead plating on the leads. Paladium and 87/13 has a slower disolution rate and takes longer for solid joint to be created between two metal surfaces. Reflow temp must allow the joint to be

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