Industry Directory | Manufacturer
AIM is a leading global manufacturer of solder assembly materials for the electronics industry.
Industry Directory | Distributor / Manufacturer
eTECH Supply is a distribution company focused on the needs of Printed Circuit Board Assembly & Repair industry.
New Equipment | Solder Materials
AIM is a leading global manufacturer of tin-lead and lead-free solder paste and assembly materials for the electronics industry.
AIM Ultra Pure Bar Solder SN63/37 - 25 pack of 1lb bars AIM solders, AIM lead free bar solder, AIM no clean solder paste, AIM wire solder, AIM solder distributors Leading distributors of AIM solder products, including lead free bar solder, no-clean s
Electronics Forum | Thu May 25 16:12:13 EDT 2006 | steve_ucsd
I find it hard to believe that AIM never contacted you either by the rep or directly. I switched to AIM solder 4 years ago after using several of their competitor�s pastes for the very fact that the products were as good but Aim�s technical support w
Electronics Forum | Thu May 25 17:11:22 EDT 2006 | ratsalad
AIM contacted me the day after I posted this on SMTnet. I have still not heard anything back from my AIM rep.
Industry News | 2011-11-03 21:52:00.0
By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.
Industry News | 2003-05-29 08:30:31.0
Losses halved in the first half year � New organization of electronics group next on the agenda
Parts & Supplies | Pick and Place/Feeders
1 High Speed Mater KE-2050 Since 1993, it has been selling "KE series" products and has received high praise from customers at home and abroad for many years. The series of products are combined with a chip machine and a general purpose ma
Parts & Supplies | Pick and Place/Feeders
1 High Speed Mater KE-2050 Since 1993, it has been selling "KE series" products and has received high praise from customers at home and abroad for many years. The series of products are combined with a chip machine and a general purpose ma
Technical Library | 2022-06-20 21:01:37.0
We've been doing a lot of print testing in our lab. In our first set of published results, "The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance1" from IPC/APEX 2016, we revealed a hierarchy of input variables to maximize solder paste transfer efficiency and minimize variation. In that study, we used a fully-optioned stencil as part of the equipment set. In order to tease out the data we were looking for, we could not lose critical information to the noise of stencil-induced variations.
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
New features highlight the ability for the customer to control what Process features are available.
Demonstrates desoldering, solder paste printing, and installation of a fine pitch QFP 208 (30.6mm x 30.6mm) component using an ATCO model AT-GDP Placement & Rework Station.
Events Calendar | Thu Oct 28 00:00:00 EDT 2021 - Thu Oct 28 00:00:00 EDT 2021 | ,
Juarez Chapter Webinar: Pin in Paste
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Career Center | Rocklin, California USA | Production
General Overview of Position With this new position Parallax aims to improve our USA manufacturing throughput in a time when most companies normally only send work offshore. This raises the standard for requiring efficient use of our Pick and Place
Career Center | Duluth, Georgia USA | Management,Sales/Marketing
Over 20 years of experience selling high tech capital equipment for manufacturing. ��Accomplished in territory management, regional sales management, and key account management ��Proficient at managing several projects, coordinating engineering deve
Career Center | hyd, andhra pradesh India | Engineering,Production,Research and Development,Technical Support
i have a experience in smt and i acan operate europlacer and mydata machines.
| https://www.feedersupplier.com/sale-21039854-jig-chip-mounter-smt-machine-nozzle-fuji-aim-nxt-aa06a00.html
JIG Chip Mounter SMT Machine Nozzle FUJI AIM NXT AA06A00 Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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). The aim of the process is to form acceptable solder joints by first pre-heating the components/PCB/solder paste and then melting the solder without causing damage by overheating
