New Equipment | Board Handling - Storage
The F9001 quick adjust PCB Rack has been developed to provide a reasonably priced easy to adjust pcb carrier as an alternative to existing high priced products. The width of the rack can be quickly adjusted for different PCB sizes by unlocking the s
Electronics Forum | Wed May 27 08:55:53 EDT 2009 | milas
Hi Is there an alternative material to fibreglass that can be used for PCBS ? for a specific application I am looking for something that will absorb little or no moisture. Regards
Electronics Forum | Tue Apr 04 16:39:41 EDT 2000 | Kevin Facinelli
Does anyone have any good information on alternative solder paste materials like the Emerson and Cuming CE 3103. I would be interested in any information anyone may have on these new materials...... Thanks, Kevin
Industry News | 2011-08-30 19:41:37.0
The SMTA announced two sessions on Alternate Lead-Free Alloys featured during their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.
Industry News | 2011-03-31 11:42:53.0
According to 2009-2010 IPC Industry Analysis and Forecast for Flexible Circuits in North America, the sales of flexible circuits is forecasted to grow to $50.8 billion globally by 2012. In order to provide the industry with the latest information on this important market segment, IPC — Association Connecting Electronics Industries® will hold the IPC International Conference on Flexible Circuits, June 21-23, 2011, in Minneapolis, Minn.
Technical Library | 2020-02-26 23:24:02.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-inpackage (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
Technical Library | 2021-06-15 15:17:33.0
Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and system-in-package (SiP) adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a physical vapor deposition (PVD) process of sputtering, leveraging front-end packaging technologies to back-end packaging applications. However, sputtering technology challenges in scalability and cost along with advancements in dispensable materials are driving considerations for alternative dispensing techniques for EMI shielding.
A Sustainable Alternative - Humitector cards are halogen-free and cobalt dichloride free. Visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-humidity-indicator-card?utm_source=CLRYouTube&utm_medium=Vi
Novec Surface Modifiers protect your electronics components quickly economically and safely. Drying to a transparent layer of just 1 micron, Novec surface modifiers offer superb resistance to moisture, oils and other contaminants in a third of the ti
Alternative Pb-Free Alloys Alternative Pb-Free Alloys While SnAgCu (SAC) alloys still dominate Pb-free selection in North America, especially Sn3.0Ag0.5Cu (SAC305), there are alternative material systems available. Any OEM that is concerned about
| https://www.eptac.com/3d-electronics-as-an-alternative-to-printed-circuit-boards-pcbs/
3D Electronics as an Alternative to Printed Circuit Boards (PCBs) - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Imagineering, Inc. | https://www.pcbnet.com/blog/a-guide-to-design-for-manufacturing-dfm-principles/
. Material Engineers must select the materials they’ll use early in the design process, including their grade and form. They should consider a variety of properties, such as strength, thermal/electrical resistance, and machinability, to determine the best choice
