Industry Directory | Consultant / Service Provider / Manufacturer / Manufacturer's Representative / Other
Semiconductor and SMT equipments sales new and used. Includes FA lab equipment Test, FIB, SEM, EDX,, C-SAM, inspection and probers
Industry Directory | Research Institute / Laboratory / School
MUAnalysis is an independent lab for Component Failure Analysis and Reliability Testing in Ottawa, Ontario Canada. We also would be pleased to discuss your analysis needs. We also perform all non-destructive testing ...
Failure Analysis and general laboratory investigations of electronic components and devices, plus material analysis. Ideally suited for high precision scanning of high density devices.
Similar to D-9000, featuring a larger scanning area (24" x 24"). Ideally suited for large printed circuit boards and multiple tray analyses.
Electronics Forum | Tue Aug 16 07:51:16 EDT 2011 | a
C-SAM is a non-destructive alternative that a lot laboratories and chip manufacturers use. Dye and Pry would work I suppose although I have never done it in practice with PoP but it should be any different for PoP.
Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
Industry News | 2012-05-15 11:14:08.0
Tom O’Connor, DFR Solutions, will present a paper on the topic of counterfeit components.
Industry News | 2012-05-23 17:07:02.0
During this second meeting of 2012, Tom O’Connor, DFR Solutions, will present a paper on the topic of counterfeit components.
Technical Library | 2017-06-22 17:11:53.0
C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination, cracks, voids, and porosity. This paper presents evaluations performed on various advanced packages/assemblies especially flip-chip die version of ball grid array/column grid array (BGA/CGA) using C-SAM equipment. For comparison, representative x-ray images of the assemblies were also gathered to show key defect detection features of the two non-destructive techniques.
Technical Library | 2022-10-04 16:43:10.0
In this paper I will discuss the different methods and equipment used to detect counterfeit electronic parts, specifically integrated circuits as well as demonstrate some of the "red flags" that help to identify a part as being suspected counterfeit. We will begin with the initial receipt of the parts and the examination of the outer packaging, the basic visual inspection of the parts, the visual inspection and documentation at high magnification, permanency marking, blacktop test, scrape test, XRF (RoHS), decapsulation, X-ray, basic electrical testing, C-SAM, full function testing and limited function testing.
Sonix Acoustic Microscope C-SAM #3 UHR2001 Price: $4,500.00 Model Number : C-SAM #3 Serial Number : UHR2001 Manufacturer: Sonix Dimensions: 440x40x50 Condition: Used - Unit powers up and appears to be functional. - Possibly missing transduc
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Corpus Christ, Texas USA | Engineering,Quality Control
This position reports to the Quality Manager and provides support in all areas of fabrication and assembly of passive components exceeding customer requirements and expectations in a fast paced environment. Support is defined as but not limited to th
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
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