Industry Directory | Manufacturer
Quik-Tool designs and manufactures innovative automatic board supports for printers, placement sytems, etc.
Industry Directory | Manufacturer
Murata is a leading company involved in the manufacturing of ceramic electronic components with an overwhelming share worldwide in ceramic filters, high frequency parts, and sensors.
New Equipment | Fabrication Services
HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri
Heller 1707 MK7 SMT Reflow Oven 7 Heating ZonesMax PCB Width: 56cmWeight: 1450KGDimension: 360x152x144cmProduct description: Heller 1707 MK7 SMT Reflow Oven, 7 Heating Zones, Max PCB Width: 56cm, Weight: 1450KG, Dimension: 360x152x144cm Heller
Electronics Forum | Wed Sep 29 17:36:02 EDT 1999 | Earl Moon
We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control and
Electronics Forum | Thu Sep 30 11:23:41 EDT 1999 | Wolfgang Busko
| We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control an
Used SMT Equipment | Pick and Place/Feeders
Product number: YS40 Products in detail YSM40 characteristics Integrating "high-speed" and"flexibility" 100000 CPH (IPC9850) high-speedproductivity There are three mount head types to choosefrom Only 1 m wide, small body Wi
Used SMT Equipment | SMT Equipment
Product name: YSM40 high density modular chip mounter Product number: YS40 Products in detail YSM40 characteristics Integrating "high-speed" and "flexibility" 100000 CPH (IPC9850) high-speed productivity There are three mount head types to ch
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2003-04-28 07:47:37.0
DPAC exceeds requirements of Sarbanes-Oxley Act in independence and financial expertise for the DPAC Technologies Board
Parts & Supplies | Pick and Place/Feeders
Product number: RX - 7 Detailed product introduction Characteristic With high productivity, versatility, highquality new modular placement machine RX 7 listed Component placement speed (best conditions): 75000 CPH chip components Element size: 0
Parts & Supplies | Pick and Place/Feeders
To provide customers with new JUKI mounting machine and SMT mounting equipment, supply new JUKI mounting machine, Samsung mounting machine, Panasonic mounting machine, FUJI mounting machine, YAMAHA mounting machine, Siemens mounting machine, MYDATA m
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
PV inverters require reliability against ingress humidity and dust in harsh environments, like deserts. Conformal coating is critical to protect inverter PCBA. Shown with the SC-400. http://www.nordsonasymtek.com
QXJ-NC32 SMT pick and place nozzle cleaning machine In the field of the semiconductor industry today, with the development of SMT, small parts into small, high-density mounting and base for reality, and future development trends will be further co
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Events Calendar | Tue Jun 02 00:00:00 EDT 2020 - Thu Jun 04 00:00:00 EDT 2020 | Markham, Ontario Canada
International Conference for Electronics Hardware Enabling Technologies (ICEHET)
Career Center | Malibu, California USA | Management
Title: President / General Manager Location: Southern California Experience: P&L Technical degree Supervise: QA, Operations, engineering & marketing 10 years plus high-density electronic components Salary: $150K + Email resume to: tmyers@electronicc
Career Center | Beaverton, Oregon USA | Engineering
Operations Engineer � Beaverton, OR 11163 Cutting edge technology! Full-time, perm opportunity with our client for an Operations Engineer located in Beaverton, Oregon. Purpose: Responsible for supporting current production activities on printed
Career Center | Daviddav, India | Engineering,Maintenance,Production,Quality Control,Research and Development
Created and defined component landing patterns for high density layouts beyond the specifications of IPC standards and in compliance with RoHs. • Designing SMT stencils (Solder paste & Glue(Epoxy) stencils).
SMT Express, Volume 3, Issue No. 10 - from SMTnet.com Volume 3, Issue No. 10 Thursday, October 18, 2001 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: SMT High Density
SMTnet Express, March 12, 2015, Subscribers: 22,490, Members: Companies: 14,252 , Users: 37,867 Miniaturization with Help of Reduced Component to Component Spacing Jonas Sjoberg, Ranilo Aranda, David Geiger, Anwar Mohammed, Murad Kurwa
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/additional-product-sub-type/plural-component-systems?con=t&page=21
Plural Component Systems Industrial Coating Systems Corporate | Global Directory | Languages Division Only All of Nordson Application Solutions Powder Coating Liquid Painting Container Coating Sealant Adhesive Systems Automotive Assembly UV Curing Systems Industries Aerospace Agriculture
KingFei SMT Tech | http://www.smtspare-parts.com/sale-11789719-k9f4g08u0d-sib0-samsung-chip-component-assembled-smt-machine-parts.html
K9F4G08U0D-SIB0 Samsung Chip Component Assembled SMT Machine Parts Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
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