New Equipment | Rework & Repair Equipment
PDR E3M Rework System for Micro SMD Rework is made of only the finest materials and components for Micro- BGA Rework, 0201 Rework, CSP Rework, uBGA Rework, LED Rework, area Array Rework, and similar micro applications. Combining PDR's ThermoActive s
New Equipment | Rework & Repair Equipment
Ultimate Performance, BGA Rework Station for small-large PCBs up to 24"/620mm The PDR E6 XL BGA Rework Station is made of only the finest materials and components for optimum precision and rework excellence. PDR's E6 SMD Rework Station is PDR's larg
Industry News | 2003-03-27 08:15:33.0
Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Parts & Supplies | Pick and Place/Feeders
Starting in May 2008, ＪＵＫＩ Corporation (President Kazuyuki Nakamura; listed on First Section of the Tokyo Stock Exchange) is beginning worldwide sales of its High-speed Modular Mounter FX-3. The FX3 is an industrial robot for mounting electronic comp
Parts & Supplies | Pick and Place/Feeders
Which series nozzles could be used for Phlips Topaz and Emerald machine As we know, many parts are compatible for Yamaha and Philips machines, but some models their nozzles are not generic.So which series nozzles could be used for Phlips Topaz and
Technical Library | 2018-11-22 05:21:52.0
VDR (Voyage Data Recorder) is an instrument continuously recording real-time data of ship body, including speech communication signal of cockpit, sensors data, alarm status and radar images, etc.. So what's types of storage devices may meet VDR's requirement?
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the t
PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation
