SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Continued From Previous Page PRINTED CIRCUIT BOARD FABRICATION BASICS AN OUTLINE Earl Moon Proof Of Design (POD) 8. PLATING (AND
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sandwiches, consisting of an ENIG-plated FR4 substrate on either side with solder preform between. The solder alloys used were either 99.99In, 97In/3Ag, and 90In/10Ag. Importantly, they were pre-flux coated during the manufacturing process with 1232 LV2K (ROL0
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this operation. NOTE 1 The joint relies on reflowing of the solder applied during the degolding/pretinning operation only. NOTE 2 This is to prevent the flow of excess solder into the cavity in the connector body. q. After the solder
