Heating system (Heller 1812EXL ) 1. All the heating zones are controlled by PLC through PID 2. Heating separately according to different zones is workable to reduce starting power. 3. Turbo air system can improve air flow and provide high rising t
Electronics Forum | Thu Jul 15 22:03:07 EDT 2004 | KEN
In no particular order: Will the failed joints wet when touched with an iron + flux? Is there flux surrounding the joint (post reflow). If no, you may be baking it out premateurely. Is this assembly wave soldered? Where is defect discovered in yo
Electronics Forum | Wed Oct 30 02:37:58 EST 2002 | Dreamsniper
Hi Guys, I have a fine pitch QFP that I suspect of having a solderability (wetability) problem. The heel joint is 50%-75% of the lead thickness so it means that I passed the IPC Class 2 recommended criteria on the Heel. The toe has at least 25%-50% s
Industry News | 2011-03-09 14:01:30.0
In 2010, China's import and export volume of electronic and information products reached USD1.01 trillion in value. This figure reflects a growth of 29.3 percent, with exports accounting for USD591.2 billion, 37.5 percent of total national exports. These figures indicate how China has successfully managed the transition from a period of recovery to one of growth.
Industry News | 2015-06-08 16:41:53.0
The Chinese stock market has seen dramatic growth in 2015, with startups and the Shenzhen Composite Index rising to unbelievable heights. Behind the huge growth is a commitment by the national government to facilitating the sustained growth of industries such as internet+ and information technology.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
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