SMTnet Express, May 16, 2019, Subscribers: 31,918, Companies: 10,765, Users: 26,116 Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle Credits: Cisco Systems, Inc. As the demand for higher routing density and transfer speed
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APEX 2006, S31-03-01 to S31-03-10. [12] D. R. Banks, T. E. Burnette, Y. Cho, W. T. DeMarco, and A. J. Mawer, “Effect of Solder Joint Voiding on Plastic To be published in the Proceedings of SMTA International, September 17 - 21, 2016, Rosemont, IL. Ball
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”, IPC Midwest Conference Proceedings, Chicago IL, 2010. 177 BACKGROUND Study #1: Study #2: Study #3: Study #4: Study #5: R. Coyle, et al, “The Influence of Solder Void Location on BGA Thermal Fatigue Life”, SMTAI Conference Proceedings [9] Study #6
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